HiSilicon Kirin 955 vs MediaTek Dimensity 900

The HiSilicon Kirin 955 and MediaTek Dimensity 900 are two processors with different specifications. Starting with the CPU cores and architecture, the Kirin 955 has 4x 2.5 GHz Cortex-A72 cores and 4x 1.8 GHz Cortex-A53 cores, while the Dimensity 900 has 2x 2.4 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores.

Both processors have 8 cores and support the ARMv8 instruction set. However, the Kirin 955 has a higher lithography of 16 nm compared to the Dimensity 900 which has a smaller 6 nm lithography. This means that the Dimensity 900 is manufactured with a more advanced and efficient process.

In terms of the number of transistors, the Kirin 955 has 2000 million transistors, while the Dimensity 900 boasts a much higher number of 10,000 million transistors. This implies that the Dimensity 900 processor may be more powerful and efficient in handling complex tasks.

Furthermore, the power consumption differs between the two processors. The Kirin 955 has a lower TDP (Thermal Design Power) of 5 Watts, indicating that it consumes less power and generates less heat. On the other hand, the Dimensity 900 has a higher TDP of 10 Watts, which suggests that it may consume more power and generate more heat.

Additionally, the Dimensity 900 stands out with its Neural Processing Unit (NPU), which the Kirin 955 lacks. The NPU enables advanced AI and machine learning capabilities, which can enhance various applications such as image recognition and voice assistants.

In conclusion, the HiSilicon Kirin 955 and MediaTek Dimensity 900 processors have noticeable differences in their specifications. While the Kirin 955 has a higher lithography and lower transistor count, the Dimensity 900 offers more processing power with its advanced architecture and higher number of transistors. Moreover, the Dimensity 900 introduces an NPU for AI capabilities, which is absent in the Kirin 955. Ultimately, the choice between these processors would depend on the specific requirements and priorities of the user or device.

CPU cores and architecture

Architecture 4x 2.5 GHz – Cortex-A72
4x 1.8 GHz – Cortex-A53
2x 2.4 GHz – Cortex-A78
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 16 nm 6 nm
Number of transistors 2000 million 10000 million
TDP 5 Watt 10 Watt
Neural Processing NPU

Memory (RAM)

Max amount up to 4 GB up to 16 GB
Memory type LPDDR4 LPDDR5
Memory frequency 1333 MHz 3200 MHz
Memory-bus 2x32 bit 4x16 bit


Storage specification UFS 2.0 UFS 3.1


GPU name Mali-T880 MP4 Mali-G68 MP4
GPU Architecture Midgard Valhall
GPU frequency 900 MHz 900 MHz
Execution units 4 4
Shaders 64 64
DirectX 11.2 12
OpenCL API 1.2 2.0
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2520x1080@120Hz
Max camera resolution 1x 31MP, 2x 13MP 1x 108MP, 2x 20MP
Max Video Capture FullHD@60fps 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
H.264 (AVC)
H.265 (HEVC)


4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.3 Gbps 2.77 Gbps
Peak Upload Speed 0.05 Gbps 1.2 Gbps
Wi-Fi 5 (802.11ac) 6 (802.11ax)
Bluetooth 4.2 5.2
Satellite navigation BeiDou

Supplemental Information

Launch Date 2016 April 2021 Quarter 1
Partnumber Hi3655 MT6877
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 955
Dimensity 900

GeekBench 6 Single-Core

Kirin 955
Dimensity 900

GeekBench 6 Multi-Core

Kirin 955
Dimensity 900