HiSilicon Kirin 820 5G vs Unisoc Tiger T606
The HiSilicon Kirin 820 5G and Unisoc Tiger T606 are two processors with notable differences in their specifications.
Starting with the HiSilicon Kirin 820 5G, it features a powerful CPU architecture with a combination of cores. It includes 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. With a total of 8 cores, this processor offers a significant amount of processing power. Additionally, it utilizes ARMv8.2-A instruction set and offers a 7 nm lithography, which ensures efficient performance and power consumption. The TDP (Thermal Design Power) of this processor is 6 Watts, which further demonstrates its energy efficiency. It also includes neural processing capabilities with its Ascend D110 Lite and HUAWEI Da Vinci Architecture.
On the other hand, the Unisoc Tiger T606 has a different CPU architecture. It consists of 2x 1.6 GHz Cortex-A75 cores and 6x 1.6 GHz Cortex-A55 cores, bringing the total to 8 cores. While it shares the same ARMv8.2-A instruction set as the HiSilicon Kirin 820 5G, it has a larger lithography of 12 nm. This indicates that the Tiger T606 might not be as power-efficient as the Kirin 820 5G. Moreover, the TDP of this processor is 10 Watts, slightly higher than that of the Kirin 820 5G.
In summary, the HiSilicon Kirin 820 5G and Unisoc Tiger T606 processors differ in several key specifications. While both processors have 8 cores and utilize the ARMv8.2-A instruction set, they vary in terms of their CPU architecture, lithography, TDP, and power efficiency. The Kirin 820 5G boasts a more powerful and diverse CPU architecture, a smaller lithography, lower TDP, and improved energy efficiency compared to the Tiger T606. These specifications suggest that the Kirin 820 5G may offer better performance and power management capabilities compared to the Tiger T606.
Starting with the HiSilicon Kirin 820 5G, it features a powerful CPU architecture with a combination of cores. It includes 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. With a total of 8 cores, this processor offers a significant amount of processing power. Additionally, it utilizes ARMv8.2-A instruction set and offers a 7 nm lithography, which ensures efficient performance and power consumption. The TDP (Thermal Design Power) of this processor is 6 Watts, which further demonstrates its energy efficiency. It also includes neural processing capabilities with its Ascend D110 Lite and HUAWEI Da Vinci Architecture.
On the other hand, the Unisoc Tiger T606 has a different CPU architecture. It consists of 2x 1.6 GHz Cortex-A75 cores and 6x 1.6 GHz Cortex-A55 cores, bringing the total to 8 cores. While it shares the same ARMv8.2-A instruction set as the HiSilicon Kirin 820 5G, it has a larger lithography of 12 nm. This indicates that the Tiger T606 might not be as power-efficient as the Kirin 820 5G. Moreover, the TDP of this processor is 10 Watts, slightly higher than that of the Kirin 820 5G.
In summary, the HiSilicon Kirin 820 5G and Unisoc Tiger T606 processors differ in several key specifications. While both processors have 8 cores and utilize the ARMv8.2-A instruction set, they vary in terms of their CPU architecture, lithography, TDP, and power efficiency. The Kirin 820 5G boasts a more powerful and diverse CPU architecture, a smaller lithography, lower TDP, and improved energy efficiency compared to the Tiger T606. These specifications suggest that the Kirin 820 5G may offer better performance and power management capabilities compared to the Tiger T606.
CPU cores and architecture
Architecture | 1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
2x 1.6 GHz – Cortex-A75 6x 1.6 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 12 nm |
TDP | 6 Watt | 10 Watt |
Neural Processing | Ascend D110 Lite, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 12 GB | up to 8 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 1600 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G57 MP6 | Mali-G57 MP1 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 850 MHz | 650 MHz |
Execution units | 6 | 1 |
Shaders | 96 | 16 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 1600x900@90Hz | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 24MP, 16MP + 8MP |
Max Video Capture | 4K@30fps | FullHD@30fps |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.2 Gbps | 0.1 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 March | 2021 October |
Partnumber | T606 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Low-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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