HiSilicon Kirin 970 vs Unisoc SC7731E
The HiSilicon Kirin 970 and the Unisoc SC7731E are two processors with different specifications.
Starting with the HiSilicon Kirin 970, it is built with a 10 nm architecture and consists of 8 CPU cores. These cores are divided into two categories: 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. With an ARMv8-A instruction set, this processor offers compatibility with the latest technologies. Additionally, it has a staggering 5500 million transistors, which contributes to its high performance. The TDP (Thermal Design Power) of the Kirin 970 is 9 Watts, which indicates its power efficiency. Furthermore, it comes equipped with the HiSilicon NPU (Neural Processing Unit), which enhances its AI capabilities.
On the other hand, the Unisoc SC7731E has a 28 nm lithography and is comprised of 4 CPU cores. Specifically, it features 4x 1.3 GHz Cortex-A7 cores. The ARMv7-A instruction set is utilized by this processor, which restricts its compatibility to older technologies. With a TDP of 7 Watts, it exhibits decent power efficiency. However, the smaller number of cores and the lower clock speed make it less powerful compared to the Kirin 970.
In conclusion, the HiSilicon Kirin 970 surpasses the Unisoc SC7731E in terms of specifications. With its advanced architecture, higher number of cores, faster clock speeds, and support for newer technologies, the Kirin 970 provides superior performance. Moreover, the addition of the HiSilicon NPU enhances its AI processing capabilities, making it suitable for applications that require sophisticated neural processing. Meanwhile, the Unisoc SC7731E, while being power efficient, falls short in terms of core count and clock speed. It is better suited for budget-conscious devices or less demanding tasks.
Starting with the HiSilicon Kirin 970, it is built with a 10 nm architecture and consists of 8 CPU cores. These cores are divided into two categories: 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. With an ARMv8-A instruction set, this processor offers compatibility with the latest technologies. Additionally, it has a staggering 5500 million transistors, which contributes to its high performance. The TDP (Thermal Design Power) of the Kirin 970 is 9 Watts, which indicates its power efficiency. Furthermore, it comes equipped with the HiSilicon NPU (Neural Processing Unit), which enhances its AI capabilities.
On the other hand, the Unisoc SC7731E has a 28 nm lithography and is comprised of 4 CPU cores. Specifically, it features 4x 1.3 GHz Cortex-A7 cores. The ARMv7-A instruction set is utilized by this processor, which restricts its compatibility to older technologies. With a TDP of 7 Watts, it exhibits decent power efficiency. However, the smaller number of cores and the lower clock speed make it less powerful compared to the Kirin 970.
In conclusion, the HiSilicon Kirin 970 surpasses the Unisoc SC7731E in terms of specifications. With its advanced architecture, higher number of cores, faster clock speeds, and support for newer technologies, the Kirin 970 provides superior performance. Moreover, the addition of the HiSilicon NPU enhances its AI processing capabilities, making it suitable for applications that require sophisticated neural processing. Meanwhile, the Unisoc SC7731E, while being power efficient, falls short in terms of core count and clock speed. It is better suited for budget-conscious devices or less demanding tasks.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
4x 1.3 GHz – Cortex-A7 |
Number of cores | 8 | 4 |
Instruction Set | ARMv8-A | ARMv7-A |
Lithography | 10 nm | 28 nm |
Number of transistors | 5500 million | |
TDP | 9 Watt | 7 Watt |
Neural Processing | HiSilicon NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 1 GB |
Memory type | LPDDR4 | LPDDR3 |
Memory frequency | 1866 MHz | 533 MHz |
Memory-bus | 4x16 bit |
Storage
Storage specification | UFS 2.1 | eMMC 5.1 |
Graphics
GPU name | Mali-G72 MP12 | Mali-T820 MP1 |
GPU Architecture | Mali Bifrost | Mali Midgard |
GPU frequency | 750 MHz | 600 MHz |
Execution units | 12 | 1 |
Shaders | 192 | 4 |
DirectX | 12 | 11 |
OpenCL API | 2.0 | 1.2 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.0 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 1440x720 |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 8MP |
Max Video Capture | 4K@30fps | HD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.2 Gbps | |
Peak Upload Speed | 0.15 Gbps | |
Wi-Fi | 5 (802.11ac) | 4 (802.11n) |
Bluetooth | 4.2 | 4.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS GLONASS |
Supplemental Information
Launch Date | 2017 September | 2018 Quarter 2 |
Partnumber | Hi3670 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Low-end |
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