HiSilicon Kirin 970 vs Unisoc Tiger T700
The HiSilicon Kirin 970 and the Unisoc Tiger T700 are two processors with different specifications.
Starting with the HiSilicon Kirin 970, it is equipped with an architecture consisting of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. This octa-core processor operates on the ARMv8-A instruction set and has a lithography of 10 nm. With 5500 million transistors, the Kirin 970 offers a powerful computing performance. It also includes the HiSilicon NPU for neural processing tasks. The TDP (Thermal Design Power) for this processor is 9 Watts, which indicates its power consumption level.
Moving on to the Unisoc Tiger T700, it features an architecture comprising of 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A5 cores. Similar to the Kirin 970, this processor is also octa-core with ARMv8.2-A instruction set support. However, it has a slightly larger lithography of 12 nm. With a TDP of 10 Watts, the Tiger T700 consumes a bit more power compared to the Kirin 970.
In terms of processing power, both processors offer varied capabilities. The Kirin 970's combination of A73 and A53 cores provide a good balance between performance and energy efficiency. Additionally, its neural processing unit enhances its capabilities for artificial intelligence and machine learning tasks. On the other hand, the Tiger T700's mix of A75 and A5 cores may not match the performance of the Kirin 970, but it still provides a decent level of processing power.
To summarize, both the HiSilicon Kirin 970 and Unisoc Tiger T700 processors have their own unique set of specifications. The Kirin 970 offers a more advanced lithography, a dedicated neural processing unit, and lower power consumption, whereas the Tiger T700 has a slightly higher TDP and a different mix of cores. When considering these processors for different applications, it is important to analyze their individual specifications and performance characteristics to make an informed decision.
Starting with the HiSilicon Kirin 970, it is equipped with an architecture consisting of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. This octa-core processor operates on the ARMv8-A instruction set and has a lithography of 10 nm. With 5500 million transistors, the Kirin 970 offers a powerful computing performance. It also includes the HiSilicon NPU for neural processing tasks. The TDP (Thermal Design Power) for this processor is 9 Watts, which indicates its power consumption level.
Moving on to the Unisoc Tiger T700, it features an architecture comprising of 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A5 cores. Similar to the Kirin 970, this processor is also octa-core with ARMv8.2-A instruction set support. However, it has a slightly larger lithography of 12 nm. With a TDP of 10 Watts, the Tiger T700 consumes a bit more power compared to the Kirin 970.
In terms of processing power, both processors offer varied capabilities. The Kirin 970's combination of A73 and A53 cores provide a good balance between performance and energy efficiency. Additionally, its neural processing unit enhances its capabilities for artificial intelligence and machine learning tasks. On the other hand, the Tiger T700's mix of A75 and A5 cores may not match the performance of the Kirin 970, but it still provides a decent level of processing power.
To summarize, both the HiSilicon Kirin 970 and Unisoc Tiger T700 processors have their own unique set of specifications. The Kirin 970 offers a more advanced lithography, a dedicated neural processing unit, and lower power consumption, whereas the Tiger T700 has a slightly higher TDP and a different mix of cores. When considering these processors for different applications, it is important to analyze their individual specifications and performance characteristics to make an informed decision.
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
2x 1.8 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A5 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 10 nm | 12 nm |
Number of transistors | 5500 million | |
TDP | 9 Watt | 10 Watt |
Neural Processing | HiSilicon NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 4 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 1866 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G72 MP12 | Mali-G52 MP2 |
GPU Architecture | Bifrost | Bifrost |
GPU frequency | 750 MHz | 850 MHz |
Execution units | 12 | 2 |
Shaders | 192 | 32 |
DirectX | 12 | 11 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2400x1080 |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 48MP |
Max Video Capture | 4K@30fps | FullHD@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.2 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2017 September | 2021 March |
Partnumber | Hi3670 | T700 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Low-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Qualcomm Snapdragon 680 vs Qualcomm Snapdragon 7 Gen 1
2
Qualcomm Snapdragon 6 Gen 1 vs Unisoc Tiger T710
3
Apple A16 Bionic vs HiSilicon Kirin 980
4
Samsung Exynos 1280 vs Qualcomm Snapdragon 8 Gen 1
5
Samsung Exynos 8895 vs Samsung Exynos 7884B
6
MediaTek Dimensity 1000 vs HiSilicon Kirin 930
7
HiSilicon Kirin 985 5G vs Qualcomm Snapdragon 821
8
Unisoc Tanggula T760 5G vs HiSilicon Kirin 9000E 5G
9
Samsung Exynos 2100 vs MediaTek Helio G85
10
MediaTek Dimensity 700 vs HiSilicon Kirin 810