HiSilicon Kirin 985 5G vs HiSilicon Kirin 9000E 5G
The HiSilicon Kirin 985 5G and HiSilicon Kirin 9000E 5G are two processors manufactured by HiSilicon for mobile devices. Both processors offer excellent performance and power efficiency, but there are some notable differences in their specifications.
In terms of CPU cores and architecture, the Kirin 985 5G features a combination of Cortex-A76 and Cortex-A55 cores. It has one high-performance Cortex-A76 core running at 2.58 GHz, three Cortex-A76 cores clocked at 2.4 GHz, and four power-efficient Cortex-A55 cores operating at 1.84 GHz. On the other hand, the Kirin 9000E 5G offers a more powerful configuration with a Cortex-A77 core running at 3.13 GHz, three Cortex-A77 cores clocked at 2.54 GHz, and four Cortex-A55 cores operating at 2.05 GHz. This architecture difference suggests that the Kirin 9000E 5G could deliver superior single-core and multi-core performance compared to the Kirin 985 5G.
Another key difference lies in their lithography. The Kirin 985 5G is manufactured using a 7 nm process, while the Kirin 9000E 5G is built on a more advanced 5 nm process. The smaller lithography allows for more transistors to be packed into the same space, resulting in improved efficiency, reduced power consumption, and potentially better heat dissipation in the Kirin 9000E 5G.
Furthermore, the Kirin 985 5G utilizes the Ascend D110 Lite and Ascend D100 Tiny for neural processing tasks, employing the Huawei Da Vinci Architecture. On the other hand, the Kirin 9000E 5G employs the Ascend Lite and Ascend Tiny for neural processing, utilizing the upgraded Huawei Da Vinci Architecture 2.0. These differences in neural processing capabilities could impact the performance and efficiency of AI-related tasks on devices using these processors.
In conclusion, while both the HiSilicon Kirin 985 5G and Kirin 9000E 5G offer strong performance and power efficiency, the Kirin 9000E 5G appears to have the edge with its more powerful CPU configuration and smaller lithography, potentially delivering better overall performance. However, the specific requirements and optimizations of a device should also be considered when choosing between these two processors.
In terms of CPU cores and architecture, the Kirin 985 5G features a combination of Cortex-A76 and Cortex-A55 cores. It has one high-performance Cortex-A76 core running at 2.58 GHz, three Cortex-A76 cores clocked at 2.4 GHz, and four power-efficient Cortex-A55 cores operating at 1.84 GHz. On the other hand, the Kirin 9000E 5G offers a more powerful configuration with a Cortex-A77 core running at 3.13 GHz, three Cortex-A77 cores clocked at 2.54 GHz, and four Cortex-A55 cores operating at 2.05 GHz. This architecture difference suggests that the Kirin 9000E 5G could deliver superior single-core and multi-core performance compared to the Kirin 985 5G.
Another key difference lies in their lithography. The Kirin 985 5G is manufactured using a 7 nm process, while the Kirin 9000E 5G is built on a more advanced 5 nm process. The smaller lithography allows for more transistors to be packed into the same space, resulting in improved efficiency, reduced power consumption, and potentially better heat dissipation in the Kirin 9000E 5G.
Furthermore, the Kirin 985 5G utilizes the Ascend D110 Lite and Ascend D100 Tiny for neural processing tasks, employing the Huawei Da Vinci Architecture. On the other hand, the Kirin 9000E 5G employs the Ascend Lite and Ascend Tiny for neural processing, utilizing the upgraded Huawei Da Vinci Architecture 2.0. These differences in neural processing capabilities could impact the performance and efficiency of AI-related tasks on devices using these processors.
In conclusion, while both the HiSilicon Kirin 985 5G and Kirin 9000E 5G offer strong performance and power efficiency, the Kirin 9000E 5G appears to have the edge with its more powerful CPU configuration and smaller lithography, potentially delivering better overall performance. However, the specific requirements and optimizations of a device should also be considered when choosing between these two processors.
CPU cores and architecture
Architecture | 1x 2.58 GHz – Cortex-A76 3x 2.4 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 5 nm |
Number of transistors | 15300 million | |
TDP | 6 Watt | 6 Watt |
Neural Processing | Ascend D110 Lite + Ascend D100 Tiny, HUAWEI Da Vinci Architecture | Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 |
Memory (RAM)
Max amount | up to 12 GB | up to 16 GB |
Memory type | LPDDR4X | LPDDR5 |
Memory frequency | 2133 MHz | 2750 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 3.0 | UFS 3.1 |
Graphics
GPU name | Mali-G77 MP8 | Mali-G78 MP22 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 700 MHz | 760 MHz |
Execution units | 8 | 22 |
Shaders | 128 | 352 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3120x1440 | 3840x2160 |
Max camera resolution | 1x 48MP, 2x 20MP | |
Max Video Capture | 4K@30fp | 4K@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.4 Gbps | 4.6 Gbps |
Peak Upload Speed | 0.2 Gbps | 2.5 Gbps |
Wi-Fi | 5 (802.11ac) | 6 (802.11ax) |
Bluetooth | 5.0 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC |
Supplemental Information
Launch Date | 2020 Quarter 2 | 2020 October |
Partnumber | Hi6290 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Flagship |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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