HiSilicon Kirin 820 5G
cpu_s1 It has 8 cores and was announced in 2020 March. It has "top.big.LITTLE" cores-set: 1x Cortex-A76, 3x Cortex-A76 (2.22 GHz), 4x Cortex-A55 (1.84 GHz). The processor is manufactured using a 7 nm process technology and supports UFS 2.1, 4G, 5G, LPDDR4X.

AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
Number of cores | 8 |
Instruction Set | ARMv8.2-A |
Lithography | 7 nm |
TDP | 6 Watt |
Neural Processing | Ascend D110 Lite, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 12 GB |
Memory type | LPDDR4X |
Memory frequency | 2133 MHz |
Memory-bus | 4x16 bit |
Storage
Storage specification | UFS 2.1 |
Graphics
GPU name | Mali-G57 MP6 |
GPU Architecture | Mali Valhall |
GPU frequency | 850 MHz |
Execution units | 6 |
Shaders | 96 |
DirectX | 12 |
OpenCL API | 2.1 |
OpenGL API | ES 3.2 |
Vulkan API | 1.2 |
Camera, Video, Display
Max camera resolution | 1x 48MP, 2x 20MP |
Max Video Capture | 4K@30fps |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes |
5G network | Yes |
Peak Download Speed | 1.6 Gbps |
Peak Upload Speed | 0.2 Gbps |
Wi-Fi | 6 (802.11ax) |
Bluetooth | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
Supplemental Information
Launch Date | 2020 March |
Vertical Segment | Mobiles |
Positioning | Mid-end |
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