HiSilicon Kirin 810 vs MediaTek Dimensity 820
When comparing the specifications of two processors, the HiSilicon Kirin 810 and the MediaTek Dimensity 820, several factors come into play.
Starting with the CPU cores and architecture, the HiSilicon Kirin 810 features an architecture of 2x 2.27 GHz Cortex-A76 and 6x 1.88 GHz Cortex-A55. In contrast, the MediaTek Dimensity 820 boasts an architecture of 4x 2.6 GHz Cortex-A76 and 4x 2.0 GHz Cortex-A55. Both processors offer eight cores, providing ample processing power for various tasks.
In terms of instruction set, both processors utilize the ARMv8.2-A instruction set. This ensures compatibility with a wide range of software and applications, allowing for seamless user experience.
Moving on to lithography, both the HiSilicon Kirin 810 and the MediaTek Dimensity 820 employ a 7 nm lithography. This process technology allows for more transistors to be accommodated within a smaller space, resulting in enhanced performance and energy efficiency.
Speaking of transistors, the HiSilicon Kirin 810 utilizes 6900 million transistors, while the MediaTek Dimensity 820 does not provide specific information on the number of transistors used. Nonetheless, it can be assumed that both processors have a substantial number of transistors, contributing to their overall performance capabilities.
In terms of thermal design power (TDP), the HiSilicon Kirin 810 boasts a lower TDP of 5 watts compared to the MediaTek Dimensity 820, which has a TDP of 10 watts. A lower TDP indicates a more power-efficient processor, contributing to improved battery life and reduced heat generation.
Finally, in terms of neural processing capabilities, the HiSilicon Kirin 810 utilizes the Ascend D100 Lite and Huawei Da Vinci Architecture, while the MediaTek Dimensity 820 features an NPU (Neural Processing Unit). Both processors offer advanced AI capabilities, contributing to improved performance in tasks such as image processing and machine learning.
Ultimately, when comparing the specifications of the HiSilicon Kirin 810 and the MediaTek Dimensity 820, it is evident that both processors offer impressive performance capabilities. However, the MediaTek Dimensity 820 may have an advantage in terms of CPU clock speeds, while the HiSilicon Kirin 810 showcases a lower TDP. The choice between the two would depend on individual requirements and priorities for performance and power efficiency.
Starting with the CPU cores and architecture, the HiSilicon Kirin 810 features an architecture of 2x 2.27 GHz Cortex-A76 and 6x 1.88 GHz Cortex-A55. In contrast, the MediaTek Dimensity 820 boasts an architecture of 4x 2.6 GHz Cortex-A76 and 4x 2.0 GHz Cortex-A55. Both processors offer eight cores, providing ample processing power for various tasks.
In terms of instruction set, both processors utilize the ARMv8.2-A instruction set. This ensures compatibility with a wide range of software and applications, allowing for seamless user experience.
Moving on to lithography, both the HiSilicon Kirin 810 and the MediaTek Dimensity 820 employ a 7 nm lithography. This process technology allows for more transistors to be accommodated within a smaller space, resulting in enhanced performance and energy efficiency.
Speaking of transistors, the HiSilicon Kirin 810 utilizes 6900 million transistors, while the MediaTek Dimensity 820 does not provide specific information on the number of transistors used. Nonetheless, it can be assumed that both processors have a substantial number of transistors, contributing to their overall performance capabilities.
In terms of thermal design power (TDP), the HiSilicon Kirin 810 boasts a lower TDP of 5 watts compared to the MediaTek Dimensity 820, which has a TDP of 10 watts. A lower TDP indicates a more power-efficient processor, contributing to improved battery life and reduced heat generation.
Finally, in terms of neural processing capabilities, the HiSilicon Kirin 810 utilizes the Ascend D100 Lite and Huawei Da Vinci Architecture, while the MediaTek Dimensity 820 features an NPU (Neural Processing Unit). Both processors offer advanced AI capabilities, contributing to improved performance in tasks such as image processing and machine learning.
Ultimately, when comparing the specifications of the HiSilicon Kirin 810 and the MediaTek Dimensity 820, it is evident that both processors offer impressive performance capabilities. However, the MediaTek Dimensity 820 may have an advantage in terms of CPU clock speeds, while the HiSilicon Kirin 810 showcases a lower TDP. The choice between the two would depend on individual requirements and priorities for performance and power efficiency.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
4x 2.6 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 7 nm |
Number of transistors | 6900 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 16 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G52 MP6 | Mali-G57 MP5 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 820 MHz | 650 MHz |
Execution units | 6 | 5 |
Shaders | 96 | 80 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 80MP, 1x 32MP + 1x 16MP |
Max Video Capture | FullHD@30fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2019 Quarter 2 | 2020 May |
Partnumber | Hi6280 | MT6875 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
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