HiSilicon Kirin 820 5G vs MediaTek Dimensity 810
The HiSilicon Kirin 820 5G and MediaTek Dimensity 810 are two processors that offer high performance and efficiency for smartphones.
Starting with the HiSilicon Kirin 820 5G, it features a powerful architecture with a combination of CPU cores. It includes 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. With a total of 8 cores, this processor ensures smooth multitasking and responsiveness. It utilizes the ARMv8.2-A instruction set and is built on a 7 nm lithography, which contributes to its power efficiency. Additionally, the HiSilicon Kirin 820 5G includes the Ascend D110 Lite Neural Processing Unit (NPU) based on the HUAWEI Da Vinci Architecture, which enhances its AI capabilities.
Moving on to the MediaTek Dimensity 810, it also boasts an impressive architecture. It consists of 2x 2.4 GHz Cortex-A76 cores and 6x 2.0 GHz Cortex-A55 cores. This combination provides a good balance between high-performance tasks and power efficiency. Like the HiSilicon Kirin 820 5G, it utilizes the ARMv8.2-A instruction set and features 8 cores. However, the Dimensity 810 is built on a smaller 6 nm lithography, which can potentially offer improved power efficiency. It also includes a Neural Processing Unit (NPU) to enhance AI capabilities.
In terms of power consumption, the HiSilicon Kirin 820 5G has a TDP of 6 Watt, while the MediaTek Dimensity 810 has a slightly higher TDP of 8 Watt. This indicates that the former may offer better power efficiency, although the difference is marginal.
In conclusion, both the HiSilicon Kirin 820 5G and MediaTek Dimensity 810 processors provide impressive performance and efficiency. The HiSilicon Kirin 820 5G stands out with its 7 nm lithography and Ascend D110 Lite Neural Processing Unit, while the MediaTek Dimensity 810 offers a smaller 6 nm lithography and an NPU. Ultimately, the choice between the two would depend on specific requirements and priorities, such as power efficiency, AI capabilities, and overall performance.
Starting with the HiSilicon Kirin 820 5G, it features a powerful architecture with a combination of CPU cores. It includes 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. With a total of 8 cores, this processor ensures smooth multitasking and responsiveness. It utilizes the ARMv8.2-A instruction set and is built on a 7 nm lithography, which contributes to its power efficiency. Additionally, the HiSilicon Kirin 820 5G includes the Ascend D110 Lite Neural Processing Unit (NPU) based on the HUAWEI Da Vinci Architecture, which enhances its AI capabilities.
Moving on to the MediaTek Dimensity 810, it also boasts an impressive architecture. It consists of 2x 2.4 GHz Cortex-A76 cores and 6x 2.0 GHz Cortex-A55 cores. This combination provides a good balance between high-performance tasks and power efficiency. Like the HiSilicon Kirin 820 5G, it utilizes the ARMv8.2-A instruction set and features 8 cores. However, the Dimensity 810 is built on a smaller 6 nm lithography, which can potentially offer improved power efficiency. It also includes a Neural Processing Unit (NPU) to enhance AI capabilities.
In terms of power consumption, the HiSilicon Kirin 820 5G has a TDP of 6 Watt, while the MediaTek Dimensity 810 has a slightly higher TDP of 8 Watt. This indicates that the former may offer better power efficiency, although the difference is marginal.
In conclusion, both the HiSilicon Kirin 820 5G and MediaTek Dimensity 810 processors provide impressive performance and efficiency. The HiSilicon Kirin 820 5G stands out with its 7 nm lithography and Ascend D110 Lite Neural Processing Unit, while the MediaTek Dimensity 810 offers a smaller 6 nm lithography and an NPU. Ultimately, the choice between the two would depend on specific requirements and priorities, such as power efficiency, AI capabilities, and overall performance.
CPU cores and architecture
Architecture | 1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
2x 2.4 GHz – Cortex-A76 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 6 nm |
Number of transistors | 12000 million | |
TDP | 6 Watt | 8 Watt |
Neural Processing | Ascend D110 Lite, HUAWEI Da Vinci Architecture | NPU |
Memory (RAM)
Max amount | up to 12 GB | up to 12 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G57 MP6 | Mali-G57 MP2 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 850 MHz | 950 MHz |
Execution units | 6 | 2 |
Shaders | 96 | 32 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 64MP, 2x 16MP |
Max Video Capture | 4K@30fps | 2K@30FPS |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.2 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2020 March | 2021 Quarter 3 |
Partnumber | MT6833V/PNZA, MT6833P | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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