HiSilicon Kirin 935 vs MediaTek Dimensity 920
The HiSilicon Kirin 935 and MediaTek Dimensity 920 are two processors with different specifications and capabilities.
In terms of CPU cores and architecture, the Kirin 935 has a combination of 4x 2.2 GHz Cortex-A53 cores and 4x 1.5 GHz Cortex-A53 cores. On the other hand, the Dimensity 920 features 2x 2.5 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. The Dimensity 920 has a more powerful Cortex-A78 core compared to the Kirin 935, which may result in better performance for certain tasks.
Both processors have 8 cores and support the ARMv8 instruction set, ensuring compatibility with modern applications and software.
In terms of lithography, the Kirin 935 utilizes a 28 nm process, while the Dimensity 920 takes advantage of a more advanced 6 nm process. A smaller lithography generally leads to better power efficiency and improved performance.
The number of transistors in the Kirin 935 is measured at 1000 million, whereas the Dimensity 920 does not provide this specific information. More transistors generally imply a more complex and powerful processor, but we cannot directly compare in this regard.
Regarding thermal design power (TDP), the Kirin 935 has a lower TDP of 7 Watts compared to the Dimensity 920's 10 Watt TDP. A lower TDP can result in less heat generation and better power efficiency, which could contribute to longer battery life.
One notable feature of the Dimensity 920 is its Neural Processing Unit (NPU), which is designed to enhance artificial intelligence (AI) processing. The Kirin 935 does not mention a dedicated NPU, so the Dimensity 920 might have an advantage in AI-related tasks.
In summary, the Dimensity 920 has a more powerful CPU with a mixture of higher-performing cores, a more advanced lithography process, and an additional NPU for AI processing. However, the Kirin 935 has a lower TDP and a larger number of transistors. The choice between these processors would ultimately depend on the specific requirements and priorities of the user or device.
In terms of CPU cores and architecture, the Kirin 935 has a combination of 4x 2.2 GHz Cortex-A53 cores and 4x 1.5 GHz Cortex-A53 cores. On the other hand, the Dimensity 920 features 2x 2.5 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. The Dimensity 920 has a more powerful Cortex-A78 core compared to the Kirin 935, which may result in better performance for certain tasks.
Both processors have 8 cores and support the ARMv8 instruction set, ensuring compatibility with modern applications and software.
In terms of lithography, the Kirin 935 utilizes a 28 nm process, while the Dimensity 920 takes advantage of a more advanced 6 nm process. A smaller lithography generally leads to better power efficiency and improved performance.
The number of transistors in the Kirin 935 is measured at 1000 million, whereas the Dimensity 920 does not provide this specific information. More transistors generally imply a more complex and powerful processor, but we cannot directly compare in this regard.
Regarding thermal design power (TDP), the Kirin 935 has a lower TDP of 7 Watts compared to the Dimensity 920's 10 Watt TDP. A lower TDP can result in less heat generation and better power efficiency, which could contribute to longer battery life.
One notable feature of the Dimensity 920 is its Neural Processing Unit (NPU), which is designed to enhance artificial intelligence (AI) processing. The Kirin 935 does not mention a dedicated NPU, so the Dimensity 920 might have an advantage in AI-related tasks.
In summary, the Dimensity 920 has a more powerful CPU with a mixture of higher-performing cores, a more advanced lithography process, and an additional NPU for AI processing. However, the Kirin 935 has a lower TDP and a larger number of transistors. The choice between these processors would ultimately depend on the specific requirements and priorities of the user or device.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A53 4x 1.5 GHz – Cortex-A53 |
2x 2.5 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 28 nm | 6 nm |
Number of transistors | 1000 million | |
TDP | 7 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 16 GB |
Memory type | LPDDR3 | LPDDR5 |
Memory frequency | 800 MHz | 3200 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 3.1 |
Graphics
GPU name | Mali-T628 MP4 | Mali-G68 MP4 |
GPU Architecture | Midgard | Valhall |
GPU frequency | 680 MHz | 950 MHz |
Execution units | 4 | 4 |
Shaders | 64 | 96 |
DirectX | 11 | 12 |
OpenCL API | 1.2 | 2.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2560x1600 | 2520x1080@120Hz |
Max camera resolution | 1x 20MP | 1x 108MP, 2x 20MP |
Max Video Capture | 4K@30fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.05 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 6 (802.11ax) |
Bluetooth | 4.2 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2015 Quarter 2 | 2021 Quarter 3 |
Partnumber | Hi3635 | MT6877T |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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