HiSilicon Kirin 9000E 5G vs MediaTek Dimensity 700
When comparing the specifications of the HiSilicon Kirin 9000E 5G and the MediaTek Dimensity 700 processors, several key differences can be identified.
Starting with the CPU cores and architecture, the HiSilicon Kirin 9000E 5G features a more advanced configuration. It consists of 1x 3.13 GHz Cortex-A77, 3x 2.54 GHz Cortex-A77, and 4x 2.05 GHz Cortex-A55 cores. On the other hand, the MediaTek Dimensity 700 processor has 2x 2.2 GHz Cortex-A76 and 6x 2 GHz Cortex-A55 cores. The HiSilicon Kirin 9000E 5G's architecture seems to offer a higher performance potential due to its higher clock speeds.
Both processors have 8 cores and utilize the ARMv8.2-A instruction set. However, there is a notable difference in their lithography. The HiSilicon Kirin 9000E 5G has a lithography of 5 nm, which indicates a more advanced manufacturing process compared to the MediaTek Dimensity 700's 7 nm lithography. This suggests that the HiSilicon Kirin 9000E 5G may have better power efficiency and potentially higher performance.
In terms of power consumption, the HiSilicon Kirin 9000E 5G has a TDP (Thermal Design Power) of 6 Watts, while the MediaTek Dimensity 700 has a TDP of 10 Watts. A lower TDP typically indicates better power efficiency, which can be advantageous for prolonged battery life and reduced heat generation.
One additional specification worth mentioning is the neural processing capabilities. The HiSilicon Kirin 9000E 5G incorporates Ascend Lite + Ascend Tiny and HUAWEI Da Vinci Architecture 2.0 for its neural processing tasks. Unfortunately, the MediaTek Dimensity 700's neural processing capabilities are not provided in the specifications.
In conclusion, while both processors have similar core counts and instruction sets, the HiSilicon Kirin 9000E 5G differentiates itself with its advanced architecture, lower lithography, lower TDP, and specified neural processing capabilities. These specifications suggest that the HiSilicon Kirin 9000E 5G could potentially offer higher overall performance and improved power efficiency compared to the MediaTek Dimensity 700. However, real-world performance and user experience depend on various factors beyond specifications and should be considered when evaluating the processors for specific applications and use cases.
Starting with the CPU cores and architecture, the HiSilicon Kirin 9000E 5G features a more advanced configuration. It consists of 1x 3.13 GHz Cortex-A77, 3x 2.54 GHz Cortex-A77, and 4x 2.05 GHz Cortex-A55 cores. On the other hand, the MediaTek Dimensity 700 processor has 2x 2.2 GHz Cortex-A76 and 6x 2 GHz Cortex-A55 cores. The HiSilicon Kirin 9000E 5G's architecture seems to offer a higher performance potential due to its higher clock speeds.
Both processors have 8 cores and utilize the ARMv8.2-A instruction set. However, there is a notable difference in their lithography. The HiSilicon Kirin 9000E 5G has a lithography of 5 nm, which indicates a more advanced manufacturing process compared to the MediaTek Dimensity 700's 7 nm lithography. This suggests that the HiSilicon Kirin 9000E 5G may have better power efficiency and potentially higher performance.
In terms of power consumption, the HiSilicon Kirin 9000E 5G has a TDP (Thermal Design Power) of 6 Watts, while the MediaTek Dimensity 700 has a TDP of 10 Watts. A lower TDP typically indicates better power efficiency, which can be advantageous for prolonged battery life and reduced heat generation.
One additional specification worth mentioning is the neural processing capabilities. The HiSilicon Kirin 9000E 5G incorporates Ascend Lite + Ascend Tiny and HUAWEI Da Vinci Architecture 2.0 for its neural processing tasks. Unfortunately, the MediaTek Dimensity 700's neural processing capabilities are not provided in the specifications.
In conclusion, while both processors have similar core counts and instruction sets, the HiSilicon Kirin 9000E 5G differentiates itself with its advanced architecture, lower lithography, lower TDP, and specified neural processing capabilities. These specifications suggest that the HiSilicon Kirin 9000E 5G could potentially offer higher overall performance and improved power efficiency compared to the MediaTek Dimensity 700. However, real-world performance and user experience depend on various factors beyond specifications and should be considered when evaluating the processors for specific applications and use cases.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
| Architecture | 1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 |
| Number of cores | 8 | 8 |
| Instruction Set | ARMv8.2-A | ARMv8.2-A |
| Lithography | 5 nm | 7 nm |
| Number of transistors | 15300 million | |
| TDP | 6 Watt | 10 Watt |
| Neural Processing | Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 |
Memory (RAM)
| Max amount | up to 16 GB | up to 12 GB |
| Memory type | LPDDR5 | LPDDR4X |
| Memory frequency | 2750 MHz | 2133 MHz |
| Memory-bus | 4x16 bit | 2x16 bit |
Storage
| Storage specification | UFS 3.1 | UFS 2.2 |
Graphics
| GPU name | Mali-G78 MP22 | Mali-G57 MP2 |
| GPU Architecture | Mali Valhall | Mali Valhall |
| GPU frequency | 760 MHz | 950 MHz |
| Execution units | 22 | 2 |
| Shaders | 352 | 32 |
| DirectX | 12 | 12 |
| OpenCL API | 2.1 | 2.1 |
| OpenGL API | ES 3.2 | ES 3.2 |
| Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
| Max screen resolution | 3840x2160 | 2520x1080@90Hz |
| Max camera resolution | 1x 64MP, 2x 16MP | |
| Max Video Capture | 4K@60fps | 2K@30FPS |
| Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
| 4G network | Yes | Yes |
| 5G network | Yes | Yes |
| Peak Download Speed | 4.6 Gbps | 2.77 Gbps |
| Peak Upload Speed | 2.5 Gbps | 1.2 Gbps |
| Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
| Bluetooth | 5.2 | 5.1 |
| Satellite navigation | BeiDou GPS Galileo GLONASS NavIC |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
| Launch Date | 2020 October | 2021 Quarter 1 |
| Partnumber | MT6833V/ZA, MT6833V/NZA | |
| Vertical Segment | Mobiles | Mobiles |
| Positioning | Flagship | Mid-end |
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