HiSilicon Kirin 810 vs MediaTek Dimensity 820

When comparing the specifications of two processors, the HiSilicon Kirin 810 and the MediaTek Dimensity 820, several factors come into play.

Starting with the CPU cores and architecture, the HiSilicon Kirin 810 features an architecture of 2x 2.27 GHz Cortex-A76 and 6x 1.88 GHz Cortex-A55. In contrast, the MediaTek Dimensity 820 boasts an architecture of 4x 2.6 GHz Cortex-A76 and 4x 2.0 GHz Cortex-A55. Both processors offer eight cores, providing ample processing power for various tasks.

In terms of instruction set, both processors utilize the ARMv8.2-A instruction set. This ensures compatibility with a wide range of software and applications, allowing for seamless user experience.

Moving on to lithography, both the HiSilicon Kirin 810 and the MediaTek Dimensity 820 employ a 7 nm lithography. This process technology allows for more transistors to be accommodated within a smaller space, resulting in enhanced performance and energy efficiency.

Speaking of transistors, the HiSilicon Kirin 810 utilizes 6900 million transistors, while the MediaTek Dimensity 820 does not provide specific information on the number of transistors used. Nonetheless, it can be assumed that both processors have a substantial number of transistors, contributing to their overall performance capabilities.

In terms of thermal design power (TDP), the HiSilicon Kirin 810 boasts a lower TDP of 5 watts compared to the MediaTek Dimensity 820, which has a TDP of 10 watts. A lower TDP indicates a more power-efficient processor, contributing to improved battery life and reduced heat generation.

Finally, in terms of neural processing capabilities, the HiSilicon Kirin 810 utilizes the Ascend D100 Lite and Huawei Da Vinci Architecture, while the MediaTek Dimensity 820 features an NPU (Neural Processing Unit). Both processors offer advanced AI capabilities, contributing to improved performance in tasks such as image processing and machine learning.

Ultimately, when comparing the specifications of the HiSilicon Kirin 810 and the MediaTek Dimensity 820, it is evident that both processors offer impressive performance capabilities. However, the MediaTek Dimensity 820 may have an advantage in terms of CPU clock speeds, while the HiSilicon Kirin 810 showcases a lower TDP. The choice between the two would depend on individual requirements and priorities for performance and power efficiency.

CPU cores and architecture

Architecture 2x 2.27 GHz – Cortex-A76
6x 1.88 GHz – Cortex-A55
4x 2.6 GHz – Cortex-A76
4x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 7 nm
Number of transistors 6900 million
TDP 5 Watt 10 Watt
Neural Processing Ascend D100 Lite, HUAWEI Da Vinci Architecture NPU

Memory (RAM)

Max amount up to 8 GB up to 16 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 2133 MHz
Memory-bus 4x16 bit 2x16 bit


Storage specification UFS 2.1 UFS 2.2


GPU name Mali-G52 MP6 Mali-G57 MP5
GPU Architecture Bifrost Valhall
GPU frequency 820 MHz 650 MHz
Execution units 6 5
Shaders 96 80
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 20MP 1x 80MP, 1x 32MP + 1x 16MP
Max Video Capture FullHD@30fps 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
H.264 (AVC)
H.265 (HEVC)


4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.1 5.1
Satellite navigation BeiDou

Supplemental Information

Launch Date 2019 Quarter 2 2020 May
Partnumber Hi6280 MT6875
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 810
Dimensity 820

GeekBench 6 Single-Core

Kirin 810
Dimensity 820

GeekBench 6 Multi-Core

Kirin 810
Dimensity 820