MediaTek Dimensity 7050
Dimensity 7050 is one of MediaTek mid-end CPU. It was announced in 2023 Quarter 2. 2x Cortex-A78 (2.6 GHz), 6x Cortex-A55 (2 GHz). and supports UFS 3.1, 4G, 5G, LPDDR5.
CPU cores and architecture
Architecture | 2x 2.6 GHz – Cortex-A78 6x 2 GHz – Cortex-A55 |
Number of cores | 8 |
Instruction Set | ARMv8.2-A |
Lithography | 6 nm |
TDP | 4 Watt |
Neural Processing | MediaTek APU 3.0 |
Memory (RAM)
Max amount | up to 16 GB |
Memory type | LPDDR5 |
Memory frequency | 3200 MHz |
Memory-bus | 4x16 bit |
Storage
Storage specification | UFS 3.1 |
Graphics
GPU name | Mali-G68 MP4 |
GPU Architecture | Valhall |
GPU frequency | 800 MHz |
Execution units | 3 |
Shaders | 64 |
OpenCL API | 2.1 |
OpenGL API | ES 3.2 |
Vulkan API | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080 |
Max camera resolution | 1x 200MP |
Max Video Capture | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes |
5G network | Yes |
Peak Download Speed | 2.77 Gbps |
Wi-Fi | 6 (802.11ax) |
Bluetooth | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2023 Quarter 2 |
Partnumber | MT6877V |
Vertical Segment | Mobiles |
Positioning | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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