HiSilicon Kirin 950 vs Unisoc Tiger T710
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The HiSilicon Kirin 950 and Unisoc Tiger T710 are two processors that offer different specifications and features. Let's compare them based on their specifications.
Starting with the HiSilicon Kirin 950, it is built on a 16nm lithography with 8 CPU cores. These cores are divided into two clusters, with 4 Cortex-A72 cores clocked at 2.4 GHz and 4 Cortex-A53 cores clocked at 1.8 GHz. This processor is based on the ARMv8-A instruction set and has a total of 2000 million transistors. The thermal design power (TDP) of the Kirin 950 is 5 Watt.
On the other hand, the Unisoc Tiger T710 is built on a more advanced 12nm lithography. It also features 8 CPU cores divided into two clusters, with 4 Cortex-A75 cores and 4 Cortex-A55 cores, both clocked at 1.8 GHz. The T710 processor is based on the ARMv8.2-A instruction set. Notably, it also includes dual neural processing units (NPUs), which can greatly enhance AI and machine learning capabilities.
In terms of architecture, both processors have a similar arrangement of CPU cores, but the Unisoc Tiger T710 utilizes the more recent Cortex-A75 and Cortex-A55 cores compared to the Kirin 950's Cortex-A72 and Cortex-A53 cores. This suggests that the T710 may offer better performance and power efficiency.
The lithography also differs between the two processors, with the Unisoc Tiger T710 being built on a more efficient 12nm process compared to the Kirin 950's 16nm process. This could result in improved power efficiency and potentially better thermal performance.
Additionally, the Unisoc Tiger T710 stands out with its inclusion of dual NPUs. These dedicated units can significantly enhance AI-related tasks, such as image recognition, speech processing, and real-time translations.
In conclusion, both the HiSilicon Kirin 950 and Unisoc Tiger T710 have their own strengths and weaknesses. While the Kirin 950 offers a higher TDP and an older CPU core architecture, the Tiger T710 boasts a more advanced lithography process and the inclusion of dual NPUs. Ultimately, the choice between the two processors would depend on the specific requirements and priorities of the user or device.
Starting with the HiSilicon Kirin 950, it is built on a 16nm lithography with 8 CPU cores. These cores are divided into two clusters, with 4 Cortex-A72 cores clocked at 2.4 GHz and 4 Cortex-A53 cores clocked at 1.8 GHz. This processor is based on the ARMv8-A instruction set and has a total of 2000 million transistors. The thermal design power (TDP) of the Kirin 950 is 5 Watt.
On the other hand, the Unisoc Tiger T710 is built on a more advanced 12nm lithography. It also features 8 CPU cores divided into two clusters, with 4 Cortex-A75 cores and 4 Cortex-A55 cores, both clocked at 1.8 GHz. The T710 processor is based on the ARMv8.2-A instruction set. Notably, it also includes dual neural processing units (NPUs), which can greatly enhance AI and machine learning capabilities.
In terms of architecture, both processors have a similar arrangement of CPU cores, but the Unisoc Tiger T710 utilizes the more recent Cortex-A75 and Cortex-A55 cores compared to the Kirin 950's Cortex-A72 and Cortex-A53 cores. This suggests that the T710 may offer better performance and power efficiency.
The lithography also differs between the two processors, with the Unisoc Tiger T710 being built on a more efficient 12nm process compared to the Kirin 950's 16nm process. This could result in improved power efficiency and potentially better thermal performance.
Additionally, the Unisoc Tiger T710 stands out with its inclusion of dual NPUs. These dedicated units can significantly enhance AI-related tasks, such as image recognition, speech processing, and real-time translations.
In conclusion, both the HiSilicon Kirin 950 and Unisoc Tiger T710 have their own strengths and weaknesses. While the Kirin 950 offers a higher TDP and an older CPU core architecture, the Tiger T710 boasts a more advanced lithography process and the inclusion of dual NPUs. Ultimately, the choice between the two processors would depend on the specific requirements and priorities of the user or device.
CPU cores and architecture
| Architecture | 4x 2.4 GHz – Cortex-A72 4x 1.8 GHz – Cortex-A53 |
4x 1.8 GHz – Cortex-A75 4x 1.8 GHz – Cortex-A55 |
| Number of cores | 8 | 8 |
| Instruction Set | ARMv8-A | ARMv8.2-A |
| Lithography | 16 nm | 12 nm |
| Number of transistors | 2000 million | |
| TDP | 5 Watt | |
| Neural Processing | Dual NPU |
Memory (RAM)
| Max amount | up to 4 GB | up to 8 GB |
| Memory type | LPDDR4 | LPDDR4X |
| Memory frequency | 1333 MHz | 1866 MHz |
| Memory-bus | 2x32 bit |
Storage
| Storage specification | UFS 2.0 | UFS 2.1 |
Graphics
| GPU name | Mali-T880 MP4 | Imagination PowerVR GM9446 |
| GPU Architecture | Midgard | Rogue |
| GPU frequency | 900 MHz | 800 MHz |
| Execution units | 4 | |
| Shaders | 64 | |
| DirectX | 11.2 | |
| OpenCL API | 1.2 | 4.0 |
| OpenGL API | ES 3.2 | |
| Vulkan API | 1.0 | 1.1 |
Camera, Video, Display
| Max camera resolution | 1x 31MP, 2x 13MP | 1x 24MP |
| Max Video Capture | FullHD@60fps | 4K@30fps |
| Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
| 4G network | Yes | Yes |
| 5G network | Yes | Yes |
| Peak Download Speed | 0.3 Gbps | 0.3 Gbps |
| Peak Upload Speed | 0.05 Gbps | 0.1 Gbps |
| Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
| Bluetooth | 4.2 | 5.0 |
| Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
| Launch Date | 2015 November | 2019 |
| Partnumber | Hi3650 | T710 |
| Vertical Segment | Mobiles | Mobiles |
| Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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