MediaTek Dimensity 700 vs Unisoc Tanggula T760 5G

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The Unisoc Tanggula T760 5G and MediaTek Dimensity 700 are two processors with distinct specifications.

Starting with the Unisoc Tanggula T760 5G, it is equipped with a 6 nm lithography, making it more power-efficient compared to the MediaTek Dimensity 700 with a 7 nm lithography. The Tanggula T760 5G features 8 cores, consisting of 4 Cortex-A76 cores clocked at 2.2 GHz and 4 Cortex-A55 cores clocked at 1.8 GHz. This configuration allows for optimal balance between high-performance and energy efficiency. Additionally, it supports the ARMv8.2-A instruction set, providing compatibility for a wide range of applications. The Tanggula T760 5G also incorporates a Neural Processing Unit (NPU), enabling faster and more efficient artificial intelligence-based tasks.

On the other hand, the MediaTek Dimensity 700 also consists of 8 cores, with 2 Cortex-A76 cores clocked at 2.2 GHz and 6 Cortex-A55 cores clocked at 2 GHz. These cores are capable of delivering powerful performance, although the absence of a Neural Processing Unit may limit the device's AI capabilities compared to the Tanggula T760 5G. The Dimensity 700 features a 7 nm lithography and supports the ARMv8.2-A instruction set.

In terms of power consumption, the Tanggula T760 5G offers a lower thermal design power (TDP) of 5 Watts compared to the Dimensity 700's 10 Watt TDP. This means that devices equipped with the Tanggula T760 5G will likely have better power efficiency and longer battery life.

In summary, while both processors offer similar core configurations and instruction sets, the Tanggula T760 5G stands out with its more advanced 6 nm lithography for improved power efficiency. Additionally, the inclusion of a Neural Processing Unit enhances the Tanggula T760 5G's AI capabilities, potentially leading to better performance for AI-related tasks. However, the Dimensity 700 provides powerful processing capabilities and remains a strong option for users prioritizing performance over AI capabilities and power efficiency.

CPU cores and architecture

Architecture 2x 2.2 GHz – Cortex-A76
6x 2 GHz – Cortex-A55
4x 2.2 GHz – Cortex-A76
4x 1.8 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 6 nm
TDP 10 Watt 5 Watt
Neural Processing NPU

Memory (RAM)

Max amount up to 12 GB up to 16 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 2133 MHz
Memory-bus 2x16 bit 4x16 bit

Storage

Storage specification UFS 2.2 UFS 3.1

Graphics

GPU name Mali-G57 MP2 Mali-G57 MP6
GPU Architecture Valhall Valhall
GPU frequency 950 MHz 850 MHz
Execution units 2 6
Shaders 32 96
DirectX 12 12
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 2520x1080@90Hz 2160x1080
Max camera resolution 1x 64MP, 2x 16MP 1x 64MP, 2x 24MP
Max Video Capture 2K@30FPS FullHD@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP9
H.264 (AVC)
H.265 (HEVC)

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 2.77 Gbps 2.7 Gbps
Peak Upload Speed 1.2 Gbps 1.5 Gbps
Wi-Fi 5 (802.11ac) 5 (802.11ac)
Bluetooth 5.1 5.0
Satellite navigation BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2021 Quarter 1 2021 February
Partnumber MT6833V/ZA, MT6833V/NZA T760
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Dimensity 700
325860
Tanggula T760 5G
243570

GeekBench 6 Single-Core

Score
Dimensity 700
531
Tanggula T760 5G
559

GeekBench 6 Multi-Core

Score
Dimensity 700
1719
Tanggula T760 5G
2249