HiSilicon Kirin 970 vs MediaTek Dimensity 900

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When comparing the HiSilicon Kirin 970 and the MediaTek Dimensity 900 processors, there are several key specifications that differentiate the two.

Starting with the CPU cores and architecture, the Kirin 970 features a combination of 4 Cortex-A73 cores clocked at 2.4 GHz and 4 Cortex-A53 cores clocked at 1.8 GHz. On the other hand, the Dimensity 900 utilizes 2 Cortex-A78 cores clocked at 2.4 GHz and 6 Cortex-A55 cores clocked at 2.0 GHz. This means that the Dimensity 900 offers a slightly more powerful performance with its Cortex-A78 cores.

In terms of the number of cores, both processors feature 8 cores. However, the Kirin 970 employs ARMv8-A instruction set, while the Dimensity 900 utilizes the more advanced ARMv8.2-A instruction set. This indicates that the Dimensity 900 potentially offers improved efficiency and better compatibility with newer software.

Moving on to the lithography, the Kirin 970 is based on a 10 nm process, while the Dimensity 900 uses a more advanced 6 nm process. A smaller lithography generally leads to better power efficiency and thermal performance, implying that the Dimensity 900 may have an advantage in this aspect.

When it comes to the number of transistors, the Dimensity 900 boasts a significantly higher count of 10000 million, compared to the Kirin 970's 5500 million. More transistors typically indicate improved performance and capabilities.

In terms of power consumption, the Kirin 970 has a TDP (thermal design power) of 9 Watt, while the Dimensity 900 has a slightly higher TDP of 10 Watt. This suggests that the Kirin 970 may offer slightly better power efficiency.

Finally, both processors feature neural processing units (NPU) for AI-related tasks. The Kirin 970 has the HiSilicon NPU, whereas the Dimensity 900 simply has an NPU, without any specified brand. It is difficult to determine the specific differences in NPU performance without more detailed information.

In summary, while the Kirin 970 has a competent specification, the Dimensity 900 offers some advantages with its more powerful CPU cores, advanced instruction set, smaller lithography, higher number of transistors, and potentially better power efficiency. However, without considering real-world performance and actual usage scenarios, it is important to note that specifications alone may not paint a complete picture of a processor's capability.

CPU cores and architecture

Architecture 4x 2.4 GHz – Cortex-A73
4x 1.8 GHz – Cortex-A53
2x 2.4 GHz – Cortex-A78
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 10 nm 6 nm
Number of transistors 5500 million 10000 million
TDP 9 Watt 10 Watt
Neural Processing HiSilicon NPU NPU

Memory (RAM)

Max amount up to 8 GB up to 16 GB
Memory type LPDDR4 LPDDR5
Memory frequency 1866 MHz 3200 MHz
Memory-bus 4x16 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 3.1

Graphics

GPU name Mali-G72 MP12 Mali-G68 MP4
GPU Architecture Bifrost Valhall
GPU frequency 750 MHz 900 MHz
Execution units 12 4
Shaders 192 64
DirectX 12 12
OpenCL API 2.0 2.0
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 20MP 1x 108MP, 2x 20MP
Max Video Capture 4K@30fps 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.2 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 5 (802.11ac) 6 (802.11ax)
Bluetooth 4.2 5.2
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2017 September 2021 Quarter 1
Partnumber Hi3670 MT6877
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 970
318577
Dimensity 900
435318

GeekBench 6 Single-Core

Score
Kirin 970
389
Dimensity 900
704

GeekBench 6 Multi-Core

Score
Kirin 970
1502
Dimensity 900
2139