HiSilicon Kirin 820 5G

The HiSilicon Kirin 820 5G is a {total_cores} CPU It has 8 cores and was announced in 2020 March. It has "top.big.LITTLE" cores-set: 1x Cortex-A76, 3x Cortex-A76 (2.22 GHz), 4x Cortex-A55 (1.84 GHz). The processor is manufactured using a 7 nm process technology and supports UFS 2.1, 4G, 5G, LPDDR4X.
HiSilicon Kirin 820 5G

AnTuTu 10

Total Score
Kirin 820 5G
387656

GeekBench 6 Single-Core

Score
Kirin 820 5G
640

GeekBench 6 Multi-Core

Score
Kirin 820 5G
2436

CPU cores and architecture

Architecture 1x 2.36 GHz – Cortex-A76
3x 2.22 GHz – Cortex-A76
4x 1.84 GHz – Cortex-A55
Number of cores 8
Instruction Set ARMv8.2-A
Lithography 7 nm
TDP 6 Watt
Neural Processing Ascend D110 Lite, HUAWEI Da Vinci Architecture

Memory (RAM)

Max amount up to 12 GB
Memory type LPDDR4X
Memory frequency 2133 MHz
Memory-bus 4x16 bit

Storage

Storage specification UFS 2.1

Graphics

GPU name Mali-G57 MP6
GPU Architecture Mali Valhall
GPU frequency 850 MHz
Execution units 6
Shaders 96
DirectX 12
OpenCL API 2.1
OpenGL API ES 3.2
Vulkan API 1.2

Camera, Video, Display

Max camera resolution 1x 48MP, 2x 20MP
Max Video Capture 4K@30fps
Video codec support AV1
H.264 (AVC)
H.265 (HEVC)
VP8
VP9

Wireless

4G network Yes
5G network Yes
Peak Download Speed 1.6 Gbps
Peak Upload Speed 0.2 Gbps
Wi-Fi 6 (802.11ax)
Bluetooth 5.1
Satellite navigation BeiDou
GPS
GLONASS

Supplemental Information

Launch Date 2020 March
Vertical Segment Mobiles
Positioning Mid-end

Popular comparisons:

1
Qualcomm Snapdragon 782G vs MediaTek Dimensity 7050
2
Apple A18 Pro vs Apple A9
3
MediaTek Dimensity 1000 Plus vs HiSilicon Kirin 810
4
Qualcomm Snapdragon 662 vs Apple A13 Bionic
5
MediaTek Dimensity 8400 vs MediaTek Dimensity 6300
6
Apple M1 (iPad) vs MediaTek Helio G50
7
Qualcomm Snapdragon 710 vs Qualcomm Snapdragon 765
8
Unisoc Tiger T606 vs MediaTek Dimensity 8100
9
MediaTek Dimensity 800U vs MediaTek Helio G100
10
MediaTek Dimensity 7300 vs Qualcomm Snapdragon 860