HiSilicon Kirin 820 5G vs Unisoc Tanggula T760 5G

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The HiSilicon Kirin 820 5G and the Unisoc Tanggula T760 5G are two processors that offer impressive specifications. Let's compare their key features.

In terms of CPU cores and architecture, the HiSilicon Kirin 820 5G boasts a 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. On the other hand, the Unisoc Tanggula T760 5G features 4x 2.2 GHz Cortex-A76 cores and 4x 1.8 GHz Cortex-A55 cores. Both processors have 8 cores in total, providing ample power for a variety of tasks.

Considering the instruction set, both processors utilize ARMv8.2-A, ensuring compatibility with modern software and applications. This means that users can enjoy a smooth and efficient experience when running various programs on devices powered by these processors.

Moving on to the lithography, the HiSilicon Kirin 820 5G adopts a 7 nm design, while the Unisoc Tanggula T760 5G utilizes a slightly more advanced 6 nm lithography. This finer lithography allows for greater power efficiency and improved performance.

When it comes to the thermal design power (TDP), the HiSilicon Kirin 820 5G consumes 6 watts, while the Unisoc Tanggula T760 5G operates at 5 watts. A lower TDP indicates better power efficiency, which can lead to longer battery life for devices using these processors.

Regarding neural processing, the HiSilicon Kirin 820 5G incorporates the Ascend D110 Lite and HUAWEI Da Vinci Architecture. On the other hand, the Unisoc Tanggula T760 5G features its own Neural Processing Unit (NPU). Neural processing units enhance artificial intelligence capabilities, enabling devices to perform tasks like facial recognition and image processing more efficiently.

In summary, both the HiSilicon Kirin 820 5G and Unisoc Tanggula T760 5G offer impressive specifications. The HiSilicon Kirin 820 5G shines with its diverse CPU cores and advanced neural processing capabilities, while the Unisoc Tanggula T760 5G stands out with its slightly more advanced lithography and lower TDP. Ultimately, the choice between these processors depends on the specific needs and preferences of the user.

CPU cores and architecture

Architecture	1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55	4x 2.2 GHz – Cortex-A76 4x 1.8 GHz – Cortex-A55
Number of cores	8	8
Instruction Set	ARMv8.2-A	ARMv8.2-A
Lithography	7 nm	6 nm
TDP	6 Watt	5 Watt
Neural Processing	Ascend D110 Lite, HUAWEI Da Vinci Architecture	NPU

Memory (RAM)

Max amount	up to 12 GB	up to 16 GB
Memory type	LPDDR4X	LPDDR4X
Memory frequency	2133 MHz	2133 MHz
Memory-bus	4x16 bit	4x16 bit

Storage

Storage specification

UFS 2.1

UFS 3.1

Graphics

GPU name	Mali-G57 MP6	Mali-G57 MP6
GPU Architecture	Valhall	Valhall
GPU frequency	850 MHz	850 MHz
Execution units	6	6
Shaders	96	96
DirectX	12	12
OpenCL API	2.1	2.1
OpenGL API	ES 3.2	ES 3.2
Vulkan API	1.2	1.2

Camera, Video, Display

Max screen resolution		2160x1080
Max camera resolution	1x 48MP, 2x 20MP	1x 64MP, 2x 24MP
Max Video Capture	4K@30fps	FullHD@30fps
Video codec support	AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9	H.264 (AVC) H.265 (HEVC)

Wireless

4G network	Yes	Yes
5G network	Yes	Yes
Peak Download Speed	1.6 Gbps	2.7 Gbps
Peak Upload Speed	0.2 Gbps	1.5 Gbps
Wi-Fi	6 (802.11ax)	5 (802.11ac)
Bluetooth	5.1	5.0
Satellite navigation	BeiDou GPS GLONASS	BeiDou GPS Galileo GLONASS