HiSilicon Kirin 820 5G vs MediaTek Dimensity 700
The HiSilicon Kirin 820 5G and MediaTek Dimensity 700 are two processors that offer powerful performance for smartphones. Let's delve into their specifications to understand their differences and similarities.
Starting with the HiSilicon Kirin 820 5G, it features a combination of CPU cores and architecture that consists of 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. This configuration offers a balanced mix of high-performance and power-efficient cores for various tasks. The processor is based on the ARMv8.2-A instruction set and boasts a 7 nm lithography process. With a TDP of 6 Watts, it ensures efficient power consumption. Additionally, the Kirin 820 5G features the Ascend D110 Lite Neural Processing Unit, utilizing HUAWEI Da Vinci Architecture for AI-related tasks and capabilities.
On the other hand, the MediaTek Dimensity 700 also possesses 8 cores and an ARMv8.2-A instruction set. Its architecture comprises 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. This configuration provides a slightly higher clock speed than the Kirin 820 5G, which may result in improved performance for single-threaded tasks. Similar to the Kirin 820 5G, the Dimensity 700 is built on a 7 nm lithography process, ensuring power efficiency. It has a TDP of 10 Watts, indicating slightly higher power consumption compared to the Kirin 820 5G.
In terms of performance, the HiSilicon Kirin 820 5G and MediaTek Dimensity 700 both offer strong capabilities. However, due to their different CPU core configurations and clock speeds, their performance may vary in specific tasks. The Kirin 820 5G's additional Cortex-A76 cores may provide an advantage in multi-threaded tasks, while the Dimensity 700's higher single-threaded clock speed may excel in certain single-threaded applications.
When considering power consumption, the Kirin 820 5G takes the lead with its lower TDP of 6 Watts. This indicates that it may offer better power efficiency and potentially longer battery life compared to the Dimensity 700.
Overall, both the HiSilicon Kirin 820 5G and MediaTek Dimensity 700 present compelling options for smartphone processors. Choosing between them depends on the specific requirements and priorities of the user, whether it be multi-threaded performance or power efficiency.
Starting with the HiSilicon Kirin 820 5G, it features a combination of CPU cores and architecture that consists of 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. This configuration offers a balanced mix of high-performance and power-efficient cores for various tasks. The processor is based on the ARMv8.2-A instruction set and boasts a 7 nm lithography process. With a TDP of 6 Watts, it ensures efficient power consumption. Additionally, the Kirin 820 5G features the Ascend D110 Lite Neural Processing Unit, utilizing HUAWEI Da Vinci Architecture for AI-related tasks and capabilities.
On the other hand, the MediaTek Dimensity 700 also possesses 8 cores and an ARMv8.2-A instruction set. Its architecture comprises 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. This configuration provides a slightly higher clock speed than the Kirin 820 5G, which may result in improved performance for single-threaded tasks. Similar to the Kirin 820 5G, the Dimensity 700 is built on a 7 nm lithography process, ensuring power efficiency. It has a TDP of 10 Watts, indicating slightly higher power consumption compared to the Kirin 820 5G.
In terms of performance, the HiSilicon Kirin 820 5G and MediaTek Dimensity 700 both offer strong capabilities. However, due to their different CPU core configurations and clock speeds, their performance may vary in specific tasks. The Kirin 820 5G's additional Cortex-A76 cores may provide an advantage in multi-threaded tasks, while the Dimensity 700's higher single-threaded clock speed may excel in certain single-threaded applications.
When considering power consumption, the Kirin 820 5G takes the lead with its lower TDP of 6 Watts. This indicates that it may offer better power efficiency and potentially longer battery life compared to the Dimensity 700.
Overall, both the HiSilicon Kirin 820 5G and MediaTek Dimensity 700 present compelling options for smartphone processors. Choosing between them depends on the specific requirements and priorities of the user, whether it be multi-threaded performance or power efficiency.
CPU cores and architecture
Architecture | 1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 7 nm |
TDP | 6 Watt | 10 Watt |
Neural Processing | Ascend D110 Lite, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 12 GB | up to 12 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G57 MP6 | Mali-G57 MP2 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 850 MHz | 950 MHz |
Execution units | 6 | 2 |
Shaders | 96 | 32 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@90Hz | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 64MP, 2x 16MP |
Max Video Capture | 4K@30fps | 2K@30FPS |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.2 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2020 March | 2021 Quarter 1 |
Partnumber | MT6833V/ZA, MT6833V/NZA | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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