HiSilicon Kirin 820 5G vs Unisoc Tanggula T760 5G

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The HiSilicon Kirin 820 5G and the Unisoc Tanggula T760 5G are two processors that offer impressive specifications. Let's compare their key features.

In terms of CPU cores and architecture, the HiSilicon Kirin 820 5G boasts a 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. On the other hand, the Unisoc Tanggula T760 5G features 4x 2.2 GHz Cortex-A76 cores and 4x 1.8 GHz Cortex-A55 cores. Both processors have 8 cores in total, providing ample power for a variety of tasks.

Considering the instruction set, both processors utilize ARMv8.2-A, ensuring compatibility with modern software and applications. This means that users can enjoy a smooth and efficient experience when running various programs on devices powered by these processors.

Moving on to the lithography, the HiSilicon Kirin 820 5G adopts a 7 nm design, while the Unisoc Tanggula T760 5G utilizes a slightly more advanced 6 nm lithography. This finer lithography allows for greater power efficiency and improved performance.

When it comes to the thermal design power (TDP), the HiSilicon Kirin 820 5G consumes 6 watts, while the Unisoc Tanggula T760 5G operates at 5 watts. A lower TDP indicates better power efficiency, which can lead to longer battery life for devices using these processors.

Regarding neural processing, the HiSilicon Kirin 820 5G incorporates the Ascend D110 Lite and HUAWEI Da Vinci Architecture. On the other hand, the Unisoc Tanggula T760 5G features its own Neural Processing Unit (NPU). Neural processing units enhance artificial intelligence capabilities, enabling devices to perform tasks like facial recognition and image processing more efficiently.

In summary, both the HiSilicon Kirin 820 5G and Unisoc Tanggula T760 5G offer impressive specifications. The HiSilicon Kirin 820 5G shines with its diverse CPU cores and advanced neural processing capabilities, while the Unisoc Tanggula T760 5G stands out with its slightly more advanced lithography and lower TDP. Ultimately, the choice between these processors depends on the specific needs and preferences of the user.

CPU cores and architecture

Architecture 1x 2.36 GHz – Cortex-A76
3x 2.22 GHz – Cortex-A76
4x 1.84 GHz – Cortex-A55
4x 2.2 GHz – Cortex-A76
4x 1.8 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 6 nm
TDP 6 Watt 5 Watt
Neural Processing Ascend D110 Lite, HUAWEI Da Vinci Architecture NPU

Memory (RAM)

Max amount up to 12 GB up to 16 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 2133 MHz
Memory-bus 4x16 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 3.1

Graphics

GPU name Mali-G57 MP6 Mali-G57 MP6
GPU Architecture Valhall Valhall
GPU frequency 850 MHz 850 MHz
Execution units 6 6
Shaders 96 96
DirectX 12 12
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 2160x1080
Max camera resolution 1x 48MP, 2x 20MP 1x 64MP, 2x 24MP
Max Video Capture 4K@30fps FullHD@30fps
Video codec support AV1
H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.6 Gbps 2.7 Gbps
Peak Upload Speed 0.2 Gbps 1.5 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.1 5.0
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2020 March 2021 February
Partnumber T760
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 820 5G
387656
Tanggula T760 5G
243570

GeekBench 6 Single-Core

Score
Kirin 820 5G
640
Tanggula T760 5G
559

GeekBench 6 Multi-Core

Score
Kirin 820 5G
2436
Tanggula T760 5G
2249