HiSilicon Kirin 820 5G vs MediaTek Dimensity 930
The HiSilicon Kirin 820 5G and MediaTek Dimensity 930 are both powerful processors with their own unique specifications. Let's compare them side by side.
Starting with the CPU cores and architecture, the HiSilicon Kirin 820 5G boasts a more diverse architecture with 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. This allows for efficient multitasking and optimized performance. On the other hand, the MediaTek Dimensity 930 has 2x 2.2 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. While it has fewer cores, the Cortex-A78 cores offer superior power and higher clock speeds for enhanced processing capabilities.
In terms of the number of cores, both processors have 8 cores, ensuring smooth performance and quick response times. They also have the same ARMv8.2-A instruction set, which means they are compatible with the latest software and can execute a wide range of tasks effectively.
Moving on to the lithography, the HiSilicon Kirin 820 5G features a 7 nm process, which is highly efficient and helps to reduce power consumption. On the other hand, the MediaTek Dimensity 930 is built on a 6 nm lithography, which offers slightly better energy efficiency and improved performance.
In terms of power consumption, the HiSilicon Kirin 820 5G has a TDP (Thermal Design Power) of 6 Watts, while the MediaTek Dimensity 930 has a TDP of 10 Watts. This suggests that the Kirin 820 5G may be more power-efficient, potentially resulting in longer battery life for devices powered by this processor.
Lastly, the HiSilicon Kirin 820 5G features the Ascend D110 Lite and HUAWEI Da Vinci Architecture for neural processing, while the MediaTek Dimensity 930 utilizes an NPU (Neural Processing Unit). While both processors offer advanced neural processing capabilities, the specific architecture used may result in slight differences in performance.
Overall, both the HiSilicon Kirin 820 5G and MediaTek Dimensity 930 are impressive processors with their own unique strengths. Depending on the device and user requirements, one may prefer the multitasking capability and power efficiency of the Kirin 820 5G, while others may lean towards the higher clock speeds and superior processing capabilities of the Dimensity 930.
Starting with the CPU cores and architecture, the HiSilicon Kirin 820 5G boasts a more diverse architecture with 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. This allows for efficient multitasking and optimized performance. On the other hand, the MediaTek Dimensity 930 has 2x 2.2 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. While it has fewer cores, the Cortex-A78 cores offer superior power and higher clock speeds for enhanced processing capabilities.
In terms of the number of cores, both processors have 8 cores, ensuring smooth performance and quick response times. They also have the same ARMv8.2-A instruction set, which means they are compatible with the latest software and can execute a wide range of tasks effectively.
Moving on to the lithography, the HiSilicon Kirin 820 5G features a 7 nm process, which is highly efficient and helps to reduce power consumption. On the other hand, the MediaTek Dimensity 930 is built on a 6 nm lithography, which offers slightly better energy efficiency and improved performance.
In terms of power consumption, the HiSilicon Kirin 820 5G has a TDP (Thermal Design Power) of 6 Watts, while the MediaTek Dimensity 930 has a TDP of 10 Watts. This suggests that the Kirin 820 5G may be more power-efficient, potentially resulting in longer battery life for devices powered by this processor.
Lastly, the HiSilicon Kirin 820 5G features the Ascend D110 Lite and HUAWEI Da Vinci Architecture for neural processing, while the MediaTek Dimensity 930 utilizes an NPU (Neural Processing Unit). While both processors offer advanced neural processing capabilities, the specific architecture used may result in slight differences in performance.
Overall, both the HiSilicon Kirin 820 5G and MediaTek Dimensity 930 are impressive processors with their own unique strengths. Depending on the device and user requirements, one may prefer the multitasking capability and power efficiency of the Kirin 820 5G, while others may lean towards the higher clock speeds and superior processing capabilities of the Dimensity 930.
CPU cores and architecture
Architecture | 1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
2x 2.2 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 6 nm |
TDP | 6 Watt | 10 Watt |
Neural Processing | Ascend D110 Lite, HUAWEI Da Vinci Architecture | NPU |
Memory (RAM)
Max amount | up to 12 GB | up to 16 GB |
Memory type | LPDDR4X | LPDDR5 |
Memory frequency | 2133 MHz | 3200 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G57 MP6 | Imagination PowerVR BXM-8-256 |
GPU Architecture | Valhall | Rogue |
GPU frequency | 850 MHz | 800 MHz |
Execution units | 6 | |
Shaders | 96 | |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 3.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 108MP, 1x 64MP |
Max Video Capture | 4K@30fps | 2K@30fps |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.2 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2020 March | 2022 Quarter 3 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Google Tensor G1 vs Qualcomm Snapdragon 685
2
Qualcomm Snapdragon 670 vs Samsung Exynos 9611
3
HiSilicon Kirin 710F vs MediaTek Helio P70
4
Samsung Exynos 9810 vs Qualcomm Snapdragon 720G
5
MediaTek Dimensity 7050 vs Apple A15 Bionic
6
MediaTek Helio P90 vs Samsung Exynos 8890
7
Qualcomm Snapdragon 778G vs MediaTek Dimensity 1000
8
Unisoc Tiger T610 vs MediaTek Dimensity 1200
9
Samsung Exynos 9610 vs Qualcomm Snapdragon 8 Gen 2
10
MediaTek Dimensity 900 vs Samsung Exynos 990