HiSilicon Kirin 970 vs MediaTek Dimensity 820

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The HiSilicon Kirin 970 and MediaTek Dimensity 820 are both powerful processors used in smartphones. Let's compare their specifications to see how they differ.

Starting with the HiSilicon Kirin 970, this processor features a CPU architecture consisting of 4 Cortex-A73 cores clocked at 2.4 GHz and 4 Cortex-A53 cores clocked at 1.8 GHz. With a total of 8 cores, it offers a versatile and efficient performance. The Kirin 970 utilizes the ARMv8-A instruction set and operates on a 10nm lithography. It is equipped with 5500 million transistors, indicating a high level of integration. The thermal design power (TDP) of this processor is 9 Watts, ensuring a balance between performance and power efficiency. Additionally, it features the HiSilicon NPU for enhanced neural processing capabilities.

On the other hand, the MediaTek Dimensity 820 presents a different set of specifications. It also incorporates an 8-core CPU architecture, with 4 Cortex-A76 cores running at 2.6 GHz and 4 Cortex-A55 cores operating at 2.0 GHz. This configuration combines high performance with power efficiency. The Dimensity 820 utilizes the ARMv8.2-A instruction set and boasts a 7nm lithography, indicating superior power efficiency and potentially better thermal characteristics. It has a TDP of 10 Watts, slightly higher than the Kirin 970, but still within a reasonable range. The Dimensity 820 is equipped with an NPU for efficient neural processing.

In summary, while both processors offer impressive specifications, there are some noteworthy differences. The Kirin 970 operates on a 10nm lithography, has a TDP of 9 Watts, and features the HiSilicon NPU. On the other hand, the Dimensity 820 operates on a more advanced 7nm lithography, has a TDP of 10 Watts, and includes an NPU as well. Both processors offer 8 cores, providing a good balance between performance and power efficiency. Ultimately, the choice between them may depend on specific needs and preferences, such as thermal characteristics, power efficiency, or specific neural processing requirements.

CPU cores and architecture

Architecture 4x 2.4 GHz – Cortex-A73
4x 1.8 GHz – Cortex-A53
4x 2.6 GHz – Cortex-A76
4x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 10 nm 7 nm
Number of transistors 5500 million
TDP 9 Watt 10 Watt
Neural Processing HiSilicon NPU NPU

Memory (RAM)

Max amount up to 8 GB up to 16 GB
Memory type LPDDR4 LPDDR4X
Memory frequency 1866 MHz 2133 MHz
Memory-bus 4x16 bit 2x16 bit

Storage

Storage specification UFS 2.1 UFS 2.2

Graphics

GPU name Mali-G72 MP12 Mali-G57 MP5
GPU Architecture Bifrost Valhall
GPU frequency 750 MHz 650 MHz
Execution units 12 5
Shaders 192 80
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 20MP 1x 80MP, 1x 32MP + 1x 16MP
Max Video Capture 4K@30fps 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.2 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 5 (802.11ac) 5 (802.11ac)
Bluetooth 4.2 5.1
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS
QZSS

Supplemental Information

Launch Date 2017 September 2020 May
Partnumber Hi3670 MT6875
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 970
318577
Dimensity 820
403227

GeekBench 6 Single-Core

Score
Kirin 970
389
Dimensity 820
615

GeekBench 6 Multi-Core

Score
Kirin 970
1502
Dimensity 820
1924