HiSilicon Kirin 970 vs Unisoc SC7731E

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The HiSilicon Kirin 970 and the Unisoc SC7731E are two processors with different specifications.

Starting with the HiSilicon Kirin 970, it is built with a 10 nm architecture and consists of 8 CPU cores. These cores are divided into two categories: 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. With an ARMv8-A instruction set, this processor offers compatibility with the latest technologies. Additionally, it has a staggering 5500 million transistors, which contributes to its high performance. The TDP (Thermal Design Power) of the Kirin 970 is 9 Watts, which indicates its power efficiency. Furthermore, it comes equipped with the HiSilicon NPU (Neural Processing Unit), which enhances its AI capabilities.

On the other hand, the Unisoc SC7731E has a 28 nm lithography and is comprised of 4 CPU cores. Specifically, it features 4x 1.3 GHz Cortex-A7 cores. The ARMv7-A instruction set is utilized by this processor, which restricts its compatibility to older technologies. With a TDP of 7 Watts, it exhibits decent power efficiency. However, the smaller number of cores and the lower clock speed make it less powerful compared to the Kirin 970.

In conclusion, the HiSilicon Kirin 970 surpasses the Unisoc SC7731E in terms of specifications. With its advanced architecture, higher number of cores, faster clock speeds, and support for newer technologies, the Kirin 970 provides superior performance. Moreover, the addition of the HiSilicon NPU enhances its AI processing capabilities, making it suitable for applications that require sophisticated neural processing. Meanwhile, the Unisoc SC7731E, while being power efficient, falls short in terms of core count and clock speed. It is better suited for budget-conscious devices or less demanding tasks.

CPU cores and architecture

Architecture 4x 2.4 GHz – Cortex-A73
4x 1.8 GHz – Cortex-A53
4x 1.3 GHz – Cortex-A7
Number of cores 8 4
Instruction Set ARMv8-A ARMv7-A
Lithography 10 nm 28 nm
Number of transistors 5500 million
TDP 9 Watt 7 Watt
Neural Processing HiSilicon NPU

Memory (RAM)

Max amount up to 8 GB up to 1 GB
Memory type LPDDR4 LPDDR3
Memory frequency 1866 MHz 533 MHz
Memory-bus 4x16 bit

Storage

Storage specification UFS 2.1 eMMC 5.1

Graphics

GPU name Mali-G72 MP12 Mali-T820 MP1
GPU Architecture Bifrost Midgard
GPU frequency 750 MHz 600 MHz
Execution units 12 1
Shaders 192 4
DirectX 12 11
OpenCL API 2.0 1.2
OpenGL API ES 3.2
Vulkan API 1.0 1.0

Camera, Video, Display

Max screen resolution 2340x1080 1440x720
Max camera resolution 1x 48MP, 2x 20MP 1x 8MP
Max Video Capture 4K@30fps HD@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.2 Gbps
Peak Upload Speed 0.15 Gbps
Wi-Fi 5 (802.11ac) 4 (802.11n)
Bluetooth 4.2 4.2
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
GLONASS

Supplemental Information

Launch Date 2017 September 2018 Quarter 2
Partnumber Hi3670
Vertical Segment Mobiles Mobiles
Positioning Flagship Low-end

AnTuTu 10

Total Score
Kirin 970
318577
SC7731E

GeekBench 6 Single-Core

Score
Kirin 970
389
SC7731E
88

GeekBench 6 Multi-Core

Score
Kirin 970
1502
SC7731E
411