HiSilicon Kirin 970
The HiSilicon Kirin 970 is a {total_cores} CPU It has 8 cores and was announced in 2017 September. It has "big.LITTLE" cores-set: 4x Cortex-A73 (2.4 GHz), 4x Cortex-A53 (1.8 GHz). The processor is manufactured using a 10 nm process technology and supports UFS 2.1, 4G, LPDDR4.

AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
Number of cores | 8 |
Instruction Set | ARMv8-A |
Lithography | 10 nm |
Number of transistors | 5500 million |
TDP | 9 Watt |
Neural Processing | HiSilicon NPU |
Memory (RAM)
Max amount | up to 8 GB |
Memory type | LPDDR4 |
Memory frequency | 1866 MHz |
Memory-bus | 4x16 bit |
Storage
Storage specification | UFS 2.1 |
Graphics
GPU name | Mali-G72 MP12 |
GPU Architecture | Mali Bifrost |
GPU frequency | 750 MHz |
Execution units | 12 |
Shaders | 192 |
DirectX | 12 |
OpenCL API | 2.0 |
Vulkan API | 1.0 |
Camera, Video, Display
Max screen resolution | 2340x1080 |
Max camera resolution | 1x 48MP, 2x 20MP |
Max Video Capture | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes |
5G network | Yes |
Peak Download Speed | 1.2 Gbps |
Peak Upload Speed | 0.15 Gbps |
Wi-Fi | 5 (802.11ac) |
Bluetooth | 4.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2017 September |
Partnumber | Hi3670 |
Vertical Segment | Mobiles |
Positioning | Flagship |
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