HiSilicon Kirin 810 vs MediaTek Dimensity 800U
The HiSilicon Kirin 810 and MediaTek Dimensity 800U are two processors that are often compared due to their similar specifications. Let's take a closer look at each processor's specifications to see how they differ.
Starting with the HiSilicon Kirin 810, it is built on a 7 nm lithography process and features 8 CPU cores. Its architecture consists of 2 Cortex-A76 cores clocked at 2.27 GHz and 6 Cortex-A55 cores clocked at 1.88 GHz. With the ARMv8.2-A instruction set, this processor offers efficient performance for various tasks. The Kirin 810 also boasts a Neural Processing Unit (NPU) called Ascend D100 Lite, which utilizes HUAWEI's Da Vinci Architecture for advanced AI processing. With a TDP of 5 Watts, it provides a balance between power and energy efficiency.
On the other hand, the MediaTek Dimensity 800U shares some similarities. It also utilizes the 7 nm lithography process and features 8 CPU cores. Its architecture comprises 2 Cortex-A76 cores clocked at a higher frequency of 2.4 GHz and 6 Cortex-A55 cores clocked at 2.0 GHz. Like the Kirin 810, it uses the ARMv8.2-A instruction set. However, the Dimensity 800U does not mention a specific NPU, only noting that it has an NPU for Neural Processing.
Based on these specifications, both processors offer excellent performance capabilities. The Kirin 810 has a wider range of CPU frequencies, which may provide better versatility for different tasks. Additionally, its dedicated NPU with HUAWEI's Da Vinci Architecture could lead to superior AI processing. On the other hand, the Dimensity 800U's higher clock speed for its Cortex-A76 cores suggests potentially better single-threaded performance.
In conclusion, while the HiSilicon Kirin 810 and MediaTek Dimensity 800U share many similarities in terms of lithography, CPU cores, and instruction set, there are slight differences in their architecture and neural processing capabilities. Users can consider their specific requirements and preferences to choose the processor that best suits their needs.
Starting with the HiSilicon Kirin 810, it is built on a 7 nm lithography process and features 8 CPU cores. Its architecture consists of 2 Cortex-A76 cores clocked at 2.27 GHz and 6 Cortex-A55 cores clocked at 1.88 GHz. With the ARMv8.2-A instruction set, this processor offers efficient performance for various tasks. The Kirin 810 also boasts a Neural Processing Unit (NPU) called Ascend D100 Lite, which utilizes HUAWEI's Da Vinci Architecture for advanced AI processing. With a TDP of 5 Watts, it provides a balance between power and energy efficiency.
On the other hand, the MediaTek Dimensity 800U shares some similarities. It also utilizes the 7 nm lithography process and features 8 CPU cores. Its architecture comprises 2 Cortex-A76 cores clocked at a higher frequency of 2.4 GHz and 6 Cortex-A55 cores clocked at 2.0 GHz. Like the Kirin 810, it uses the ARMv8.2-A instruction set. However, the Dimensity 800U does not mention a specific NPU, only noting that it has an NPU for Neural Processing.
Based on these specifications, both processors offer excellent performance capabilities. The Kirin 810 has a wider range of CPU frequencies, which may provide better versatility for different tasks. Additionally, its dedicated NPU with HUAWEI's Da Vinci Architecture could lead to superior AI processing. On the other hand, the Dimensity 800U's higher clock speed for its Cortex-A76 cores suggests potentially better single-threaded performance.
In conclusion, while the HiSilicon Kirin 810 and MediaTek Dimensity 800U share many similarities in terms of lithography, CPU cores, and instruction set, there are slight differences in their architecture and neural processing capabilities. Users can consider their specific requirements and preferences to choose the processor that best suits their needs.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
2x 2.4 GHz – Cortex-A76 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 7 nm |
Number of transistors | 6900 million | |
TDP | 5 Watt | |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 12 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G52 MP6 | Mali-G57 MP3 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 820 MHz | 850 MHz |
Execution units | 6 | 3 |
Shaders | 96 | 48 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 64MP, 1x 20MP + 1x 16MP |
Max Video Capture | FullHD@30fps | 4K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2019 Quarter 2 | 2020 Quarter 3 |
Partnumber | Hi6280 | MT6853V, MT6853V/TNZA, MT6853/TNZA, MT6853T |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
Popular comparisons:
1
Apple A14 Bionic vs MediaTek Dimensity 8020
2
HiSilicon Kirin 955 vs Google Tensor G3
3
Qualcomm Snapdragon 480 vs MediaTek Dimensity 800U
4
MediaTek Helio G95 vs Qualcomm Snapdragon 865
5
MediaTek Helio G90 vs Google Tensor G2
6
MediaTek Dimensity 1000L vs Qualcomm Snapdragon 865 Plus
7
Apple A15 Bionic vs Apple A10X Fusion
8
Qualcomm Snapdragon 730 vs HiSilicon Kirin 930
9
MediaTek Dimensity 6080 vs MediaTek Dimensity 900
10
Qualcomm Snapdragon 662 vs MediaTek Helio G96