HiSilicon Kirin 810 vs HiSilicon Kirin 950

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The HiSilicon Kirin 810 and HiSilicon Kirin 950 are both powerful processors designed by HiSilicon Technologies, a subsidiary of Huawei. While they are both capable processors, they have some notable differences in their specifications.

Starting with the HiSilicon Kirin 810, it features an architecture consisting of 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. With a total of 8 cores, it offers a versatile and efficient performance. It operates on the ARMv8.2-A instruction set and has a lithography of 7 nm, which means it is manufactured using a highly advanced and energy-efficient process. In terms of the number of transistors, it boasts 6900 million, showcasing its ability to handle complex tasks. Additionally, it has a thermal design power (TDP) of 5 Watt, making it energy-efficient. It also includes Ascend D100 Lite for neural processing, utilizing HUAWEI Da Vinci Architecture.

On the other hand, the HiSilicon Kirin 950 operates on an architecture comprising 4x 2.4 GHz Cortex-A72 cores and 4x 1.8 GHz Cortex-A53 cores. Similar to the Kirin 810, it also has a total of 8 cores. However, it employs the ARMv8-A instruction set and has a lithography of 16 nm, indicating it is manufactured on a slightly older and less energy-efficient process. It possesses 2000 million transistors, which is notably lower than the Kirin 810. This suggests that it may not handle more demanding tasks as efficiently as its counterpart. Like the Kirin 810, it also has a TDP of 5 Watts.

In summary, the HiSilicon Kirin 810 and HiSilicon Kirin 950 differ in terms of their CPU architecture, instruction set, lithography, number of transistors, and neural processing capabilities. The Kirin 810 is built on a more advanced 7 nm process and includes Ascend D100 Lite with HUAWEI Da Vinci Architecture, while the Kirin 950 operates on a 16 nm process and lacks dedicated neural processing hardware. These differences may impact their performance, energy efficiency, and ability to handle complex tasks.

CPU cores and architecture

Architecture 2x 2.27 GHz – Cortex-A76
6x 1.88 GHz – Cortex-A55
4x 2.4 GHz – Cortex-A72
4x 1.8 GHz – Cortex-A53
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8-A
Lithography 7 nm 16 nm
Number of transistors 6900 million 2000 million
TDP 5 Watt 5 Watt
Neural Processing Ascend D100 Lite, HUAWEI Da Vinci Architecture

Memory (RAM)

Max amount up to 8 GB up to 4 GB
Memory type LPDDR4X LPDDR4
Memory frequency 2133 MHz 1333 MHz
Memory-bus 4x16 bit 2x32 bit

Storage

Storage specification UFS 2.1 UFS 2.0

Graphics

GPU name Mali-G52 MP6 Mali-T880 MP4
GPU Architecture Bifrost Midgard
GPU frequency 820 MHz 900 MHz
Execution units 6 4
Shaders 96 64
DirectX 12 11.2
OpenCL API 2.0 1.2
OpenGL API ES 3.2
Vulkan API 1.0 1.0

Camera, Video, Display

Max camera resolution 1x 48MP, 2x 20MP 1x 31MP, 2x 13MP
Max Video Capture FullHD@30fps FullHD@60fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP8

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 0.3 Gbps
Peak Upload Speed 0.15 Gbps 0.05 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.1 4.2
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2019 Quarter 2 2015 November
Partnumber Hi6280 Hi3650
Vertical Segment Mobiles Mobiles
Positioning Mid-end Flagship

AnTuTu 10

Total Score
Kirin 810
373134
Kirin 950
135741

GeekBench 6 Single-Core

Score
Kirin 810
604
Kirin 950
341

GeekBench 6 Multi-Core

Score
Kirin 810
1959
Kirin 950
1294