HiSilicon Kirin 970 vs Unisoc Tiger T606
The HiSilicon Kirin 970 and the Unisoc Tiger T606 are two processors with different specifications and features. Let's compare them based on their specifications.
Starting with the HiSilicon Kirin 970, this processor has a total of 8 cores divided into 4x 2.4 GHz – Cortex-A73 and 4x 1.8 GHz – Cortex-A53. The CPU architecture is based on ARMv8-A instruction set, and it is built on a 10 nm lithography process. It consists of 5500 million transistors and has a TDP (Thermal Design Power) of 9 Watts. One notable feature of the Kirin 970 is the inclusion of the HiSilicon NPU (Neural Processing Unit), which enhances its capabilities for tasks like AI and machine learning.
On the other hand, the Unisoc Tiger T606 has a similar number of cores, with a total of 8 cores. Its architecture consists of 2x 1.6 GHz – Cortex-A75 and 6x 1.6 GHz – Cortex-A55 cores. The instruction set supported by the Tiger T606 is ARMv8.2-A, and it is built on a 12 nm lithography process. The TDP of this processor is slightly higher, rated at 10 Watts.
In summary, the HiSilicon Kirin 970 and Unisoc Tiger T606 share some similarities, such as having 8 cores. However, they differ in their CPU architecture, clock speeds, lithography, and TDP. The Kirin 970's Cortex-A73 and A53 cores offer different speeds, while the Tiger T606 features Cortex-A75 and A55 cores. While the Kirin 970 includes an NPU, the Tiger T606 doesn't have a specified neural processing unit.
Choosing between these processors would depend on the specific requirements and priorities of the user. The Kirin 970 may offer advantages in tasks involving AI and machine learning, while the Tiger T606 might have its strengths in other areas.
Starting with the HiSilicon Kirin 970, this processor has a total of 8 cores divided into 4x 2.4 GHz – Cortex-A73 and 4x 1.8 GHz – Cortex-A53. The CPU architecture is based on ARMv8-A instruction set, and it is built on a 10 nm lithography process. It consists of 5500 million transistors and has a TDP (Thermal Design Power) of 9 Watts. One notable feature of the Kirin 970 is the inclusion of the HiSilicon NPU (Neural Processing Unit), which enhances its capabilities for tasks like AI and machine learning.
On the other hand, the Unisoc Tiger T606 has a similar number of cores, with a total of 8 cores. Its architecture consists of 2x 1.6 GHz – Cortex-A75 and 6x 1.6 GHz – Cortex-A55 cores. The instruction set supported by the Tiger T606 is ARMv8.2-A, and it is built on a 12 nm lithography process. The TDP of this processor is slightly higher, rated at 10 Watts.
In summary, the HiSilicon Kirin 970 and Unisoc Tiger T606 share some similarities, such as having 8 cores. However, they differ in their CPU architecture, clock speeds, lithography, and TDP. The Kirin 970's Cortex-A73 and A53 cores offer different speeds, while the Tiger T606 features Cortex-A75 and A55 cores. While the Kirin 970 includes an NPU, the Tiger T606 doesn't have a specified neural processing unit.
Choosing between these processors would depend on the specific requirements and priorities of the user. The Kirin 970 may offer advantages in tasks involving AI and machine learning, while the Tiger T606 might have its strengths in other areas.
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
2x 1.6 GHz – Cortex-A75 6x 1.6 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 10 nm | 12 nm |
Number of transistors | 5500 million | |
TDP | 9 Watt | 10 Watt |
Neural Processing | HiSilicon NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 8 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 1600 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G72 MP12 | Mali-G57 MP1 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 750 MHz | 650 MHz |
Execution units | 12 | 1 |
Shaders | 192 | 16 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 1600x900@90Hz |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 24MP, 16MP + 8MP |
Max Video Capture | 4K@30fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.2 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2017 September | 2021 October |
Partnumber | Hi3670 | T606 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Low-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Qualcomm Snapdragon 710 vs Google Tensor G2
2
HiSilicon Kirin 960 vs Apple A10X Fusion
3
MediaTek Dimensity 6100 Plus vs Qualcomm Snapdragon 7 Plus Gen 2
4
MediaTek Helio G90 vs MediaTek Helio P90
5
Google Tensor G1 vs MediaTek Dimensity 9200 Plus
6
MediaTek Helio G70 vs Samsung Exynos 7870
7
Samsung Exynos 7904 vs Qualcomm Snapdragon 888
8
HiSilicon Kirin 980 vs HiSilicon Kirin 710F
9
Unisoc Tiger T310 vs HiSilicon Kirin 955
10
MediaTek Dimensity 930 vs MediaTek Helio P70