HiSilicon Kirin 710 vs HiSilicon Kirin 810
The HiSilicon Kirin 710 and HiSilicon Kirin 810 are two processors manufactured by HiSilicon, a subsidiary of Huawei. While both processors have their advantages, they differ in certain specifications that may influence performance.
Starting with the HiSilicon Kirin 710, it is built on a 12nm lithography and has a total of 8 CPU cores. Its architecture comprises of 4 Cortex-A73 cores clocked at 2.2 GHz and 4 Cortex-A53 cores clocked at 1.7 GHz. With an ARMv8-A instruction set, it offers a balance between power and efficiency. With 5500 million transistors, it boasts decent performance for its class. The TDP of the Kirin 710 is 5 Watts.
On the other hand, the HiSilicon Kirin 810 stands out with its more advanced specifications. It utilizes a 7nm lithography, providing improved power efficiency. The processor also boasts 8 cores, with 2 Cortex-A76 cores clocked at 2.27 GHz for high performance tasks and 6 Cortex-A55 cores clocked at 1.88 GHz for lower power consumption. The Kirin 810 has an ARMv8.2-A instruction set, potentially offering enhanced compatibility with newer software. Additionally, it features 6900 million transistors, indicating improved processing capabilities. The TDP of the Kirin 810 is also 5 Watts.
In terms of neural processing, the HiSilicon Kirin 810 has an additional feature known as the Ascend D100 Lite, which uses HUAWEI Da Vinci Architecture. This dedicated neural processing unit enhances AI-related tasks, such as facial recognition and machine learning algorithms.
Overall, the HiSilicon Kirin 810 outshines the Kirin 710 in terms of lithography, CPU architecture, and number of transistors. It offers better power efficiency and potentially superior performance. However, both processors have the same TDP and a similar number of CPU cores. The choice between the two processors ultimately depends on the specific requirements and priorities of the user.
Starting with the HiSilicon Kirin 710, it is built on a 12nm lithography and has a total of 8 CPU cores. Its architecture comprises of 4 Cortex-A73 cores clocked at 2.2 GHz and 4 Cortex-A53 cores clocked at 1.7 GHz. With an ARMv8-A instruction set, it offers a balance between power and efficiency. With 5500 million transistors, it boasts decent performance for its class. The TDP of the Kirin 710 is 5 Watts.
On the other hand, the HiSilicon Kirin 810 stands out with its more advanced specifications. It utilizes a 7nm lithography, providing improved power efficiency. The processor also boasts 8 cores, with 2 Cortex-A76 cores clocked at 2.27 GHz for high performance tasks and 6 Cortex-A55 cores clocked at 1.88 GHz for lower power consumption. The Kirin 810 has an ARMv8.2-A instruction set, potentially offering enhanced compatibility with newer software. Additionally, it features 6900 million transistors, indicating improved processing capabilities. The TDP of the Kirin 810 is also 5 Watts.
In terms of neural processing, the HiSilicon Kirin 810 has an additional feature known as the Ascend D100 Lite, which uses HUAWEI Da Vinci Architecture. This dedicated neural processing unit enhances AI-related tasks, such as facial recognition and machine learning algorithms.
Overall, the HiSilicon Kirin 810 outshines the Kirin 710 in terms of lithography, CPU architecture, and number of transistors. It offers better power efficiency and potentially superior performance. However, both processors have the same TDP and a similar number of CPU cores. The choice between the two processors ultimately depends on the specific requirements and priorities of the user.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 12 nm | 7 nm |
Number of transistors | 5500 million | 6900 million |
TDP | 5 Watt | 5 Watt |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 6 GB | up to 8 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G52 MP6 |
GPU Architecture | Mali Bifrost | Mali Bifrost |
GPU frequency | 1000 MHz | 820 MHz |
Execution units | 4 | 6 |
Shaders | 64 | 96 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.0 |
Camera, Video, Display
Max screen resolution | 2340x1080 | |
Max camera resolution | 1x 40MP, 2x 24MP | 1x 48MP, 2x 20MP |
Max Video Capture | FullHD@30fps | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.6 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.15 Gbps |
Wi-Fi | 4 (802.11n) | 6 (802.11ax) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS GLONASS |
Supplemental Information
Launch Date | 2018 Quarter 3 | 2019 Quarter 2 |
Partnumber | Hi6260 | Hi6280 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
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