HiSilicon Kirin 950 vs MediaTek Dimensity 720

VS
The HiSilicon Kirin 950 and MediaTek Dimensity 720 are two processors that possess distinct specifications, making them suitable for different purposes and user preferences.

In terms of CPU cores and architecture, the Kirin 950 features an architecture of 4x 2.4 GHz - Cortex-A72 and 4x 1.8 GHz - Cortex-A53. This combination of cores allows for efficient multitasking and processing power. On the other hand, the Dimensity 720 boasts an architecture of 2x 2.2 GHz - Cortex-A76 and 6x 2 GHz - Cortex-A55. This architecture provides a balance between performance and power consumption.

When it comes to the number of cores, both processors have 8 cores, ensuring seamless performance and the ability to handle demanding tasks. Additionally, they both utilize the ARMv8 instruction set, which offers compatibility with a wide range of applications.

In terms of lithography, the Kirin 950 has a 16 nm lithography, while the Dimensity 720 boasts a more advanced 7 nm lithography. A smaller lithography allows for better power efficiency and potentially enhanced performance.

Another noteworthy difference is the TDP (Thermal Design Power), which determines the maximum amount of power needed to dissipate heat generated by the processor. The Kirin 950 has a TDP of 5 watts, indicating a lower power consumption compared to the Dimensity 720's 10-watt TDP.

Furthermore, the Dimensity 720 sets itself apart with its Neural Processing Unit (NPU). This dedicated unit enhances AI processing capabilities, allowing for improved performance in AI-related tasks.

Ultimately, the choice between these two processors depends on the specific requirements of the user. The Kirin 950 might be more suitable for those seeking better power efficiency, while the Dimensity 720 could be a viable option for individuals interested in AI processing capabilities and advanced lithography.

CPU cores and architecture

Architecture 4x 2.4 GHz – Cortex-A72
4x 1.8 GHz – Cortex-A53
2x 2.2 GHz – Cortex-A76
6x 2 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 16 nm 7 nm
Number of transistors 2000 million
TDP 5 Watt 10 Watt
Neural Processing NPU

Memory (RAM)

Max amount up to 4 GB up to 12 GB
Memory type LPDDR4 LPDDR4X
Memory frequency 1333 MHz 2133 MHz
Memory-bus 2x32 bit 2x16 bit

Storage

Storage specification UFS 2.0 UFS 2.2

Graphics

GPU name Mali-T880 MP4 Mali-G57 MP3
GPU Architecture Midgard Valhall
GPU frequency 900 MHz 850 MHz
Execution units 4 3
Shaders 64
DirectX 11.2 12
OpenCL API 1.2 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2520x1080@90Hz
Max camera resolution 1x 31MP, 2x 13MP 1x 64MP, 1x 20MP + 1x 16MP
Max Video Capture FullHD@60fps 4K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.3 Gbps 2.77 Gbps
Peak Upload Speed 0.05 Gbps 1.2 Gbps
Wi-Fi 5 (802.11ac) 5 (802.11ac)
Bluetooth 4.2 5.1
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2015 November 2020 Quarter 3
Partnumber Hi3650 MT6853V/ZA, MT6853V/NZA
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 950
135741
Dimensity 720
293337

GeekBench 6 Single-Core

Score
Kirin 950
341
Dimensity 720
540

GeekBench 6 Multi-Core

Score
Kirin 950
1294
Dimensity 720
1698