HiSilicon Kirin 955 vs MediaTek Dimensity 900
The HiSilicon Kirin 955 and MediaTek Dimensity 900 are two processors with different specifications. Starting with the CPU cores and architecture, the Kirin 955 has 4x 2.5 GHz Cortex-A72 cores and 4x 1.8 GHz Cortex-A53 cores, while the Dimensity 900 has 2x 2.4 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores.
Both processors have 8 cores and support the ARMv8 instruction set. However, the Kirin 955 has a higher lithography of 16 nm compared to the Dimensity 900 which has a smaller 6 nm lithography. This means that the Dimensity 900 is manufactured with a more advanced and efficient process.
In terms of the number of transistors, the Kirin 955 has 2000 million transistors, while the Dimensity 900 boasts a much higher number of 10,000 million transistors. This implies that the Dimensity 900 processor may be more powerful and efficient in handling complex tasks.
Furthermore, the power consumption differs between the two processors. The Kirin 955 has a lower TDP (Thermal Design Power) of 5 Watts, indicating that it consumes less power and generates less heat. On the other hand, the Dimensity 900 has a higher TDP of 10 Watts, which suggests that it may consume more power and generate more heat.
Additionally, the Dimensity 900 stands out with its Neural Processing Unit (NPU), which the Kirin 955 lacks. The NPU enables advanced AI and machine learning capabilities, which can enhance various applications such as image recognition and voice assistants.
In conclusion, the HiSilicon Kirin 955 and MediaTek Dimensity 900 processors have noticeable differences in their specifications. While the Kirin 955 has a higher lithography and lower transistor count, the Dimensity 900 offers more processing power with its advanced architecture and higher number of transistors. Moreover, the Dimensity 900 introduces an NPU for AI capabilities, which is absent in the Kirin 955. Ultimately, the choice between these processors would depend on the specific requirements and priorities of the user or device.
Both processors have 8 cores and support the ARMv8 instruction set. However, the Kirin 955 has a higher lithography of 16 nm compared to the Dimensity 900 which has a smaller 6 nm lithography. This means that the Dimensity 900 is manufactured with a more advanced and efficient process.
In terms of the number of transistors, the Kirin 955 has 2000 million transistors, while the Dimensity 900 boasts a much higher number of 10,000 million transistors. This implies that the Dimensity 900 processor may be more powerful and efficient in handling complex tasks.
Furthermore, the power consumption differs between the two processors. The Kirin 955 has a lower TDP (Thermal Design Power) of 5 Watts, indicating that it consumes less power and generates less heat. On the other hand, the Dimensity 900 has a higher TDP of 10 Watts, which suggests that it may consume more power and generate more heat.
Additionally, the Dimensity 900 stands out with its Neural Processing Unit (NPU), which the Kirin 955 lacks. The NPU enables advanced AI and machine learning capabilities, which can enhance various applications such as image recognition and voice assistants.
In conclusion, the HiSilicon Kirin 955 and MediaTek Dimensity 900 processors have noticeable differences in their specifications. While the Kirin 955 has a higher lithography and lower transistor count, the Dimensity 900 offers more processing power with its advanced architecture and higher number of transistors. Moreover, the Dimensity 900 introduces an NPU for AI capabilities, which is absent in the Kirin 955. Ultimately, the choice between these processors would depend on the specific requirements and priorities of the user or device.
CPU cores and architecture
Architecture | 4x 2.5 GHz – Cortex-A72 4x 1.8 GHz – Cortex-A53 |
2x 2.4 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 16 nm | 6 nm |
Number of transistors | 2000 million | 10000 million |
TDP | 5 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 4 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR5 |
Memory frequency | 1333 MHz | 3200 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 3.1 |
Graphics
GPU name | Mali-T880 MP4 | Mali-G68 MP4 |
GPU Architecture | Midgard | Valhall |
GPU frequency | 900 MHz | 900 MHz |
Execution units | 4 | 4 |
Shaders | 64 | 64 |
DirectX | 11.2 | 12 |
OpenCL API | 1.2 | 2.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | |
Max camera resolution | 1x 31MP, 2x 13MP | 1x 108MP, 2x 20MP |
Max Video Capture | FullHD@60fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.05 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 6 (802.11ax) |
Bluetooth | 4.2 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2016 April | 2021 Quarter 1 |
Partnumber | Hi3655 | MT6877 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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