Unisoc Tanggula T760 5G
The Tanggula T760 5G is one of Unisoc mid-end CPU. It has 8 cores and was announced in 2021 February. It has "top.big.LITTLE" cores-set: 4x Cortex-A76 (2.2 GHz), 4x Cortex-A55 (1.8 GHz). The processor is manufactured using a 6 nm process technology and supports UFS 3.1, 4G, 5G, LPDDR4X.

AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A76 4x 1.8 GHz – Cortex-A55 |
Number of cores | 8 |
Instruction Set | ARMv8.2-A |
Lithography | 6 nm |
TDP | 5 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 16 GB |
Memory type | LPDDR4X |
Memory frequency | 2133 MHz |
Memory-bus | 4x16 bit |
Storage
Storage specification | UFS 3.1 |
Graphics
GPU name | Mali-G57 MP6 |
GPU Architecture | Mali Valhall |
GPU frequency | 850 MHz |
Execution units | 6 |
Shaders | 96 |
DirectX | 12 |
OpenCL API | 2.1 |
OpenGL API | ES 3.2 |
Vulkan API | 1.2 |
Camera, Video, Display
Max screen resolution | 2160x1080 |
Max camera resolution | 1x 64MP, 2x 24MP |
Max Video Capture | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes |
5G network | Yes |
Peak Download Speed | 2.7 Gbps |
Peak Upload Speed | 1.5 Gbps |
Wi-Fi | 5 (802.11ac) |
Bluetooth | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2021 February |
Partnumber | T760 |
Vertical Segment | Mobiles |
Positioning | Mid-end |
Popular comparisons:
1
MediaTek Dimensity 9400 Plus vs Samsung Exynos 1580
2
Samsung Exynos 850 vs Qualcomm Snapdragon 632
3
MediaTek Dimensity 9200 vs HiSilicon Kirin 710F
4
Qualcomm Snapdragon 750G vs MediaTek Helio G88
5
MediaTek Helio P65 vs Qualcomm Snapdragon 4s Gen 2
6
Qualcomm Snapdragon 450 vs Qualcomm Snapdragon 678
7
MediaTek Dimensity 1000 vs Qualcomm Snapdragon 7 Plus Gen 2
8
Qualcomm Snapdragon 636 vs MediaTek Helio P90
9
MediaTek Dimensity 7400 vs Qualcomm Snapdragon 7s Gen 3
10
Unisoc T8300 vs Samsung Exynos 1380