HiSilicon Kirin 810

cpu_s1 It has 8 cores and was announced in 2019 Quarter 2. It has "big.LITTLE" cores-set: 2x Cortex-A76 (2.27 GHz), 6x Cortex-A55 (1.88 GHz). The processor is manufactured using a 7 nm process technology and supports UFS 2.1, 4G, LPDDR4X.
HiSilicon Kirin 810

AnTuTu 10

Total Score
Kirin 810
373134

GeekBench 6 Single-Core

Score
Kirin 810
604

GeekBench 6 Multi-Core

Score
Kirin 810
1959

CPU cores and architecture

Architecture 2x 2.27 GHz – Cortex-A76
6x 1.88 GHz – Cortex-A55
Number of cores 8
Instruction Set ARMv8.2-A
Lithography 7 nm
Number of transistors 6900 million
TDP 5 Watt
Neural Processing Ascend D100 Lite, HUAWEI Da Vinci Architecture

Memory (RAM)

Max amount up to 8 GB
Memory type LPDDR4X
Memory frequency 2133 MHz
Memory-bus 4x16 bit

Storage

Storage specification UFS 2.1

Graphics

GPU name Mali-G52 MP6
GPU Architecture Mali Bifrost
GPU frequency 820 MHz
Execution units 6
Shaders 96
DirectX 12
OpenCL API 2.0
OpenGL API ES 3.2
Vulkan API 1.0

Camera, Video, Display

Max camera resolution 1x 48MP, 2x 20MP
Max Video Capture FullHD@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9

Wireless

4G network Yes
5G network Yes
Peak Download Speed 0.6 Gbps
Peak Upload Speed 0.15 Gbps
Wi-Fi 6 (802.11ax)
Bluetooth 5.1
Satellite navigation BeiDou
GPS
GLONASS

Supplemental Information

Launch Date 2019 Quarter 2
Partnumber Hi6280
Vertical Segment Mobiles
Positioning Mid-end

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