MediaTek Dimensity 800 vs MediaTek Dimensity 900
The MediaTek Dimensity 800 and Dimensity 900 are two processors that offer powerful performance for mobile devices. Let's compare their specifications to see how they differ.
Starting with the MediaTek Dimensity 800, it has a CPU architecture consisting of 4x 2.0 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. This architecture allows for a balanced performance and power efficiency. It operates on the ARMv8.2-A instruction set and has a lithography of 7 nm, which means it is manufactured using a more advanced process resulting in better efficiency and performance. Additionally, it has a TDP (Thermal Design Power) of 10 Watt, ensuring it can deliver sustained performance without overheating. It also includes a Neural Processing Unit (NPU) for improved AI capabilities.
Moving on to the MediaTek Dimensity 900, it has a more advanced CPU architecture. It consists of 2x 2.4 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. This architecture offers even higher performance, especially for demanding tasks. Similar to the Dimensity 800, it operates on the ARMv8.2-A instruction set and has a TDP of 10 Watt. However, the Dimensity 900 has a smaller lithography of 6 nm, which suggests improved efficiency and power consumption. It also boasts an impressive number of transistors, with 10000 million, indicating enhanced processing capabilities. Like the Dimensity 800, it includes an NPU for AI tasks.
In summary, while both processors deliver excellent performance, the MediaTek Dimensity 900 offers some notable upgrades compared to the Dimensity 800. It features a more advanced CPU architecture with higher frequency cores, a smaller lithography process, and a significant increase in the number of transistors. These improvements result in improved processing speeds, power efficiency, and overall performance, making the Dimensity 900 an attractive choice for high-performance mobile devices.
Starting with the MediaTek Dimensity 800, it has a CPU architecture consisting of 4x 2.0 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. This architecture allows for a balanced performance and power efficiency. It operates on the ARMv8.2-A instruction set and has a lithography of 7 nm, which means it is manufactured using a more advanced process resulting in better efficiency and performance. Additionally, it has a TDP (Thermal Design Power) of 10 Watt, ensuring it can deliver sustained performance without overheating. It also includes a Neural Processing Unit (NPU) for improved AI capabilities.
Moving on to the MediaTek Dimensity 900, it has a more advanced CPU architecture. It consists of 2x 2.4 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. This architecture offers even higher performance, especially for demanding tasks. Similar to the Dimensity 800, it operates on the ARMv8.2-A instruction set and has a TDP of 10 Watt. However, the Dimensity 900 has a smaller lithography of 6 nm, which suggests improved efficiency and power consumption. It also boasts an impressive number of transistors, with 10000 million, indicating enhanced processing capabilities. Like the Dimensity 800, it includes an NPU for AI tasks.
In summary, while both processors deliver excellent performance, the MediaTek Dimensity 900 offers some notable upgrades compared to the Dimensity 800. It features a more advanced CPU architecture with higher frequency cores, a smaller lithography process, and a significant increase in the number of transistors. These improvements result in improved processing speeds, power efficiency, and overall performance, making the Dimensity 900 an attractive choice for high-performance mobile devices.
CPU cores and architecture
Architecture | 4x 2.0 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
2x 2.4 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 4 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 6 nm |
Number of transistors | 10000 million | |
TDP | 10 Watt | 10 Watt |
Neural Processing | NPU | NPU |
Memory (RAM)
Max amount | up to 16 GB | up to 16 GB |
Memory type | LPDDR4X | LPDDR5 |
Memory frequency | 2133 MHz | 3200 MHz |
Memory-bus | 2x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.2 | UFS 3.1 |
Graphics
GPU name | Mali-G57 MP4 | Mali-G68 MP4 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 650 MHz | 900 MHz |
Execution units | 4 | 4 |
Shaders | 64 | 64 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | 2520x1080@120Hz |
Max camera resolution | 1x 80MP, 1x 32MP + 1x 16MP | 1x 108MP, 2x 20MP |
Max Video Capture | 4K@30FPS | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 2.77 Gbps | 2.77 Gbps |
Peak Upload Speed | 1.2 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 6 (802.11ax) |
Bluetooth | 5.1 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS QZSS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2020 Quarter 2 | 2021 Quarter 1 |
Partnumber | MT6873, MT6873V | MT6877 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Samsung Exynos 7880 vs Qualcomm Snapdragon 6 Gen 1
2
MediaTek Dimensity 700 vs Apple A17 Pro
3
Unisoc Tanggula T740 5G vs Qualcomm Snapdragon 690
4
MediaTek Dimensity 900 vs MediaTek Dimensity 1000L
5
MediaTek Helio G35 vs MediaTek Helio P65
6
MediaTek Helio G25 vs MediaTek Helio G80
7
HiSilicon Kirin 985 5G vs Qualcomm Snapdragon 8 Gen 1
8
Unisoc Tiger T616 vs Qualcomm Snapdragon 778G
9
MediaTek Dimensity 6100 Plus vs MediaTek Helio G85
10
MediaTek Dimensity 8000 vs Qualcomm Snapdragon 765G