HiSilicon Kirin 935 vs HiSilicon Kirin 970

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The HiSilicon Kirin 935 and the HiSilicon Kirin 970 are two processors produced by HiSilicon, a semiconductor company owned by Huawei Technologies. These processors are commonly used in smartphones and other mobile devices. Here, we will compare the specifications of both processors.

Starting with the HiSilicon Kirin 935, it features an architecture that consists of 4 Cortex-A53 cores clocked at 2.2 GHz and another 4 Cortex-A53 cores clocked at 1.5 GHz. With a total of 8 cores, this processor provides a good balance between performance and power efficiency. The instruction set used is ARMv8-A, which is the latest version of the ARM architecture. It is manufactured using a 28 nm process and contains approximately 1000 million transistors. The power consumption, or thermal design power (TDP), of this processor is 7 watts.

Moving on to the HiSilicon Kirin 970, it showcases an improved architecture compared to its predecessor. It utilizes 4 Cortex-A73 cores clocked at 2.4 GHz and 4 Cortex-A53 cores clocked at 1.8 GHz. This architecture offers better performance with higher clock speeds on the A73 cores. Like the Kirin 935, it also comes with 8 cores and uses the ARMv8-A instruction set. However, the Kirin 970 has a smaller lithography process of 10 nm, allowing for improved power efficiency and reduced heat generation. It contains a significantly higher number of transistors, around 5500 million, indicating enhanced processing capabilities. The TDP of the Kirin 970 is slightly higher than its predecessor at 9 watts. Additionally, this processor comes equipped with the HiSilicon NPU, which stands for Neural Processing Unit. This dedicated AI chip enhances the processor's capability to handle artificial intelligence tasks efficiently.

In summary, the Kirin 970 boasts better performance and power efficiency compared to the Kirin 935. It utilizes a more advanced architecture, smaller lithography, and a larger number of transistors. Additionally, the Kirin 970 includes the HiSilicon NPU, providing better AI processing capabilities. Overall, the Kirin 970 is a significant upgrade in terms of specifications and is likely to deliver improved performance in real-world usage scenarios.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A53
4x 1.5 GHz – Cortex-A53
4x 2.4 GHz – Cortex-A73
4x 1.8 GHz – Cortex-A53
Number of cores 8 8
Instruction Set ARMv8-A ARMv8-A
Lithography 28 nm 10 nm
Number of transistors 1000 million 5500 million
TDP 7 Watt 9 Watt
Neural Processing HiSilicon NPU

Memory (RAM)

Max amount up to 8 GB up to 8 GB
Memory type LPDDR3 LPDDR4
Memory frequency 800 MHz 1866 MHz
Memory-bus 2x32 bit 4x16 bit

Storage

Storage specification UFS 2.0 UFS 2.1

Graphics

GPU name Mali-T628 MP4 Mali-G72 MP12
GPU Architecture Midgard Bifrost
GPU frequency 680 MHz 750 MHz
Execution units 4 12
Shaders 64 192
DirectX 11 12
OpenCL API 1.2 2.0
Vulkan API 1.0 1.0

Camera, Video, Display

Max screen resolution 2560x1600 2340x1080
Max camera resolution 1x 20MP 1x 48MP, 2x 20MP
Max Video Capture 4K@30fps 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
H.264 (AVC)
H.265 (HEVC)
VP8
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.3 Gbps 1.2 Gbps
Peak Upload Speed 0.05 Gbps 0.15 Gbps
Wi-Fi 5 (802.11ac) 5 (802.11ac)
Bluetooth 4.2 4.2
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2015 Quarter 2 2017 September
Partnumber Hi3635 Hi3670
Vertical Segment Mobiles Mobiles
Positioning Mid-end Flagship

AnTuTu 10

Total Score
Kirin 935
Kirin 970
318577

GeekBench 6 Single-Core

Score
Kirin 935
Kirin 970
389

GeekBench 6 Multi-Core

Score
Kirin 935
Kirin 970
1502