HiSilicon Kirin 710
The HiSilicon Kirin 710 is a {total_cores} CPU It has 8 cores and was announced in 2018 Quarter 3. It has "big.LITTLE" cores-set: 4x Cortex-A73 (2.2 GHz), 4x Cortex-A53 (1.7 GHz). The processor is manufactured using a 12 nm process technology and supports UFS 2.1, 4G, LPDDR4.

AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
Number of cores | 8 |
Instruction Set | ARMv8-A |
Lithography | 12 nm |
Number of transistors | 5500 million |
TDP | 5 Watt |
Memory (RAM)
Max amount | up to 6 GB |
Memory type | LPDDR4 |
Memory frequency | 1866 MHz |
Memory-bus | 2x32 bit |
Storage
Storage specification | UFS 2.1 |
Graphics
GPU name | Mali-G51 MP4 |
GPU Architecture | Mali Bifrost |
GPU frequency | 1000 MHz |
Execution units | 4 |
Shaders | 64 |
DirectX | 12 |
OpenCL API | 2.0 |
Vulkan API | 1.0 |
Camera, Video, Display
Max screen resolution | 2340x1080 |
Max camera resolution | 1x 40MP, 2x 24MP |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes |
5G network | Yes |
Peak Download Speed | 0.6 Gbps |
Peak Upload Speed | 0.15 Gbps |
Wi-Fi | 4 (802.11n) |
Bluetooth | 4.2 |
Satellite navigation | BeiDou GPS GLONASS |
Supplemental Information
Launch Date | 2018 Quarter 3 |
Partnumber | Hi6260 |
Vertical Segment | Mobiles |
Positioning | Mid-end |
Popular comparisons:
1
Samsung Exynos 9610 vs Apple A17 Pro
2
MediaTek Helio G25 vs MediaTek Dimensity 9200
3
Qualcomm Snapdragon 4s Gen 2 vs Unisoc Tiger T310
4
MediaTek Dimensity 8300 vs Google Tensor G5
5
Apple M2 (iPad) vs MediaTek Helio G35
6
Qualcomm Snapdragon 632 vs MediaTek Dimensity 1080
7
Qualcomm Snapdragon 801 vs Unisoc T9100
8
MediaTek Helio P60 vs Qualcomm Snapdragon 8s Gen 4
9
MediaTek Dimensity 1000 vs HiSilicon Kirin 9020
10
MediaTek Dimensity 1300 vs MediaTek Dimensity 7200