HiSilicon Kirin 710 vs HiSilicon Kirin 970
The HiSilicon Kirin 710 and Kirin 970 are two processors that are commonly used in smartphones and other devices. While they both offer impressive performance, there are some specifications that set them apart.
Starting with the HiSilicon Kirin 710, this processor boasts a combination of Cortex-A73 and Cortex-A53 cores. It has 4 high-performance cores clocked at 2.2 GHz and 4 efficiency cores clocked at 1.7 GHz. With a total of 8 cores, this processor is designed to handle a wide range of tasks efficiently. It utilizes the ARMv8-A instruction set and features a 12 nm lithography, which helps to optimize power consumption and improve performance. The HiSilicon Kirin 710 has 5500 million transistors and operates with a TDP (Thermal Design Power) of 5 Watts.
On the other hand, the HiSilicon Kirin 970 takes performance to the next level. It also employs a combination of Cortex-A73 and Cortex-A53 cores, but with higher clock speeds. It has 4 high-performance cores clocked at 2.4 GHz and 4 efficiency cores clocked at 1.8 GHz. The Kirin 970, similar to the Kirin 710, utilizes the ARMv8-A instruction set. However, it features a more advanced 10 nm lithography, which allows for increased performance and power efficiency. Additionally, the Kirin 970 includes a Neural Processing Unit (NPU), which enhances AI capabilities and enables faster and more efficient processing of neural network tasks. The Kirin 970 has the same number of transistors as the Kirin 710, but operates with a slightly higher TDP of 9 Watts.
In summary, while both processors offer commendable performance, the HiSilicon Kirin 970 surpasses the Kirin 710 in several aspects. It has higher clock speeds, a more advanced lithography, and includes a Neural Processing Unit for improved AI capabilities. However, it's important to note that both processors are well-suited for everyday tasks and can handle a variety of applications with ease.
Starting with the HiSilicon Kirin 710, this processor boasts a combination of Cortex-A73 and Cortex-A53 cores. It has 4 high-performance cores clocked at 2.2 GHz and 4 efficiency cores clocked at 1.7 GHz. With a total of 8 cores, this processor is designed to handle a wide range of tasks efficiently. It utilizes the ARMv8-A instruction set and features a 12 nm lithography, which helps to optimize power consumption and improve performance. The HiSilicon Kirin 710 has 5500 million transistors and operates with a TDP (Thermal Design Power) of 5 Watts.
On the other hand, the HiSilicon Kirin 970 takes performance to the next level. It also employs a combination of Cortex-A73 and Cortex-A53 cores, but with higher clock speeds. It has 4 high-performance cores clocked at 2.4 GHz and 4 efficiency cores clocked at 1.8 GHz. The Kirin 970, similar to the Kirin 710, utilizes the ARMv8-A instruction set. However, it features a more advanced 10 nm lithography, which allows for increased performance and power efficiency. Additionally, the Kirin 970 includes a Neural Processing Unit (NPU), which enhances AI capabilities and enables faster and more efficient processing of neural network tasks. The Kirin 970 has the same number of transistors as the Kirin 710, but operates with a slightly higher TDP of 9 Watts.
In summary, while both processors offer commendable performance, the HiSilicon Kirin 970 surpasses the Kirin 710 in several aspects. It has higher clock speeds, a more advanced lithography, and includes a Neural Processing Unit for improved AI capabilities. However, it's important to note that both processors are well-suited for everyday tasks and can handle a variety of applications with ease.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8-A |
Lithography | 12 nm | 10 nm |
Number of transistors | 5500 million | 5500 million |
TDP | 5 Watt | 9 Watt |
Neural Processing | HiSilicon NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 8 GB |
Memory type | LPDDR4 | LPDDR4 |
Memory frequency | 1866 MHz | 1866 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G72 MP12 |
GPU Architecture | Bifrost | Bifrost |
GPU frequency | 650 MHz | 750 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 12 |
Shaders | 64 | 192 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.0 |
Vulkan API | 1.0 | 1.0 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2340x1080 |
Max camera resolution | 1x 40MP, 2x 24MP | 1x 48MP, 2x 20MP |
Max Video Capture | 4K@30fps | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 1.2 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.15 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 4.2 | 4.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2018 Quarter 3 | 2017 September |
Partnumber | Hi6260 | Hi3670 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Flagship |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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