HiSilicon Kirin 970 vs MediaTek Dimensity 700

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When comparing the HiSilicon Kirin 970 and the MediaTek Dimensity 700 processors, several key specifications can help determine their performance and capabilities.

Starting with the CPU cores and architecture, the Kirin 970 features a combination of four Cortex-A73 cores clocked at 2.4 GHz and four Cortex-A53 cores clocked at 1.8 GHz. In contrast, the Dimensity 700 utilizes two Cortex-A76 cores clocked at 2.2 GHz and six Cortex-A55 cores clocked at 2 GHz. In terms of the number of cores, both processors contain eight cores.

Moving on to instruction sets, the Kirin 970 supports ARMv8-A, while the Dimensity 700 supports the newer ARMv8.2-A. This distinction implies that the Dimensity 700 may have more advanced instructions and features compared to the Kirin 970.

Regarding lithography, the Kirin 970 is built on a 10 nm manufacturing process, whereas the Dimensity 700 is manufactured using a more advanced 7 nm process. A smaller lithography generally translates to better power efficiency and potentially higher performance due to a smaller transistor size. Speaking of transistors, the Kirin 970 packs around 5500 million transistors, while no information is available for the Dimensity 700.

When it comes to power consumption, the Kirin 970 has a thermal design power (TDP) rating of 9 Watts, slightly lower than the Dimensity 700's TDP of 10 Watts. This suggests that the Kirin 970 may be slightly more power-efficient, although the difference may be negligible.

One additional feature worth noting is the HiSilicon NPU (Neural Processing Unit), which the Kirin 970 incorporates. This specialized unit enhances the processor's capabilities for artificial intelligence and machine learning tasks, potentially giving it an advantage in these areas.

In summary, while the Kirin 970 and the Dimensity 700 processors share similarities, such as the number of cores and instruction sets, there are key differences in their CPU architectures, lithography, and power consumption. These discrepancies may impact their overall performance, power efficiency, and suitability for certain tasks or applications.

CPU cores and architecture

Architecture 4x 2.4 GHz – Cortex-A73
4x 1.8 GHz – Cortex-A53
2x 2.2 GHz – Cortex-A76
6x 2 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 10 nm 7 nm
Number of transistors 5500 million
TDP 9 Watt 10 Watt
Neural Processing HiSilicon NPU

Memory (RAM)

Max amount up to 8 GB up to 12 GB
Memory type LPDDR4 LPDDR4X
Memory frequency 1866 MHz 2133 MHz
Memory-bus 4x16 bit 2x16 bit

Storage

Storage specification UFS 2.1 UFS 2.2

Graphics

GPU name Mali-G72 MP12 Mali-G57 MP2
GPU Architecture Bifrost Valhall
GPU frequency 750 MHz 950 MHz
Execution units 12 2
Shaders 192 32
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080 2520x1080@90Hz
Max camera resolution 1x 48MP, 2x 20MP 1x 64MP, 2x 16MP
Max Video Capture 4K@30fps 2K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.2 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 5 (802.11ac) 5 (802.11ac)
Bluetooth 4.2 5.1
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2017 September 2021 Quarter 1
Partnumber Hi3670 MT6833V/ZA, MT6833V/NZA
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 970
318577
Dimensity 700
325860

GeekBench 6 Single-Core

Score
Kirin 970
389
Dimensity 700
531

GeekBench 6 Multi-Core

Score
Kirin 970
1502
Dimensity 700
1719