HiSilicon Kirin 935 vs Unisoc Tanggula T760 5G
Comparing the specifications of the HiSilicon Kirin 935 and Unisoc Tanggula T760 5G processors, several key differences stand out.
Regarding the CPU cores and architecture, both processors feature eight cores. However, the Kirin 935 architecture consists of four Cortex-A53 cores clocked at 2.2 GHz and four Cortex-A53 cores clocked at 1.5 GHz. On the other hand, the Tanggula T760 5G architecture includes four Cortex-A76 cores clocked at 2.2 GHz and four Cortex-A55 cores clocked at 1.8 GHz. This indicates that the Tanggula T760 5G has a more advanced architecture, with a mix of higher-performance Cortex-A76 cores.
Moving on to the instruction set, the Kirin 935 utilizes the ARMv8-A instruction set, while the Tanggula T760 5G employs the newer ARMv8.2-A instruction set. The latter is an upgrade, potentially offering improved performance and efficiency.
In terms of the lithography process, the Kirin 935 uses a 28 nm process, whereas the Tanggula T760 5G utilizes a more advanced 6 nm process. A smaller lithography process typically results in better efficiency and performance.
The Kirin 935 has 1000 million transistors, whereas there is no information available regarding the number of transistors in the Tanggula T760 5G. This could suggest that the Kirin 935 has a higher transistor count and potentially better overall performance.
Further, the Kirin 935 has a TDP (Thermal Design Power) of 7 Watts, whereas the Tanggula T760 5G boasts a lower TDP of 5 Watts. A lower TDP generally implies better power efficiency.
Lastly, the Tanggula T760 5G differentiates itself from the Kirin 935 by featuring a dedicated Neural Processing Unit (NPU). This suggests that the Tanggula T760 5G may offer better AI-related processing capabilities.
In summary, while the HiSilicon Kirin 935 is a capable processor with a decent configuration, the Unisoc Tanggula T760 5G surpasses it in several areas. With a more advanced architecture, a newer instruction set, a smaller lithography process, a potentially higher transistor count, a lower TDP, and the inclusion of an NPU, the Tanggula T760 5G appears to offer superior performance, power efficiency, and AI capabilities.
Regarding the CPU cores and architecture, both processors feature eight cores. However, the Kirin 935 architecture consists of four Cortex-A53 cores clocked at 2.2 GHz and four Cortex-A53 cores clocked at 1.5 GHz. On the other hand, the Tanggula T760 5G architecture includes four Cortex-A76 cores clocked at 2.2 GHz and four Cortex-A55 cores clocked at 1.8 GHz. This indicates that the Tanggula T760 5G has a more advanced architecture, with a mix of higher-performance Cortex-A76 cores.
Moving on to the instruction set, the Kirin 935 utilizes the ARMv8-A instruction set, while the Tanggula T760 5G employs the newer ARMv8.2-A instruction set. The latter is an upgrade, potentially offering improved performance and efficiency.
In terms of the lithography process, the Kirin 935 uses a 28 nm process, whereas the Tanggula T760 5G utilizes a more advanced 6 nm process. A smaller lithography process typically results in better efficiency and performance.
The Kirin 935 has 1000 million transistors, whereas there is no information available regarding the number of transistors in the Tanggula T760 5G. This could suggest that the Kirin 935 has a higher transistor count and potentially better overall performance.
Further, the Kirin 935 has a TDP (Thermal Design Power) of 7 Watts, whereas the Tanggula T760 5G boasts a lower TDP of 5 Watts. A lower TDP generally implies better power efficiency.
Lastly, the Tanggula T760 5G differentiates itself from the Kirin 935 by featuring a dedicated Neural Processing Unit (NPU). This suggests that the Tanggula T760 5G may offer better AI-related processing capabilities.
In summary, while the HiSilicon Kirin 935 is a capable processor with a decent configuration, the Unisoc Tanggula T760 5G surpasses it in several areas. With a more advanced architecture, a newer instruction set, a smaller lithography process, a potentially higher transistor count, a lower TDP, and the inclusion of an NPU, the Tanggula T760 5G appears to offer superior performance, power efficiency, and AI capabilities.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A53 4x 1.5 GHz – Cortex-A53 |
4x 2.2 GHz – Cortex-A76 4x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 28 nm | 6 nm |
Number of transistors | 1000 million | |
TDP | 7 Watt | 5 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 16 GB |
Memory type | LPDDR3 | LPDDR4X |
Memory frequency | 800 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 3.1 |
Graphics
GPU name | Mali-T628 MP4 | Mali-G57 MP6 |
GPU Architecture | Midgard | Valhall |
GPU frequency | 680 MHz | 850 MHz |
Execution units | 4 | 6 |
Shaders | 64 | 96 |
DirectX | 11 | 12 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2560x1600 | 2160x1080 |
Max camera resolution | 1x 20MP | 1x 64MP, 2x 24MP |
Max Video Capture | 4K@30fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 2.7 Gbps |
Peak Upload Speed | 0.05 Gbps | 1.5 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2015 Quarter 2 | 2021 February |
Partnumber | Hi3635 | T760 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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