HiSilicon Kirin 970 vs MediaTek Dimensity 900
When comparing the HiSilicon Kirin 970 and the MediaTek Dimensity 900 processors, there are several key specifications that differentiate the two.
Starting with the CPU cores and architecture, the Kirin 970 features a combination of 4 Cortex-A73 cores clocked at 2.4 GHz and 4 Cortex-A53 cores clocked at 1.8 GHz. On the other hand, the Dimensity 900 utilizes 2 Cortex-A78 cores clocked at 2.4 GHz and 6 Cortex-A55 cores clocked at 2.0 GHz. This means that the Dimensity 900 offers a slightly more powerful performance with its Cortex-A78 cores.
In terms of the number of cores, both processors feature 8 cores. However, the Kirin 970 employs ARMv8-A instruction set, while the Dimensity 900 utilizes the more advanced ARMv8.2-A instruction set. This indicates that the Dimensity 900 potentially offers improved efficiency and better compatibility with newer software.
Moving on to the lithography, the Kirin 970 is based on a 10 nm process, while the Dimensity 900 uses a more advanced 6 nm process. A smaller lithography generally leads to better power efficiency and thermal performance, implying that the Dimensity 900 may have an advantage in this aspect.
When it comes to the number of transistors, the Dimensity 900 boasts a significantly higher count of 10000 million, compared to the Kirin 970's 5500 million. More transistors typically indicate improved performance and capabilities.
In terms of power consumption, the Kirin 970 has a TDP (thermal design power) of 9 Watt, while the Dimensity 900 has a slightly higher TDP of 10 Watt. This suggests that the Kirin 970 may offer slightly better power efficiency.
Finally, both processors feature neural processing units (NPU) for AI-related tasks. The Kirin 970 has the HiSilicon NPU, whereas the Dimensity 900 simply has an NPU, without any specified brand. It is difficult to determine the specific differences in NPU performance without more detailed information.
In summary, while the Kirin 970 has a competent specification, the Dimensity 900 offers some advantages with its more powerful CPU cores, advanced instruction set, smaller lithography, higher number of transistors, and potentially better power efficiency. However, without considering real-world performance and actual usage scenarios, it is important to note that specifications alone may not paint a complete picture of a processor's capability.
Starting with the CPU cores and architecture, the Kirin 970 features a combination of 4 Cortex-A73 cores clocked at 2.4 GHz and 4 Cortex-A53 cores clocked at 1.8 GHz. On the other hand, the Dimensity 900 utilizes 2 Cortex-A78 cores clocked at 2.4 GHz and 6 Cortex-A55 cores clocked at 2.0 GHz. This means that the Dimensity 900 offers a slightly more powerful performance with its Cortex-A78 cores.
In terms of the number of cores, both processors feature 8 cores. However, the Kirin 970 employs ARMv8-A instruction set, while the Dimensity 900 utilizes the more advanced ARMv8.2-A instruction set. This indicates that the Dimensity 900 potentially offers improved efficiency and better compatibility with newer software.
Moving on to the lithography, the Kirin 970 is based on a 10 nm process, while the Dimensity 900 uses a more advanced 6 nm process. A smaller lithography generally leads to better power efficiency and thermal performance, implying that the Dimensity 900 may have an advantage in this aspect.
When it comes to the number of transistors, the Dimensity 900 boasts a significantly higher count of 10000 million, compared to the Kirin 970's 5500 million. More transistors typically indicate improved performance and capabilities.
In terms of power consumption, the Kirin 970 has a TDP (thermal design power) of 9 Watt, while the Dimensity 900 has a slightly higher TDP of 10 Watt. This suggests that the Kirin 970 may offer slightly better power efficiency.
Finally, both processors feature neural processing units (NPU) for AI-related tasks. The Kirin 970 has the HiSilicon NPU, whereas the Dimensity 900 simply has an NPU, without any specified brand. It is difficult to determine the specific differences in NPU performance without more detailed information.
In summary, while the Kirin 970 has a competent specification, the Dimensity 900 offers some advantages with its more powerful CPU cores, advanced instruction set, smaller lithography, higher number of transistors, and potentially better power efficiency. However, without considering real-world performance and actual usage scenarios, it is important to note that specifications alone may not paint a complete picture of a processor's capability.
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
2x 2.4 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 10 nm | 6 nm |
Number of transistors | 5500 million | 10000 million |
TDP | 9 Watt | 10 Watt |
Neural Processing | HiSilicon NPU | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR5 |
Memory frequency | 1866 MHz | 3200 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G72 MP12 | Mali-G68 MP4 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 750 MHz | 900 MHz |
Execution units | 12 | 4 |
Shaders | 192 | 64 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2520x1080@120Hz |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 108MP, 2x 20MP |
Max Video Capture | 4K@30fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.2 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 6 (802.11ax) |
Bluetooth | 4.2 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2017 September | 2021 Quarter 1 |
Partnumber | Hi3670 | MT6877 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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