HiSilicon Kirin 970 vs MediaTek Dimensity 820
The HiSilicon Kirin 970 and MediaTek Dimensity 820 are both powerful processors used in smartphones. Let's compare their specifications to see how they differ.
Starting with the HiSilicon Kirin 970, this processor features a CPU architecture consisting of 4 Cortex-A73 cores clocked at 2.4 GHz and 4 Cortex-A53 cores clocked at 1.8 GHz. With a total of 8 cores, it offers a versatile and efficient performance. The Kirin 970 utilizes the ARMv8-A instruction set and operates on a 10nm lithography. It is equipped with 5500 million transistors, indicating a high level of integration. The thermal design power (TDP) of this processor is 9 Watts, ensuring a balance between performance and power efficiency. Additionally, it features the HiSilicon NPU for enhanced neural processing capabilities.
On the other hand, the MediaTek Dimensity 820 presents a different set of specifications. It also incorporates an 8-core CPU architecture, with 4 Cortex-A76 cores running at 2.6 GHz and 4 Cortex-A55 cores operating at 2.0 GHz. This configuration combines high performance with power efficiency. The Dimensity 820 utilizes the ARMv8.2-A instruction set and boasts a 7nm lithography, indicating superior power efficiency and potentially better thermal characteristics. It has a TDP of 10 Watts, slightly higher than the Kirin 970, but still within a reasonable range. The Dimensity 820 is equipped with an NPU for efficient neural processing.
In summary, while both processors offer impressive specifications, there are some noteworthy differences. The Kirin 970 operates on a 10nm lithography, has a TDP of 9 Watts, and features the HiSilicon NPU. On the other hand, the Dimensity 820 operates on a more advanced 7nm lithography, has a TDP of 10 Watts, and includes an NPU as well. Both processors offer 8 cores, providing a good balance between performance and power efficiency. Ultimately, the choice between them may depend on specific needs and preferences, such as thermal characteristics, power efficiency, or specific neural processing requirements.
Starting with the HiSilicon Kirin 970, this processor features a CPU architecture consisting of 4 Cortex-A73 cores clocked at 2.4 GHz and 4 Cortex-A53 cores clocked at 1.8 GHz. With a total of 8 cores, it offers a versatile and efficient performance. The Kirin 970 utilizes the ARMv8-A instruction set and operates on a 10nm lithography. It is equipped with 5500 million transistors, indicating a high level of integration. The thermal design power (TDP) of this processor is 9 Watts, ensuring a balance between performance and power efficiency. Additionally, it features the HiSilicon NPU for enhanced neural processing capabilities.
On the other hand, the MediaTek Dimensity 820 presents a different set of specifications. It also incorporates an 8-core CPU architecture, with 4 Cortex-A76 cores running at 2.6 GHz and 4 Cortex-A55 cores operating at 2.0 GHz. This configuration combines high performance with power efficiency. The Dimensity 820 utilizes the ARMv8.2-A instruction set and boasts a 7nm lithography, indicating superior power efficiency and potentially better thermal characteristics. It has a TDP of 10 Watts, slightly higher than the Kirin 970, but still within a reasonable range. The Dimensity 820 is equipped with an NPU for efficient neural processing.
In summary, while both processors offer impressive specifications, there are some noteworthy differences. The Kirin 970 operates on a 10nm lithography, has a TDP of 9 Watts, and features the HiSilicon NPU. On the other hand, the Dimensity 820 operates on a more advanced 7nm lithography, has a TDP of 10 Watts, and includes an NPU as well. Both processors offer 8 cores, providing a good balance between performance and power efficiency. Ultimately, the choice between them may depend on specific needs and preferences, such as thermal characteristics, power efficiency, or specific neural processing requirements.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
| Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
4x 2.6 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
| Number of cores | 8 | 8 |
| Instruction Set | ARMv8-A | ARMv8.2-A |
| Lithography | 10 nm | 7 nm |
| Number of transistors | 5500 million | |
| TDP | 9 Watt | 10 Watt |
| Neural Processing | HiSilicon NPU | NPU |
Memory (RAM)
| Max amount | up to 8 GB | up to 16 GB |
| Memory type | LPDDR4 | LPDDR4X |
| Memory frequency | 1866 MHz | 2133 MHz |
| Memory-bus | 4x16 bit | 2x16 bit |
Storage
| Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
| GPU name | Mali-G72 MP12 | Mali-G57 MP5 |
| GPU Architecture | Mali Bifrost | Mali Valhall |
| GPU frequency | 750 MHz | 650 MHz |
| Execution units | 12 | 5 |
| Shaders | 192 | 80 |
| DirectX | 12 | 12 |
| OpenCL API | 2.0 | 2.1 |
| OpenGL API | ES 3.2 | |
| Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
| Max screen resolution | 2340x1080 | 2520x1080@120Hz |
| Max camera resolution | 1x 48MP, 2x 20MP | 1x 80MP, 1x 32MP + 1x 16MP |
| Max Video Capture | 4K@30fps | 4K@30fps |
| Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
| 4G network | Yes | Yes |
| 5G network | Yes | Yes |
| Peak Download Speed | 1.2 Gbps | 2.77 Gbps |
| Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
| Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
| Bluetooth | 4.2 | 5.1 |
| Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
| Launch Date | 2017 September | 2020 May |
| Partnumber | Hi3670 | MT6875 |
| Vertical Segment | Mobiles | Mobiles |
| Positioning | Flagship | Mid-end |
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