HiSilicon Kirin 970 vs HiSilicon Kirin 985 5G
The HiSilicon Kirin 970 and the HiSilicon Kirin 985 5G are both powerful processors manufactured by Huawei's semiconductor subsidiary, HiSilicon.
Starting with the HiSilicon Kirin 970, it features an architecture that consists of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. With a total of 8 cores, this processor provides a balanced performance suitable for a wide range of applications. It uses the ARMv8-A instruction set and is built on a 10nm lithography process, resulting in efficient power consumption. The Kirin 970 also boasts HiSilicon NPU (Neural Processing Unit) technology, which enhances artificial intelligence capabilities.
On the other hand, the HiSilicon Kirin 985 5G takes a step forward in terms of performance and technology. Its architecture consists of 1x 2.58 GHz Cortex-A76 core, 3x 2.4 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. With this combination, the Kirin 985 5G delivers both high-performance and power-efficient processing. It utilizes the ARMv8.2-A instruction set and is built on an even more advanced 7nm lithography process, resulting in even better power efficiency. The Kirin 985 5G also incorporates Huawei's own Ascend D110 Lite and Ascend D100 Tiny neural processing units, which are based on the HUAWEI Da Vinci Architecture. This advanced neural processing technology greatly enhances AI performance.
In terms of power consumption, the Kirin 985 5G has a lower thermal design power (TDP) of 6 Watts compared to the Kirin 970's 9 Watts. This means that the Kirin 985 5G is more power-efficient, allowing for longer battery life in devices that use it.
Overall, the HiSilicon Kirin 985 5G surpasses the Kirin 970 in terms of performance, power efficiency, and AI capabilities. With its advanced architecture, lower TDP, and advanced neural processing technologies, the Kirin 985 5G is well-suited for next-generation smartphones and other devices that require high-performance processing and AI capabilities.
Starting with the HiSilicon Kirin 970, it features an architecture that consists of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. With a total of 8 cores, this processor provides a balanced performance suitable for a wide range of applications. It uses the ARMv8-A instruction set and is built on a 10nm lithography process, resulting in efficient power consumption. The Kirin 970 also boasts HiSilicon NPU (Neural Processing Unit) technology, which enhances artificial intelligence capabilities.
On the other hand, the HiSilicon Kirin 985 5G takes a step forward in terms of performance and technology. Its architecture consists of 1x 2.58 GHz Cortex-A76 core, 3x 2.4 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. With this combination, the Kirin 985 5G delivers both high-performance and power-efficient processing. It utilizes the ARMv8.2-A instruction set and is built on an even more advanced 7nm lithography process, resulting in even better power efficiency. The Kirin 985 5G also incorporates Huawei's own Ascend D110 Lite and Ascend D100 Tiny neural processing units, which are based on the HUAWEI Da Vinci Architecture. This advanced neural processing technology greatly enhances AI performance.
In terms of power consumption, the Kirin 985 5G has a lower thermal design power (TDP) of 6 Watts compared to the Kirin 970's 9 Watts. This means that the Kirin 985 5G is more power-efficient, allowing for longer battery life in devices that use it.
Overall, the HiSilicon Kirin 985 5G surpasses the Kirin 970 in terms of performance, power efficiency, and AI capabilities. With its advanced architecture, lower TDP, and advanced neural processing technologies, the Kirin 985 5G is well-suited for next-generation smartphones and other devices that require high-performance processing and AI capabilities.
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
1x 2.58 GHz – Cortex-A76 3x 2.4 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 10 nm | 7 nm |
Number of transistors | 5500 million | |
TDP | 9 Watt | 6 Watt |
Neural Processing | HiSilicon NPU | Ascend D110 Lite + Ascend D100 Tiny, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 8 GB | up to 12 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.0 |
Graphics
GPU name | Mali-G72 MP12 | Mali-G77 MP8 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 750 MHz | 700 MHz |
Execution units | 12 | 8 |
Shaders | 192 | 128 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 3120x1440 |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 48MP, 2x 20MP |
Max Video Capture | 4K@30fps | 4K@30fp |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.2 Gbps | 1.4 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.2 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2017 September | 2020 Quarter 2 |
Partnumber | Hi3670 | Hi6290 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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