HiSilicon Kirin 985 5G vs MediaTek Dimensity 930
The HiSilicon Kirin 985 5G and the MediaTek Dimensity 930 are two processors that differ in various specifications.
In terms of CPU cores and architecture, the Kirin 985 5G features a 1x 2.58 GHz Cortex-A76 core, 3x 2.4 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. On the other hand, the Dimensity 930 has a configuration of 2x 2.2 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. Both processors have 8 cores in total, offering efficient multitasking capabilities.
In relation to the instruction set, both processors utilize the ARMv8.2-A instruction set, ensuring compatibility with modern software and applications.
When it comes to lithography, the Kirin 985 5G is manufactured with a 7 nm process, while the Dimensity 930 boasts a smaller 6 nm lithography. A smaller lithography typically results in improved power efficiency and better performance.
In terms of thermal design power (TDP), the Kirin 985 5G consumes 6 watts, while the Dimensity 930 consumes a slightly higher 10 watts. Lower TDP values indicate better energy efficiency, which can contribute to longer battery life on devices powered by the Kirin 985 5G.
Regarding neural processing, the Kirin 985 5G employs the Ascend D110 Lite and Ascend D100 Tiny neural processors, utilizing the HUAWEI Da Vinci Architecture. The Dimensity 930, on the other hand, features an NPU for neural processing tasks.
In summary, the Kirin 985 5G and the Dimensity 930 differ in their CPU cores and architecture, lithography, TDP, and neural processing capabilities. The Kirin 985 5G offers a more diverse range of CPU cores and a smaller lithography, potentially leading to better performance and energy efficiency. However, the Dimensity 930 may excel in neural processing tasks with its dedicated NPU. Ultimately, the choice between these processors may depend on the specific requirements of the device or application they are intended for.
In terms of CPU cores and architecture, the Kirin 985 5G features a 1x 2.58 GHz Cortex-A76 core, 3x 2.4 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. On the other hand, the Dimensity 930 has a configuration of 2x 2.2 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. Both processors have 8 cores in total, offering efficient multitasking capabilities.
In relation to the instruction set, both processors utilize the ARMv8.2-A instruction set, ensuring compatibility with modern software and applications.
When it comes to lithography, the Kirin 985 5G is manufactured with a 7 nm process, while the Dimensity 930 boasts a smaller 6 nm lithography. A smaller lithography typically results in improved power efficiency and better performance.
In terms of thermal design power (TDP), the Kirin 985 5G consumes 6 watts, while the Dimensity 930 consumes a slightly higher 10 watts. Lower TDP values indicate better energy efficiency, which can contribute to longer battery life on devices powered by the Kirin 985 5G.
Regarding neural processing, the Kirin 985 5G employs the Ascend D110 Lite and Ascend D100 Tiny neural processors, utilizing the HUAWEI Da Vinci Architecture. The Dimensity 930, on the other hand, features an NPU for neural processing tasks.
In summary, the Kirin 985 5G and the Dimensity 930 differ in their CPU cores and architecture, lithography, TDP, and neural processing capabilities. The Kirin 985 5G offers a more diverse range of CPU cores and a smaller lithography, potentially leading to better performance and energy efficiency. However, the Dimensity 930 may excel in neural processing tasks with its dedicated NPU. Ultimately, the choice between these processors may depend on the specific requirements of the device or application they are intended for.
CPU cores and architecture
Architecture | 1x 2.58 GHz – Cortex-A76 3x 2.4 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
2x 2.2 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 6 nm |
TDP | 6 Watt | 10 Watt |
Neural Processing | Ascend D110 Lite + Ascend D100 Tiny, HUAWEI Da Vinci Architecture | NPU |
Memory (RAM)
Max amount | up to 12 GB | up to 16 GB |
Memory type | LPDDR4X | LPDDR5 |
Memory frequency | 2133 MHz | 3200 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 3.0 | UFS 3.1 |
Graphics
GPU name | Mali-G77 MP8 | Imagination PowerVR BXM-8-256 |
GPU Architecture | Valhall | Rogue |
GPU frequency | 700 MHz | 800 MHz |
Execution units | 8 | |
Shaders | 128 | |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 3.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3120x1440 | 2520x1080@120Hz |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 108MP, 1x 64MP |
Max Video Capture | 4K@30fp | 2K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.4 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.2 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 5.0 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2020 Quarter 2 | 2022 Quarter 3 |
Partnumber | Hi6290 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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