MediaTek Dimensity 700 vs Unisoc Tanggula T760 5G
The Unisoc Tanggula T760 5G and MediaTek Dimensity 700 are two processors with distinct specifications.
Starting with the Unisoc Tanggula T760 5G, it is equipped with a 6 nm lithography, making it more power-efficient compared to the MediaTek Dimensity 700 with a 7 nm lithography. The Tanggula T760 5G features 8 cores, consisting of 4 Cortex-A76 cores clocked at 2.2 GHz and 4 Cortex-A55 cores clocked at 1.8 GHz. This configuration allows for optimal balance between high-performance and energy efficiency. Additionally, it supports the ARMv8.2-A instruction set, providing compatibility for a wide range of applications. The Tanggula T760 5G also incorporates a Neural Processing Unit (NPU), enabling faster and more efficient artificial intelligence-based tasks.
On the other hand, the MediaTek Dimensity 700 also consists of 8 cores, with 2 Cortex-A76 cores clocked at 2.2 GHz and 6 Cortex-A55 cores clocked at 2 GHz. These cores are capable of delivering powerful performance, although the absence of a Neural Processing Unit may limit the device's AI capabilities compared to the Tanggula T760 5G. The Dimensity 700 features a 7 nm lithography and supports the ARMv8.2-A instruction set.
In terms of power consumption, the Tanggula T760 5G offers a lower thermal design power (TDP) of 5 Watts compared to the Dimensity 700's 10 Watt TDP. This means that devices equipped with the Tanggula T760 5G will likely have better power efficiency and longer battery life.
In summary, while both processors offer similar core configurations and instruction sets, the Tanggula T760 5G stands out with its more advanced 6 nm lithography for improved power efficiency. Additionally, the inclusion of a Neural Processing Unit enhances the Tanggula T760 5G's AI capabilities, potentially leading to better performance for AI-related tasks. However, the Dimensity 700 provides powerful processing capabilities and remains a strong option for users prioritizing performance over AI capabilities and power efficiency.
Starting with the Unisoc Tanggula T760 5G, it is equipped with a 6 nm lithography, making it more power-efficient compared to the MediaTek Dimensity 700 with a 7 nm lithography. The Tanggula T760 5G features 8 cores, consisting of 4 Cortex-A76 cores clocked at 2.2 GHz and 4 Cortex-A55 cores clocked at 1.8 GHz. This configuration allows for optimal balance between high-performance and energy efficiency. Additionally, it supports the ARMv8.2-A instruction set, providing compatibility for a wide range of applications. The Tanggula T760 5G also incorporates a Neural Processing Unit (NPU), enabling faster and more efficient artificial intelligence-based tasks.
On the other hand, the MediaTek Dimensity 700 also consists of 8 cores, with 2 Cortex-A76 cores clocked at 2.2 GHz and 6 Cortex-A55 cores clocked at 2 GHz. These cores are capable of delivering powerful performance, although the absence of a Neural Processing Unit may limit the device's AI capabilities compared to the Tanggula T760 5G. The Dimensity 700 features a 7 nm lithography and supports the ARMv8.2-A instruction set.
In terms of power consumption, the Tanggula T760 5G offers a lower thermal design power (TDP) of 5 Watts compared to the Dimensity 700's 10 Watt TDP. This means that devices equipped with the Tanggula T760 5G will likely have better power efficiency and longer battery life.
In summary, while both processors offer similar core configurations and instruction sets, the Tanggula T760 5G stands out with its more advanced 6 nm lithography for improved power efficiency. Additionally, the inclusion of a Neural Processing Unit enhances the Tanggula T760 5G's AI capabilities, potentially leading to better performance for AI-related tasks. However, the Dimensity 700 provides powerful processing capabilities and remains a strong option for users prioritizing performance over AI capabilities and power efficiency.
CPU cores and architecture
Architecture | 2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 |
4x 2.2 GHz – Cortex-A76 4x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 6 nm |
TDP | 10 Watt | 5 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 12 GB | up to 16 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 2x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.2 | UFS 3.1 |
Graphics
GPU name | Mali-G57 MP2 | Mali-G57 MP6 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 950 MHz | 850 MHz |
Execution units | 2 | 6 |
Shaders | 32 | 96 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@90Hz | 2160x1080 |
Max camera resolution | 1x 64MP, 2x 16MP | 1x 64MP, 2x 24MP |
Max Video Capture | 2K@30FPS | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 2.77 Gbps | 2.7 Gbps |
Peak Upload Speed | 1.2 Gbps | 1.5 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC QZSS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2021 Quarter 1 | 2021 February |
Partnumber | MT6833V/ZA, MT6833V/NZA | T760 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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