HiSilicon Kirin 820 5G

Kirin 820 5G is one of HiSilicon mid-end CPU. 8 cores (8 threads). It was announced in 2020 March. It has "top.big.LITTLE" cores-set: 1x Cortex-A76, 3x Cortex-A76 (2.22 GHz), 4x Cortex-A55 (1.84 GHz). The processor is manufactured using a 7 nm process technology and supports UFS 2.1, 4G, 5G, LPDDR4X.
HiSilicon Kirin 820 5G

CPU cores and architecture

Architecture 1x 2.36 GHz – Cortex-A76
3x 2.22 GHz – Cortex-A76
4x 1.84 GHz – Cortex-A55
Number of cores 8
Instruction Set ARMv8.2-A
Lithography 7 nm
TDP 6 Watt
Neural Processing Ascend D110 Lite, HUAWEI Da Vinci Architecture

Memory (RAM)

Max amount up to 12 GB
Memory type LPDDR4X
Memory frequency 2133 MHz
Memory-bus 4x16 bit

Storage

Storage specification UFS 2.1

Graphics

GPU name Mali-G57 MP6
GPU Architecture Valhall
GPU frequency 850 MHz
Execution units 6
Shaders 96
DirectX 12
OpenCL API 2.1
OpenGL API ES 3.2
Vulkan API 1.2

Camera, Video, Display

Max camera resolution 1x 48MP, 2x 20MP
Max Video Capture 4K@30fps
Video codec support AV1
H.264 (AVC)
H.265 (HEVC)
VP8
VP9

Wireless

4G network Yes
5G network Yes
Peak Download Speed 1.6 Gbps
Peak Upload Speed 0.2 Gbps
Wi-Fi 6 (802.11ax)
Bluetooth 5.1
Satellite navigation BeiDou
GPS
GLONASS

Supplemental Information

Launch Date 2020 March
Vertical Segment Mobiles
Positioning Mid-end

AnTuTu 10

Total Score
Kirin 820 5G
387656

GeekBench 6 Single-Core

Score
Kirin 820 5G
640

GeekBench 6 Multi-Core

Score
Kirin 820 5G
2436

Popular comparisons:

1
Apple A14 Bionic vs Samsung Exynos 7904
2
Qualcomm Snapdragon 865 Plus vs Unisoc Tiger T310
3
MediaTek Dimensity 8000 vs MediaTek Dimensity 8100
4
Samsung Exynos 9609 vs Qualcomm Snapdragon 660
5
Qualcomm Snapdragon 678 vs Qualcomm Snapdragon 732G
6
MediaTek Helio G37 vs Google Tensor G2
7
MediaTek Dimensity 810 vs MediaTek Helio G80
8
Qualcomm Snapdragon 821 vs Samsung Exynos 990
9
Qualcomm Snapdragon 720G vs Qualcomm Snapdragon 680
10
Google Tensor G1 vs Qualcomm Snapdragon 685