HiSilicon Kirin 985 5G vs MediaTek Dimensity 810
The HiSilicon Kirin 985 5G and MediaTek Dimensity 810 processors are both powerful options for mobile devices. Let's compare these two processors based on their specifications.
Firstly, let's look at the CPU cores and architecture. The Kirin 985 5G operates on a 1x 2.58 GHz Cortex-A76, 3x 2.4 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 architecture. On the other hand, the Dimensity 810 features a 2x 2.4 GHz Cortex-A76 and 6x 2.0 GHz Cortex-A55 architecture. In terms of the number of cores, both processors come with 8 cores each.
Moving on to the instruction set, both the Kirin 985 5G and Dimensity 810 support ARMv8.2-A instruction set. This ensures compatibility with modern software and applications.
In terms of lithography, the Kirin 985 5G is built on a 7 nm process, while the Dimensity 810 uses a 6 nm process. A smaller lithography generally translates to improved power efficiency and better performance.
The Kirin 985 5G utilizes Ascend D110 Lite + Ascend D100 Tiny for neural processing, while the Dimensity 810 incorporates an NPU for neural processing. Both processors offer capabilities for AI and machine learning tasks.
Lastly, let's consider the TDP (Thermal Design Power) of these processors. The Kirin 985 5G has a TDP of 6 Watts, whereas the Dimensity 810 has a slightly higher TDP of 8 Watts.
It is worth mentioning that the Dimensity 810 boasts a higher number of transistors with 12000 million, which may indicate better overall performance.
Overall, both the HiSilicon Kirin 985 5G and MediaTek Dimensity 810 processors offer impressive specifications. The Kirin 985 5G excels in terms of lower TDP, while the Dimensity 810 offers a smaller lithography and potentially higher transistor count. Ultimately, the choice between these processors would depend on specific usage requirements and individual preferences.
Firstly, let's look at the CPU cores and architecture. The Kirin 985 5G operates on a 1x 2.58 GHz Cortex-A76, 3x 2.4 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 architecture. On the other hand, the Dimensity 810 features a 2x 2.4 GHz Cortex-A76 and 6x 2.0 GHz Cortex-A55 architecture. In terms of the number of cores, both processors come with 8 cores each.
Moving on to the instruction set, both the Kirin 985 5G and Dimensity 810 support ARMv8.2-A instruction set. This ensures compatibility with modern software and applications.
In terms of lithography, the Kirin 985 5G is built on a 7 nm process, while the Dimensity 810 uses a 6 nm process. A smaller lithography generally translates to improved power efficiency and better performance.
The Kirin 985 5G utilizes Ascend D110 Lite + Ascend D100 Tiny for neural processing, while the Dimensity 810 incorporates an NPU for neural processing. Both processors offer capabilities for AI and machine learning tasks.
Lastly, let's consider the TDP (Thermal Design Power) of these processors. The Kirin 985 5G has a TDP of 6 Watts, whereas the Dimensity 810 has a slightly higher TDP of 8 Watts.
It is worth mentioning that the Dimensity 810 boasts a higher number of transistors with 12000 million, which may indicate better overall performance.
Overall, both the HiSilicon Kirin 985 5G and MediaTek Dimensity 810 processors offer impressive specifications. The Kirin 985 5G excels in terms of lower TDP, while the Dimensity 810 offers a smaller lithography and potentially higher transistor count. Ultimately, the choice between these processors would depend on specific usage requirements and individual preferences.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 1x 2.58 GHz – Cortex-A76 3x 2.4 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
2x 2.4 GHz – Cortex-A76 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 6 nm |
Number of transistors | 12000 million | |
TDP | 6 Watt | 8 Watt |
Neural Processing | Ascend D110 Lite + Ascend D100 Tiny, HUAWEI Da Vinci Architecture | NPU |
Memory (RAM)
Max amount | up to 12 GB | up to 12 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 3.0 | UFS 2.2 |
Graphics
GPU name | Mali-G77 MP8 | Mali-G57 MP2 |
GPU Architecture | Mali Valhall | Mali Valhall |
GPU frequency | 700 MHz | 950 MHz |
Execution units | 8 | 2 |
Shaders | 128 | 32 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3120x1440 | 2520x1080@120Hz |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 64MP, 2x 16MP |
Max Video Capture | 4K@30fp | 2K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.4 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.2 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 5.0 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2020 Quarter 2 | 2021 Quarter 3 |
Partnumber | Hi6290 | MT6833V/PNZA, MT6833P |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
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