HiSilicon Kirin 950 vs MediaTek Dimensity 720
The HiSilicon Kirin 950 and MediaTek Dimensity 720 are two processors that possess distinct specifications, making them suitable for different purposes and user preferences.
In terms of CPU cores and architecture, the Kirin 950 features an architecture of 4x 2.4 GHz - Cortex-A72 and 4x 1.8 GHz - Cortex-A53. This combination of cores allows for efficient multitasking and processing power. On the other hand, the Dimensity 720 boasts an architecture of 2x 2.2 GHz - Cortex-A76 and 6x 2 GHz - Cortex-A55. This architecture provides a balance between performance and power consumption.
When it comes to the number of cores, both processors have 8 cores, ensuring seamless performance and the ability to handle demanding tasks. Additionally, they both utilize the ARMv8 instruction set, which offers compatibility with a wide range of applications.
In terms of lithography, the Kirin 950 has a 16 nm lithography, while the Dimensity 720 boasts a more advanced 7 nm lithography. A smaller lithography allows for better power efficiency and potentially enhanced performance.
Another noteworthy difference is the TDP (Thermal Design Power), which determines the maximum amount of power needed to dissipate heat generated by the processor. The Kirin 950 has a TDP of 5 watts, indicating a lower power consumption compared to the Dimensity 720's 10-watt TDP.
Furthermore, the Dimensity 720 sets itself apart with its Neural Processing Unit (NPU). This dedicated unit enhances AI processing capabilities, allowing for improved performance in AI-related tasks.
Ultimately, the choice between these two processors depends on the specific requirements of the user. The Kirin 950 might be more suitable for those seeking better power efficiency, while the Dimensity 720 could be a viable option for individuals interested in AI processing capabilities and advanced lithography.
In terms of CPU cores and architecture, the Kirin 950 features an architecture of 4x 2.4 GHz - Cortex-A72 and 4x 1.8 GHz - Cortex-A53. This combination of cores allows for efficient multitasking and processing power. On the other hand, the Dimensity 720 boasts an architecture of 2x 2.2 GHz - Cortex-A76 and 6x 2 GHz - Cortex-A55. This architecture provides a balance between performance and power consumption.
When it comes to the number of cores, both processors have 8 cores, ensuring seamless performance and the ability to handle demanding tasks. Additionally, they both utilize the ARMv8 instruction set, which offers compatibility with a wide range of applications.
In terms of lithography, the Kirin 950 has a 16 nm lithography, while the Dimensity 720 boasts a more advanced 7 nm lithography. A smaller lithography allows for better power efficiency and potentially enhanced performance.
Another noteworthy difference is the TDP (Thermal Design Power), which determines the maximum amount of power needed to dissipate heat generated by the processor. The Kirin 950 has a TDP of 5 watts, indicating a lower power consumption compared to the Dimensity 720's 10-watt TDP.
Furthermore, the Dimensity 720 sets itself apart with its Neural Processing Unit (NPU). This dedicated unit enhances AI processing capabilities, allowing for improved performance in AI-related tasks.
Ultimately, the choice between these two processors depends on the specific requirements of the user. The Kirin 950 might be more suitable for those seeking better power efficiency, while the Dimensity 720 could be a viable option for individuals interested in AI processing capabilities and advanced lithography.
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A72 4x 1.8 GHz – Cortex-A53 |
2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 16 nm | 7 nm |
Number of transistors | 2000 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 4 GB | up to 12 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1333 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 2.2 |
Graphics
GPU name | Mali-T880 MP4 | Mali-G57 MP3 |
GPU Architecture | Midgard | Valhall |
GPU frequency | 900 MHz | 850 MHz |
Execution units | 4 | 3 |
Shaders | 64 | |
DirectX | 11.2 | 12 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@90Hz | |
Max camera resolution | 1x 31MP, 2x 13MP | 1x 64MP, 1x 20MP + 1x 16MP |
Max Video Capture | FullHD@60fps | 4K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.05 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2015 November | 2020 Quarter 3 |
Partnumber | Hi3650 | MT6853V/ZA, MT6853V/NZA |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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