HiSilicon Kirin 970 vs HiSilicon Kirin 9000E 5G
The HiSilicon Kirin 970 and the HiSilicon Kirin 9000E 5G are two processors designed and developed by HiSilicon Technologies Co., Ltd. While both processors cater to different segments, they possess unique specifications that set them apart from each other.
Starting with the HiSilicon Kirin 970, it features a CPU architecture consisting of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. This octa-core processor operates on the ARMv8-A instruction set and has a lithography of 10 nm. With a total of 5500 million transistors, it delivers a balance between performance and power efficiency, with a TDP of 9 Watt. Additionally, it incorporates the HiSilicon NPU for neural processing tasks.
On the other hand, the HiSilicon Kirin 9000E 5G presents a more advanced CPU architecture. It has 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. Like its counterpart, it operates on the ARMv8.2-A instruction set but boasts a smaller lithography of 5 nm. With an impressive 15300 million transistors, it offers increased performance capabilities. Despite its enhanced performance, it maintains a lower TDP of 6 Watt. Furthermore, it incorporates Ascend Lite + Ascend Tiny and HUAWEI Da Vinci Architecture 2.0 for neural processing tasks.
In comparison, the HiSilicon Kirin 970 offers a balanced power-performance ratio suitable for a range of applications. It is ideal for smartphones, tablets, and other devices that require a processor that can handle everyday tasks efficiently. On the other hand, the HiSilicon Kirin 9000E 5G is built with a focus on advanced performance capabilities and cutting-edge technologies. It is well-suited for high-end smartphones, enabling them to handle intensive tasks such as gaming, multimedia, and AI processing seamlessly.
Both processors showcase HiSilicon's commitment to delivering state-of-the-art technologies in the semiconductor industry. Whether users are seeking a balance between power and efficiency or require top-tier performance, both processors provide viable options based on their specific needs. Overall, the HiSilicon Kirin 970 and HiSilicon Kirin 9000E 5G are impressive processors that cater to different segments while incorporating advanced features to enhance user experiences.
Starting with the HiSilicon Kirin 970, it features a CPU architecture consisting of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. This octa-core processor operates on the ARMv8-A instruction set and has a lithography of 10 nm. With a total of 5500 million transistors, it delivers a balance between performance and power efficiency, with a TDP of 9 Watt. Additionally, it incorporates the HiSilicon NPU for neural processing tasks.
On the other hand, the HiSilicon Kirin 9000E 5G presents a more advanced CPU architecture. It has 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. Like its counterpart, it operates on the ARMv8.2-A instruction set but boasts a smaller lithography of 5 nm. With an impressive 15300 million transistors, it offers increased performance capabilities. Despite its enhanced performance, it maintains a lower TDP of 6 Watt. Furthermore, it incorporates Ascend Lite + Ascend Tiny and HUAWEI Da Vinci Architecture 2.0 for neural processing tasks.
In comparison, the HiSilicon Kirin 970 offers a balanced power-performance ratio suitable for a range of applications. It is ideal for smartphones, tablets, and other devices that require a processor that can handle everyday tasks efficiently. On the other hand, the HiSilicon Kirin 9000E 5G is built with a focus on advanced performance capabilities and cutting-edge technologies. It is well-suited for high-end smartphones, enabling them to handle intensive tasks such as gaming, multimedia, and AI processing seamlessly.
Both processors showcase HiSilicon's commitment to delivering state-of-the-art technologies in the semiconductor industry. Whether users are seeking a balance between power and efficiency or require top-tier performance, both processors provide viable options based on their specific needs. Overall, the HiSilicon Kirin 970 and HiSilicon Kirin 9000E 5G are impressive processors that cater to different segments while incorporating advanced features to enhance user experiences.
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 10 nm | 5 nm |
Number of transistors | 5500 million | 15300 million |
TDP | 9 Watt | 6 Watt |
Neural Processing | HiSilicon NPU | Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 |
Memory (RAM)
Max amount | up to 8 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR5 |
Memory frequency | 1866 MHz | 2750 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G72 MP12 | Mali-G78 MP22 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 750 MHz | 760 MHz |
Execution units | 12 | 22 |
Shaders | 192 | 352 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 3840x2160 |
Max camera resolution | 1x 48MP, 2x 20MP | |
Max Video Capture | 4K@30fps | 4K@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.2 Gbps | 4.6 Gbps |
Peak Upload Speed | 0.15 Gbps | 2.5 Gbps |
Wi-Fi | 5 (802.11ac) | 6 (802.11ax) |
Bluetooth | 4.2 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC |
Supplemental Information
Launch Date | 2017 September | 2020 October |
Partnumber | Hi3670 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Flagship |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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