HiSilicon Kirin 820 5G vs Unisoc Tanggula T760 5G
The HiSilicon Kirin 820 5G and the Unisoc Tanggula T760 5G are two processors that offer impressive specifications. Let's compare their key features.
In terms of CPU cores and architecture, the HiSilicon Kirin 820 5G boasts a 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. On the other hand, the Unisoc Tanggula T760 5G features 4x 2.2 GHz Cortex-A76 cores and 4x 1.8 GHz Cortex-A55 cores. Both processors have 8 cores in total, providing ample power for a variety of tasks.
Considering the instruction set, both processors utilize ARMv8.2-A, ensuring compatibility with modern software and applications. This means that users can enjoy a smooth and efficient experience when running various programs on devices powered by these processors.
Moving on to the lithography, the HiSilicon Kirin 820 5G adopts a 7 nm design, while the Unisoc Tanggula T760 5G utilizes a slightly more advanced 6 nm lithography. This finer lithography allows for greater power efficiency and improved performance.
When it comes to the thermal design power (TDP), the HiSilicon Kirin 820 5G consumes 6 watts, while the Unisoc Tanggula T760 5G operates at 5 watts. A lower TDP indicates better power efficiency, which can lead to longer battery life for devices using these processors.
Regarding neural processing, the HiSilicon Kirin 820 5G incorporates the Ascend D110 Lite and HUAWEI Da Vinci Architecture. On the other hand, the Unisoc Tanggula T760 5G features its own Neural Processing Unit (NPU). Neural processing units enhance artificial intelligence capabilities, enabling devices to perform tasks like facial recognition and image processing more efficiently.
In summary, both the HiSilicon Kirin 820 5G and Unisoc Tanggula T760 5G offer impressive specifications. The HiSilicon Kirin 820 5G shines with its diverse CPU cores and advanced neural processing capabilities, while the Unisoc Tanggula T760 5G stands out with its slightly more advanced lithography and lower TDP. Ultimately, the choice between these processors depends on the specific needs and preferences of the user.
In terms of CPU cores and architecture, the HiSilicon Kirin 820 5G boasts a 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. On the other hand, the Unisoc Tanggula T760 5G features 4x 2.2 GHz Cortex-A76 cores and 4x 1.8 GHz Cortex-A55 cores. Both processors have 8 cores in total, providing ample power for a variety of tasks.
Considering the instruction set, both processors utilize ARMv8.2-A, ensuring compatibility with modern software and applications. This means that users can enjoy a smooth and efficient experience when running various programs on devices powered by these processors.
Moving on to the lithography, the HiSilicon Kirin 820 5G adopts a 7 nm design, while the Unisoc Tanggula T760 5G utilizes a slightly more advanced 6 nm lithography. This finer lithography allows for greater power efficiency and improved performance.
When it comes to the thermal design power (TDP), the HiSilicon Kirin 820 5G consumes 6 watts, while the Unisoc Tanggula T760 5G operates at 5 watts. A lower TDP indicates better power efficiency, which can lead to longer battery life for devices using these processors.
Regarding neural processing, the HiSilicon Kirin 820 5G incorporates the Ascend D110 Lite and HUAWEI Da Vinci Architecture. On the other hand, the Unisoc Tanggula T760 5G features its own Neural Processing Unit (NPU). Neural processing units enhance artificial intelligence capabilities, enabling devices to perform tasks like facial recognition and image processing more efficiently.
In summary, both the HiSilicon Kirin 820 5G and Unisoc Tanggula T760 5G offer impressive specifications. The HiSilicon Kirin 820 5G shines with its diverse CPU cores and advanced neural processing capabilities, while the Unisoc Tanggula T760 5G stands out with its slightly more advanced lithography and lower TDP. Ultimately, the choice between these processors depends on the specific needs and preferences of the user.
CPU cores and architecture
Architecture | 1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
4x 2.2 GHz – Cortex-A76 4x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 6 nm |
TDP | 6 Watt | 5 Watt |
Neural Processing | Ascend D110 Lite, HUAWEI Da Vinci Architecture | NPU |
Memory (RAM)
Max amount | up to 12 GB | up to 16 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G57 MP6 | Mali-G57 MP6 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 850 MHz | 850 MHz |
Execution units | 6 | 6 |
Shaders | 96 | 96 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2160x1080 | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 64MP, 2x 24MP |
Max Video Capture | 4K@30fps | FullHD@30fps |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.6 Gbps | 2.7 Gbps |
Peak Upload Speed | 0.2 Gbps | 1.5 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 March | 2021 February |
Partnumber | T760 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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