HiSilicon Kirin 970 vs MediaTek Dimensity 810

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The HiSilicon Kirin 970 and the MediaTek Dimensity 810 are two processors with impressive specifications and capabilities.

In terms of CPU cores and architecture, the Kirin 970 features 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores, while the Dimensity 810 boasts 2x 2.4 GHz Cortex-A76 cores and 6x 2.0 GHz Cortex-A55 cores. Both processors have 8 cores, offering a balance between efficiency and performance for various tasks.

The instruction set for the Kirin 970 is ARMv8-A, while the Dimensity 810 uses the ARMv8.2-A instruction set. This means that the Dimensity 810 is more advanced and may offer better compatibility with modern software and applications.

When it comes to lithography, the Kirin 970 adopts a 10 nm process, while the Dimensity 810 utilizes a 6 nm process. A smaller lithography generally indicates a more power-efficient and compact processor.

The number of transistors also differs between the two processors. The Kirin 970 has 5500 million transistors, while the Dimensity 810 boasts a higher count of 12000 million transistors. This indicates that the Dimensity 810 can potentially handle more complex calculations and tasks due to its increased transistor count.

In terms of thermal design power (TDP), the Dimensity 810 is slightly more power-efficient than the Kirin 970 with a TDP of 8 Watts, compared to the 9 Watts of the Kirin 970. Lower TDP means less power consumption and potentially longer battery life for devices utilizing the Dimensity 810.

Both processors also feature neural processing units (NPU), which enhance artificial intelligence capabilities. The Kirin 970 has a HiSilicon NPU, while the Dimensity 810 simply mentions "NPU" without specifying the manufacturer. This suggests that the Kirin 970 may offer more optimized and efficient AI performance.

Overall, while both processors offer great performance and capabilities, the Dimensity 810 stands out with its more advanced lithography, higher transistor count, and slightly lower TDP. However, the Kirin 970 retains its relevance with its optimized NPU and efficient power consumption.

CPU cores and architecture

Architecture 4x 2.4 GHz – Cortex-A73
4x 1.8 GHz – Cortex-A53
2x 2.4 GHz – Cortex-A76
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 10 nm 6 nm
Number of transistors 5500 million 12000 million
TDP 9 Watt 8 Watt
Neural Processing HiSilicon NPU NPU

Memory (RAM)

Max amount up to 8 GB up to 12 GB
Memory type LPDDR4 LPDDR4X
Memory frequency 1866 MHz 2133 MHz
Memory-bus 4x16 bit 2x16 bit

Storage

Storage specification UFS 2.1 UFS 2.2

Graphics

GPU name Mali-G72 MP12 Mali-G57 MP2
GPU Architecture Bifrost Valhall
GPU frequency 750 MHz 950 MHz
Execution units 12 2
Shaders 192 32
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 20MP 1x 64MP, 2x 16MP
Max Video Capture 4K@30fps 2K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.2 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 5 (802.11ac) 5 (802.11ac)
Bluetooth 4.2 5.1
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS
QZSS

Supplemental Information

Launch Date 2017 September 2021 Quarter 3
Partnumber Hi3670 MT6833V/PNZA, MT6833P
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 970
318577
Dimensity 810
356915

GeekBench 6 Single-Core

Score
Kirin 970
389
Dimensity 810
584

GeekBench 6 Multi-Core

Score
Kirin 970
1502
Dimensity 810
1662