HiSilicon Kirin 935 vs Unisoc Tanggula T760 5G

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Comparing the specifications of the HiSilicon Kirin 935 and Unisoc Tanggula T760 5G processors, several key differences stand out.

Regarding the CPU cores and architecture, both processors feature eight cores. However, the Kirin 935 architecture consists of four Cortex-A53 cores clocked at 2.2 GHz and four Cortex-A53 cores clocked at 1.5 GHz. On the other hand, the Tanggula T760 5G architecture includes four Cortex-A76 cores clocked at 2.2 GHz and four Cortex-A55 cores clocked at 1.8 GHz. This indicates that the Tanggula T760 5G has a more advanced architecture, with a mix of higher-performance Cortex-A76 cores.

Moving on to the instruction set, the Kirin 935 utilizes the ARMv8-A instruction set, while the Tanggula T760 5G employs the newer ARMv8.2-A instruction set. The latter is an upgrade, potentially offering improved performance and efficiency.

In terms of the lithography process, the Kirin 935 uses a 28 nm process, whereas the Tanggula T760 5G utilizes a more advanced 6 nm process. A smaller lithography process typically results in better efficiency and performance.

The Kirin 935 has 1000 million transistors, whereas there is no information available regarding the number of transistors in the Tanggula T760 5G. This could suggest that the Kirin 935 has a higher transistor count and potentially better overall performance.

Further, the Kirin 935 has a TDP (Thermal Design Power) of 7 Watts, whereas the Tanggula T760 5G boasts a lower TDP of 5 Watts. A lower TDP generally implies better power efficiency.

Lastly, the Tanggula T760 5G differentiates itself from the Kirin 935 by featuring a dedicated Neural Processing Unit (NPU). This suggests that the Tanggula T760 5G may offer better AI-related processing capabilities.

In summary, while the HiSilicon Kirin 935 is a capable processor with a decent configuration, the Unisoc Tanggula T760 5G surpasses it in several areas. With a more advanced architecture, a newer instruction set, a smaller lithography process, a potentially higher transistor count, a lower TDP, and the inclusion of an NPU, the Tanggula T760 5G appears to offer superior performance, power efficiency, and AI capabilities.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A53
4x 1.5 GHz – Cortex-A53
4x 2.2 GHz – Cortex-A76
4x 1.8 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 28 nm 6 nm
Number of transistors 1000 million
TDP 7 Watt 5 Watt
Neural Processing NPU

Memory (RAM)

Max amount up to 8 GB up to 16 GB
Memory type LPDDR3 LPDDR4X
Memory frequency 800 MHz 2133 MHz
Memory-bus 2x32 bit 4x16 bit

Storage

Storage specification UFS 2.0 UFS 3.1

Graphics

GPU name Mali-T628 MP4 Mali-G57 MP6
GPU Architecture Midgard Valhall
GPU frequency 680 MHz 850 MHz
Execution units 4 6
Shaders 64 96
DirectX 11 12
OpenCL API 1.2 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2560x1600 2160x1080
Max camera resolution 1x 20MP 1x 64MP, 2x 24MP
Max Video Capture 4K@30fps FullHD@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
H.264 (AVC)
H.265 (HEVC)

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.3 Gbps 2.7 Gbps
Peak Upload Speed 0.05 Gbps 1.5 Gbps
Wi-Fi 5 (802.11ac) 5 (802.11ac)
Bluetooth 4.2 5.0
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2015 Quarter 2 2021 February
Partnumber Hi3635 T760
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 935
Tanggula T760 5G
243570

GeekBench 6 Single-Core

Score
Kirin 935
Tanggula T760 5G
559

GeekBench 6 Multi-Core

Score
Kirin 935
Tanggula T760 5G
2249