HiSilicon Kirin 820 5G vs Unisoc Tiger T610

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The HiSilicon Kirin 820 5G and Unisoc Tiger T610 are two processors used in mobile devices that can be compared based on their specifications.

Starting with the HiSilicon Kirin 820 5G, it features a combination of CPU cores and architecture. It includes 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. This array of cores allows for a balanced performance, with the powerful Cortex-A76 cores handling demanding tasks and the energy-efficient Cortex-A55 cores handling lighter tasks. The architecture is based on ARMv8.2-A instruction set, offering compatibility with modern applications. The Kirin 820 5G is manufactured using a 7 nm lithography process, which ensures better power efficiency and performance compared to larger lithography processes. The TDP (Thermal Design Power) of this processor is 6 Watt, indicating its low power consumption. Additionally, it incorporates the Ascend D110 Lite and HUAWEI Da Vinci Architecture for neural processing, enhancing artificial intelligence capabilities.

Moving on to the Unisoc Tiger T610, it also consists of 8 CPU cores and an ARMv8.2-A instruction set. The architecture comprises 2x 1.8 GHz Cortex-A75 and 6x 1.8 GHz Cortex-A55 cores. While it has fewer powerful Cortex-A75 cores compared to the Kirin 820 5G, it compensates with a higher number of Cortex-A55 cores to handle multitasking efficiently. The Tiger T610 is produced using a 12 nm lithography process, which is slightly larger than the Kirin 820 5G. Consequently, it may exhibit slightly higher power consumption. The TDP of this processor is rated at 10 Watt.

In summary, the HiSilicon Kirin 820 5G and Unisoc Tiger T610 possess similarities and differences in their specifications. While both processors consist of 8 CPU cores, the Kirin 820 5G offers a more diverse core configuration and is manufactured using a smaller lithography process. On the other hand, the Tiger T610 compensates for its fewer powerful cores with a higher number of energy-efficient cores. Both processors have their strengths and weaknesses, and the choice between them would depend on the specific requirements and priorities of the device or application.

CPU cores and architecture

Architecture 1x 2.36 GHz – Cortex-A76
3x 2.22 GHz – Cortex-A76
4x 1.84 GHz – Cortex-A55
2x 1.8 GHz – Cortex-A75
6x 1.8 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 12 nm
TDP 6 Watt 10 Watt
Neural Processing Ascend D110 Lite, HUAWEI Da Vinci Architecture

Memory (RAM)

Max amount up to 12 GB up to 6 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 1600 MHz
Memory-bus 4x16 bit 2x16 bit

Storage

Storage specification UFS 2.1 eMMC 5.1

Graphics

GPU name Mali-G57 MP6 Mali-G52 MP2
GPU Architecture Valhall Bifrost
GPU frequency 850 MHz 614.4 MHz
Execution units 6 2
Shaders 96 32
DirectX 12 11
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 2400x1080
Max camera resolution 1x 48MP, 2x 20MP 1x 32MP
Max Video Capture 4K@30fps FullHD@60fps
Video codec support AV1
H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.6 Gbps 0.3 Gbps
Peak Upload Speed 0.2 Gbps 0.1 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.1 5.0
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2020 March 2019 June
Partnumber T610
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 820 5G
387656
Tiger T610
198303

GeekBench 6 Single-Core

Score
Kirin 820 5G
640
Tiger T610
355

GeekBench 6 Multi-Core

Score
Kirin 820 5G
2436
Tiger T610
1398