HiSilicon Kirin 820 5G vs Unisoc Tiger T610
The HiSilicon Kirin 820 5G and Unisoc Tiger T610 are two processors used in mobile devices that can be compared based on their specifications.
Starting with the HiSilicon Kirin 820 5G, it features a combination of CPU cores and architecture. It includes 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. This array of cores allows for a balanced performance, with the powerful Cortex-A76 cores handling demanding tasks and the energy-efficient Cortex-A55 cores handling lighter tasks. The architecture is based on ARMv8.2-A instruction set, offering compatibility with modern applications. The Kirin 820 5G is manufactured using a 7 nm lithography process, which ensures better power efficiency and performance compared to larger lithography processes. The TDP (Thermal Design Power) of this processor is 6 Watt, indicating its low power consumption. Additionally, it incorporates the Ascend D110 Lite and HUAWEI Da Vinci Architecture for neural processing, enhancing artificial intelligence capabilities.
Moving on to the Unisoc Tiger T610, it also consists of 8 CPU cores and an ARMv8.2-A instruction set. The architecture comprises 2x 1.8 GHz Cortex-A75 and 6x 1.8 GHz Cortex-A55 cores. While it has fewer powerful Cortex-A75 cores compared to the Kirin 820 5G, it compensates with a higher number of Cortex-A55 cores to handle multitasking efficiently. The Tiger T610 is produced using a 12 nm lithography process, which is slightly larger than the Kirin 820 5G. Consequently, it may exhibit slightly higher power consumption. The TDP of this processor is rated at 10 Watt.
In summary, the HiSilicon Kirin 820 5G and Unisoc Tiger T610 possess similarities and differences in their specifications. While both processors consist of 8 CPU cores, the Kirin 820 5G offers a more diverse core configuration and is manufactured using a smaller lithography process. On the other hand, the Tiger T610 compensates for its fewer powerful cores with a higher number of energy-efficient cores. Both processors have their strengths and weaknesses, and the choice between them would depend on the specific requirements and priorities of the device or application.
Starting with the HiSilicon Kirin 820 5G, it features a combination of CPU cores and architecture. It includes 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. This array of cores allows for a balanced performance, with the powerful Cortex-A76 cores handling demanding tasks and the energy-efficient Cortex-A55 cores handling lighter tasks. The architecture is based on ARMv8.2-A instruction set, offering compatibility with modern applications. The Kirin 820 5G is manufactured using a 7 nm lithography process, which ensures better power efficiency and performance compared to larger lithography processes. The TDP (Thermal Design Power) of this processor is 6 Watt, indicating its low power consumption. Additionally, it incorporates the Ascend D110 Lite and HUAWEI Da Vinci Architecture for neural processing, enhancing artificial intelligence capabilities.
Moving on to the Unisoc Tiger T610, it also consists of 8 CPU cores and an ARMv8.2-A instruction set. The architecture comprises 2x 1.8 GHz Cortex-A75 and 6x 1.8 GHz Cortex-A55 cores. While it has fewer powerful Cortex-A75 cores compared to the Kirin 820 5G, it compensates with a higher number of Cortex-A55 cores to handle multitasking efficiently. The Tiger T610 is produced using a 12 nm lithography process, which is slightly larger than the Kirin 820 5G. Consequently, it may exhibit slightly higher power consumption. The TDP of this processor is rated at 10 Watt.
In summary, the HiSilicon Kirin 820 5G and Unisoc Tiger T610 possess similarities and differences in their specifications. While both processors consist of 8 CPU cores, the Kirin 820 5G offers a more diverse core configuration and is manufactured using a smaller lithography process. On the other hand, the Tiger T610 compensates for its fewer powerful cores with a higher number of energy-efficient cores. Both processors have their strengths and weaknesses, and the choice between them would depend on the specific requirements and priorities of the device or application.
CPU cores and architecture
Architecture | 1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
2x 1.8 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 12 nm |
TDP | 6 Watt | 10 Watt |
Neural Processing | Ascend D110 Lite, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 12 GB | up to 6 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 1600 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | eMMC 5.1 |
Graphics
GPU name | Mali-G57 MP6 | Mali-G52 MP2 |
GPU Architecture | Valhall | Bifrost |
GPU frequency | 850 MHz | 614.4 MHz |
Execution units | 6 | 2 |
Shaders | 96 | 32 |
DirectX | 12 | 11 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2400x1080 | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 32MP |
Max Video Capture | 4K@30fps | FullHD@60fps |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.2 Gbps | 0.1 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 March | 2019 June |
Partnumber | T610 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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