HiSilicon Kirin 810 vs MediaTek Dimensity 7050

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Which processor is better? We compared HiSilicon Kirin 810 with MediaTek Dimensity 7050. Compare, analyze the specifications. Find out their scores in popular benchmarks (AnTuTu 10, GeekBench 6 Single-Core, GeekBench 6 Multi-Core) and who is the winner?

CPU cores and architecture

Architecture	2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55	2x 2.6 GHz – Cortex-A78 6x 2 GHz – Cortex-A55
Number of cores	8	8
Instruction Set	ARMv8.2-A	ARMv8.2-A
Lithography	7 nm	6 nm
Number of transistors	6900 million
TDP	5 Watt	4 Watt
Neural Processing	Ascend D100 Lite, HUAWEI Da Vinci Architecture	MediaTek APU 3.0

Memory (RAM)

Max amount	up to 8 GB	up to 16 GB
Memory type	LPDDR4X	LPDDR5
Memory frequency	2133 MHz	3200 MHz
Memory-bus	4x16 bit	4x16 bit

Storage

Storage specification

UFS 2.1

UFS 3.1

Graphics

GPU name	Mali-G52 MP6	Mali-G68 MP4
GPU Architecture	Bifrost	Valhall
GPU frequency	820 MHz	800 MHz
Execution units	6	3
Shaders	96	64
DirectX	12
OpenCL API	2.0	2.1
OpenGL API	ES 3.2	ES 3.2
Vulkan API	1.0	1.2

Camera, Video, Display

Max screen resolution		2520x1080
Max camera resolution	1x 48MP, 2x 20MP	1x 200MP
Max Video Capture	FullHD@30fps	4K@30fps
Video codec support	H.264 (AVC) H.265 (HEVC) VP8 VP9	H.264 (AVC) H.265 (HEVC) VP9

Wireless

4G network	Yes	Yes
5G network	Yes	Yes
Peak Download Speed	0.6 Gbps	2.77 Gbps
Peak Upload Speed	0.15 Gbps
Wi-Fi	6 (802.11ax)	6 (802.11ax)
Bluetooth	5.1	5.2
Satellite navigation	BeiDou GPS GLONASS	BeiDou GPS Galileo GLONASS NavIC QZSS