HiSilicon Kirin 820 5G vs Unisoc SC7731E
The HiSilicon Kirin 820 5G and the Unisoc SC7731E are two processors with different specifications and capabilities.
Starting with the HiSilicon Kirin 820 5G, it boasts a more advanced architecture compared to the Unisoc SC7731E. It is equipped with 1x 2.36 GHz - Cortex-A76, 3x 2.22 GHz - Cortex-A76, and 4x 1.84 GHz - Cortex-A55 cores. This provides a total of 8 cores, offering high performance and efficiency for various tasks.
In terms of the instruction set, the HiSilicon Kirin 820 5G operates on ARMv8.2-A, which is a more recent and advanced version. This allows for enhanced software compatibility and optimization.
Another noteworthy feature of the HiSilicon Kirin 820 5G is its advanced lithography of 7 nm. This ensures a smaller transistor size and more power efficiency, resulting in better overall performance and reduced power consumption. With a TDP of 6 Watts, it consumes relatively less power while delivering strong processing capabilities.
Furthermore, the HiSilicon Kirin 820 5G incorporates neural processing capabilities through its Ascend D110 Lite and HUAWEI Da Vinci Architecture. This enables dedicated AI processing, enhancing tasks that require artificial intelligence algorithms.
On the other hand, the Unisoc SC7731E has a simpler architecture. It consists of 4x 1.3 GHz - Cortex-A7 cores, providing a total of 4 cores. While it may not match the HiSilicon Kirin 820 5G in terms of performance, it can still handle everyday tasks with reasonable efficiency.
In terms of the instruction set, the Unisoc SC7731E operates on ARMv7-A, which is an older version compared to the HiSilicon Kirin 820 5G. This may limit its compatibility with certain software and optimizations.
Additionally, the Unisoc SC7731E has a lithography of 28 nm, which is larger compared to the HiSilicon Kirin 820 5G. This may result in higher power consumption and reduced efficiency. With a TDP of 7 Watts, it consumes slightly more power compared to the HiSilicon Kirin 820 5G.
Overall, the HiSilicon Kirin 820 5G offers a more advanced and powerful processing experience compared to the Unisoc SC7731E. Its multi-core design, advanced architecture, smaller lithography, and dedicated neural processing capabilities make it a superior choice for demanding tasks and applications.
Starting with the HiSilicon Kirin 820 5G, it boasts a more advanced architecture compared to the Unisoc SC7731E. It is equipped with 1x 2.36 GHz - Cortex-A76, 3x 2.22 GHz - Cortex-A76, and 4x 1.84 GHz - Cortex-A55 cores. This provides a total of 8 cores, offering high performance and efficiency for various tasks.
In terms of the instruction set, the HiSilicon Kirin 820 5G operates on ARMv8.2-A, which is a more recent and advanced version. This allows for enhanced software compatibility and optimization.
Another noteworthy feature of the HiSilicon Kirin 820 5G is its advanced lithography of 7 nm. This ensures a smaller transistor size and more power efficiency, resulting in better overall performance and reduced power consumption. With a TDP of 6 Watts, it consumes relatively less power while delivering strong processing capabilities.
Furthermore, the HiSilicon Kirin 820 5G incorporates neural processing capabilities through its Ascend D110 Lite and HUAWEI Da Vinci Architecture. This enables dedicated AI processing, enhancing tasks that require artificial intelligence algorithms.
On the other hand, the Unisoc SC7731E has a simpler architecture. It consists of 4x 1.3 GHz - Cortex-A7 cores, providing a total of 4 cores. While it may not match the HiSilicon Kirin 820 5G in terms of performance, it can still handle everyday tasks with reasonable efficiency.
In terms of the instruction set, the Unisoc SC7731E operates on ARMv7-A, which is an older version compared to the HiSilicon Kirin 820 5G. This may limit its compatibility with certain software and optimizations.
Additionally, the Unisoc SC7731E has a lithography of 28 nm, which is larger compared to the HiSilicon Kirin 820 5G. This may result in higher power consumption and reduced efficiency. With a TDP of 7 Watts, it consumes slightly more power compared to the HiSilicon Kirin 820 5G.
Overall, the HiSilicon Kirin 820 5G offers a more advanced and powerful processing experience compared to the Unisoc SC7731E. Its multi-core design, advanced architecture, smaller lithography, and dedicated neural processing capabilities make it a superior choice for demanding tasks and applications.
CPU cores and architecture
Architecture | 1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
4x 1.3 GHz – Cortex-A7 |
Number of cores | 8 | 4 |
Instruction Set | ARMv8.2-A | ARMv7-A |
Lithography | 7 nm | 28 nm |
TDP | 6 Watt | 7 Watt |
Neural Processing | Ascend D110 Lite, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 12 GB | up to 1 GB |
Memory type | LPDDR4X | LPDDR3 |
Memory frequency | 2133 MHz | 533 MHz |
Memory-bus | 4x16 bit |
Storage
Storage specification | UFS 2.1 | eMMC 5.1 |
Graphics
GPU name | Mali-G57 MP6 | Mali-T820 MP1 |
GPU Architecture | Valhall | Midgard |
GPU frequency | 850 MHz | 600 MHz |
Execution units | 6 | 1 |
Shaders | 96 | 4 |
DirectX | 12 | 11 |
OpenCL API | 2.1 | 1.2 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.0 |
Camera, Video, Display
Max screen resolution | 1440x720 | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 8MP |
Max Video Capture | 4K@30fps | HD@30fps |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.6 Gbps | |
Peak Upload Speed | 0.2 Gbps | |
Wi-Fi | 6 (802.11ax) | 4 (802.11n) |
Bluetooth | 5.1 | 4.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS GLONASS |
Supplemental Information
Launch Date | 2020 March | 2018 Quarter 2 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Low-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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