Unisoc SC9832E vs Unisoc Tanggula T740 5G
The Unisoc SC9832E and the Unisoc Tanggula T740 5G are two processors with varying specifications. Let's compare them in terms of their CPU cores and architecture, instruction set, lithography, and additional features.
Starting with the Unisoc SC9832E, it features a 4x 1.4 GHz Cortex-A53 architecture. With four cores, this processor can handle a decent amount of tasks simultaneously. Its instruction set is ARMv8-A, allowing it to support the latest software and applications. With a lithography of 28 nm, this processor may not be as power-efficient as processors with a smaller lithography. It has a TDP (Thermal Design Power) of 7 Watts, which represents the amount of heat generated and dissipated by the processor during operation.
On the other hand, the Unisoc Tanggula T740 5G boasts more advanced specifications. It has an architecture of 4x 1.8 GHz Cortex-A75 and 4x 1.8 GHz Cortex-A55, giving it a total of 8 cores. This multi-core setup enables enhanced multitasking and faster processing speed. Its instruction set, ARMv8.2-A, supports newer features and optimizations compared to the SC9832E. With a lithography of 12 nm, this processor is more power-efficient, reducing energy consumption and heat generation. Additionally, the Tanggula T740 5G comes with the added feature of dual Neural Processing Units (NPUs). These NPUs enhance AI (Artificial Intelligence) capabilities, enabling tasks such as facial recognition and voice commands with better accuracy and efficiency.
In summary, the Unisoc SC9832E is a mid-range processor with a 4x 1.4 GHz Cortex-A53 architecture, ARMv8-A instruction set, 28 nm lithography, and a TDP of 7 Watts. On the other hand, the Unisoc Tanggula T740 5G is a more high-end processor featuring an 8-core setup with a combination of Cortex-A75 and Cortex-A55 cores, ARMv8.2-A instruction set, a 12 nm lithography, and dual Neural Processing Units for improved AI capabilities. Depending on the intended usage, the Tanggula T740 5G would offer better performance and power efficiency compared to the SC9832E.
Starting with the Unisoc SC9832E, it features a 4x 1.4 GHz Cortex-A53 architecture. With four cores, this processor can handle a decent amount of tasks simultaneously. Its instruction set is ARMv8-A, allowing it to support the latest software and applications. With a lithography of 28 nm, this processor may not be as power-efficient as processors with a smaller lithography. It has a TDP (Thermal Design Power) of 7 Watts, which represents the amount of heat generated and dissipated by the processor during operation.
On the other hand, the Unisoc Tanggula T740 5G boasts more advanced specifications. It has an architecture of 4x 1.8 GHz Cortex-A75 and 4x 1.8 GHz Cortex-A55, giving it a total of 8 cores. This multi-core setup enables enhanced multitasking and faster processing speed. Its instruction set, ARMv8.2-A, supports newer features and optimizations compared to the SC9832E. With a lithography of 12 nm, this processor is more power-efficient, reducing energy consumption and heat generation. Additionally, the Tanggula T740 5G comes with the added feature of dual Neural Processing Units (NPUs). These NPUs enhance AI (Artificial Intelligence) capabilities, enabling tasks such as facial recognition and voice commands with better accuracy and efficiency.
In summary, the Unisoc SC9832E is a mid-range processor with a 4x 1.4 GHz Cortex-A53 architecture, ARMv8-A instruction set, 28 nm lithography, and a TDP of 7 Watts. On the other hand, the Unisoc Tanggula T740 5G is a more high-end processor featuring an 8-core setup with a combination of Cortex-A75 and Cortex-A55 cores, ARMv8.2-A instruction set, a 12 nm lithography, and dual Neural Processing Units for improved AI capabilities. Depending on the intended usage, the Tanggula T740 5G would offer better performance and power efficiency compared to the SC9832E.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 1.4 GHz – Cortex-A53 | 4x 1.8 GHz – Cortex-A75 4x 1.8 GHz – Cortex-A55 |
Number of cores | 4 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 28 nm | 12 nm |
TDP | 7 Watt | |
Neural Processing | Dual NPU |
Memory (RAM)
Max amount | up to 2 GB | up to 8 GB |
Memory type | LPDDR3 | LPDDR4X |
Memory frequency | 667 MHz | 1866 MHz |
Storage
Storage specification | eMMC 5.1 | UFS 2.1 |
Graphics
GPU name | Mali-T820 MP1 | Imagination PowerVR GM9446 |
GPU Architecture | Mali Midgard | PowerVR Rogue |
GPU frequency | 680 MHz | 800 MHz |
Execution units | 1 | |
Shaders | 4 | |
DirectX | 11 | |
OpenCL API | 1.2 | 4.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.1 |
Camera, Video, Display
Max screen resolution | 1440x720 | 2960x1440@60Hz |
Max camera resolution | 1x 13MP | 1x 64MP |
Max Video Capture | FullHD@30fps | 4K@30fps |
Video codec support | H.264 (AVC) | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.15 Gbps | 1.5 Gbps |
Peak Upload Speed | 0.05 Gbps | 0.75 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2018 | 2020 Quarter 1 |
Partnumber | T740, Tiger T7510 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Low-end | Mid-end |
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