HiSilicon Kirin 9000E 5G vs MediaTek Dimensity 700

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When comparing the specifications of the HiSilicon Kirin 9000E 5G and the MediaTek Dimensity 700 processors, several key differences can be identified.

Starting with the CPU cores and architecture, the HiSilicon Kirin 9000E 5G features a more advanced configuration. It consists of 1x 3.13 GHz Cortex-A77, 3x 2.54 GHz Cortex-A77, and 4x 2.05 GHz Cortex-A55 cores. On the other hand, the MediaTek Dimensity 700 processor has 2x 2.2 GHz Cortex-A76 and 6x 2 GHz Cortex-A55 cores. The HiSilicon Kirin 9000E 5G's architecture seems to offer a higher performance potential due to its higher clock speeds.

Both processors have 8 cores and utilize the ARMv8.2-A instruction set. However, there is a notable difference in their lithography. The HiSilicon Kirin 9000E 5G has a lithography of 5 nm, which indicates a more advanced manufacturing process compared to the MediaTek Dimensity 700's 7 nm lithography. This suggests that the HiSilicon Kirin 9000E 5G may have better power efficiency and potentially higher performance.

In terms of power consumption, the HiSilicon Kirin 9000E 5G has a TDP (Thermal Design Power) of 6 Watts, while the MediaTek Dimensity 700 has a TDP of 10 Watts. A lower TDP typically indicates better power efficiency, which can be advantageous for prolonged battery life and reduced heat generation.

One additional specification worth mentioning is the neural processing capabilities. The HiSilicon Kirin 9000E 5G incorporates Ascend Lite + Ascend Tiny and HUAWEI Da Vinci Architecture 2.0 for its neural processing tasks. Unfortunately, the MediaTek Dimensity 700's neural processing capabilities are not provided in the specifications.

In conclusion, while both processors have similar core counts and instruction sets, the HiSilicon Kirin 9000E 5G differentiates itself with its advanced architecture, lower lithography, lower TDP, and specified neural processing capabilities. These specifications suggest that the HiSilicon Kirin 9000E 5G could potentially offer higher overall performance and improved power efficiency compared to the MediaTek Dimensity 700. However, real-world performance and user experience depend on various factors beyond specifications and should be considered when evaluating the processors for specific applications and use cases.

CPU cores and architecture

Architecture 1x 3.13 GHz – Cortex-A77
3x 2.54 GHz – Cortex-A77
4x 2.05 GHz – Cortex-A55
2x 2.2 GHz – Cortex-A76
6x 2 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 5 nm 7 nm
Number of transistors 15300 million
TDP 6 Watt 10 Watt
Neural Processing Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0

Memory (RAM)

Max amount up to 16 GB up to 12 GB
Memory type LPDDR5 LPDDR4X
Memory frequency 2750 MHz 2133 MHz
Memory-bus 4x16 bit 2x16 bit

Storage

Storage specification UFS 3.1 UFS 2.2

Graphics

GPU name Mali-G78 MP22 Mali-G57 MP2
GPU Architecture Valhall Valhall
GPU frequency 760 MHz 950 MHz
Execution units 22 2
Shaders 352 32
DirectX 12 12
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 3840x2160 2520x1080@90Hz
Max camera resolution 1x 64MP, 2x 16MP
Max Video Capture 4K@60fps 2K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 4.6 Gbps 2.77 Gbps
Peak Upload Speed 2.5 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.2 5.1
Satellite navigation BeiDou
GPS
Galileo
GLONASS
NavIC
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2020 October 2021 Quarter 1
Partnumber MT6833V/ZA, MT6833V/NZA
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 9000E 5G
737022
Dimensity 700
325860

GeekBench 6 Single-Core

Score
Kirin 9000E 5G
1059
Dimensity 700
531

GeekBench 6 Multi-Core

Score
Kirin 9000E 5G
3702
Dimensity 700
1719