HiSilicon Kirin 820 5G vs MediaTek Dimensity 810

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The HiSilicon Kirin 820 5G and MediaTek Dimensity 810 are two processors that offer high performance and efficiency for smartphones.

Starting with the HiSilicon Kirin 820 5G, it features a powerful architecture with a combination of CPU cores. It includes 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. With a total of 8 cores, this processor ensures smooth multitasking and responsiveness. It utilizes the ARMv8.2-A instruction set and is built on a 7 nm lithography, which contributes to its power efficiency. Additionally, the HiSilicon Kirin 820 5G includes the Ascend D110 Lite Neural Processing Unit (NPU) based on the HUAWEI Da Vinci Architecture, which enhances its AI capabilities.

Moving on to the MediaTek Dimensity 810, it also boasts an impressive architecture. It consists of 2x 2.4 GHz Cortex-A76 cores and 6x 2.0 GHz Cortex-A55 cores. This combination provides a good balance between high-performance tasks and power efficiency. Like the HiSilicon Kirin 820 5G, it utilizes the ARMv8.2-A instruction set and features 8 cores. However, the Dimensity 810 is built on a smaller 6 nm lithography, which can potentially offer improved power efficiency. It also includes a Neural Processing Unit (NPU) to enhance AI capabilities.

In terms of power consumption, the HiSilicon Kirin 820 5G has a TDP of 6 Watt, while the MediaTek Dimensity 810 has a slightly higher TDP of 8 Watt. This indicates that the former may offer better power efficiency, although the difference is marginal.

In conclusion, both the HiSilicon Kirin 820 5G and MediaTek Dimensity 810 processors provide impressive performance and efficiency. The HiSilicon Kirin 820 5G stands out with its 7 nm lithography and Ascend D110 Lite Neural Processing Unit, while the MediaTek Dimensity 810 offers a smaller 6 nm lithography and an NPU. Ultimately, the choice between the two would depend on specific requirements and priorities, such as power efficiency, AI capabilities, and overall performance.

CPU cores and architecture

Architecture 1x 2.36 GHz – Cortex-A76
3x 2.22 GHz – Cortex-A76
4x 1.84 GHz – Cortex-A55
2x 2.4 GHz – Cortex-A76
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 6 nm
Number of transistors 12000 million
TDP 6 Watt 8 Watt
Neural Processing Ascend D110 Lite, HUAWEI Da Vinci Architecture NPU

Memory (RAM)

Max amount up to 12 GB up to 12 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 2133 MHz
Memory-bus 4x16 bit 2x16 bit

Storage

Storage specification UFS 2.1 UFS 2.2

Graphics

GPU name Mali-G57 MP6 Mali-G57 MP2
GPU Architecture Valhall Valhall
GPU frequency 850 MHz 950 MHz
Execution units 6 2
Shaders 96 32
DirectX 12 12
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 20MP 1x 64MP, 2x 16MP
Max Video Capture 4K@30fps 2K@30FPS
Video codec support AV1
H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.6 Gbps 2.77 Gbps
Peak Upload Speed 0.2 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.1 5.1
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS
QZSS

Supplemental Information

Launch Date 2020 March 2021 Quarter 3
Partnumber MT6833V/PNZA, MT6833P
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 820 5G
387656
Dimensity 810
356915

GeekBench 6 Single-Core

Score
Kirin 820 5G
640
Dimensity 810
584

GeekBench 6 Multi-Core

Score
Kirin 820 5G
2436
Dimensity 810
1662