HiSilicon Kirin 985 5G vs Unisoc Tanggula T760 5G

VS
When comparing the HiSilicon Kirin 985 5G and the Unisoc Tanggula T760 5G processors, several key specifications should be taken into consideration.

In terms of CPU cores and architecture, the HiSilicon Kirin 985 5G boasts a more diverse setup. It includes 1x 2.58 GHz Cortex-A76 core, 3x 2.4 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. On the other hand, the Unisoc Tanggula T760 5G features 4x 2.2 GHz Cortex-A76 cores and 4x 1.8 GHz Cortex-A55 cores.

Both processors have 8 cores in total, but the Kirin 985 5G has a higher clock speed on its highest-performing Cortex-A76 core. This could potentially result in better performance under heavy workloads for the Kirin processor.

In terms of instruction sets, both processors support ARMv8.2-A, ensuring compatibility with the latest software and optimizations.

There is a slight difference in lithography between the two processors. The Kirin 985 5G utilizes a 7 nm process, while the Tanggula T760 5G employs a 6 nm process. A smaller lithography generally translates to better power efficiency and potentially improved performance.

In terms of power consumption, the Tanggula T760 5G has a lower thermal design power (TDP) of 5 watts compared to the 6 watts of the Kirin 985 5G. A lower TDP indicates that the Unisoc processor may consume less power and generate less heat.

Lastly, when comparing neural processing capabilities, the Kirin 985 5G utilizes the Ascend D110 Lite and Ascend D100 Tiny technologies based on the HUAWEI Da Vinci Architecture. The Tanggula T760 5G, on the other hand, features its own Neural Processing Unit (NPU). The specific features and performance of these NPUs would need to be compared separately to assess their effectiveness.

In conclusion, the HiSilicon Kirin 985 5G processor excels in terms of its CPU core diversity and potentially higher performance under heavy workloads. The Unisoc Tanggula T760 5G, on the other hand, offers a slightly smaller lithography and a lower TDP, indicating better power efficiency. The specific neural processing capabilities of each processor would require further investigation to determine their respective advantages.

CPU cores and architecture

Architecture 1x 2.58 GHz – Cortex-A76
3x 2.4 GHz – Cortex-A76
4x 1.84 GHz – Cortex-A55
4x 2.2 GHz – Cortex-A76
4x 1.8 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 6 nm
TDP 6 Watt 5 Watt
Neural Processing Ascend D110 Lite + Ascend D100 Tiny, HUAWEI Da Vinci Architecture NPU

Memory (RAM)

Max amount up to 12 GB up to 16 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 2133 MHz
Memory-bus 4x16 bit 4x16 bit

Storage

Storage specification UFS 3.0 UFS 3.1

Graphics

GPU name Mali-G77 MP8 Mali-G57 MP6
GPU Architecture Valhall Valhall
GPU frequency 700 MHz 850 MHz
Execution units 8 6
Shaders 128 96
DirectX 12 12
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 3120x1440 2160x1080
Max camera resolution 1x 48MP, 2x 20MP 1x 64MP, 2x 24MP
Max Video Capture 4K@30fp FullHD@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.4 Gbps 2.7 Gbps
Peak Upload Speed 0.2 Gbps 1.5 Gbps
Wi-Fi 5 (802.11ac) 5 (802.11ac)
Bluetooth 5.0 5.0
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2020 Quarter 2 2021 February
Partnumber Hi6290 T760
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 985 5G
467882
Tanggula T760 5G
243570

GeekBench 6 Single-Core

Score
Kirin 985 5G
699
Tanggula T760 5G
559

GeekBench 6 Multi-Core

Score
Kirin 985 5G
2593
Tanggula T760 5G
2249