HiSilicon Kirin 820 5G vs MediaTek Dimensity 700

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The HiSilicon Kirin 820 5G and MediaTek Dimensity 700 are two processors that offer powerful performance for smartphones. Let's delve into their specifications to understand their differences and similarities.

Starting with the HiSilicon Kirin 820 5G, it features a combination of CPU cores and architecture that consists of 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. This configuration offers a balanced mix of high-performance and power-efficient cores for various tasks. The processor is based on the ARMv8.2-A instruction set and boasts a 7 nm lithography process. With a TDP of 6 Watts, it ensures efficient power consumption. Additionally, the Kirin 820 5G features the Ascend D110 Lite Neural Processing Unit, utilizing HUAWEI Da Vinci Architecture for AI-related tasks and capabilities.

On the other hand, the MediaTek Dimensity 700 also possesses 8 cores and an ARMv8.2-A instruction set. Its architecture comprises 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. This configuration provides a slightly higher clock speed than the Kirin 820 5G, which may result in improved performance for single-threaded tasks. Similar to the Kirin 820 5G, the Dimensity 700 is built on a 7 nm lithography process, ensuring power efficiency. It has a TDP of 10 Watts, indicating slightly higher power consumption compared to the Kirin 820 5G.

In terms of performance, the HiSilicon Kirin 820 5G and MediaTek Dimensity 700 both offer strong capabilities. However, due to their different CPU core configurations and clock speeds, their performance may vary in specific tasks. The Kirin 820 5G's additional Cortex-A76 cores may provide an advantage in multi-threaded tasks, while the Dimensity 700's higher single-threaded clock speed may excel in certain single-threaded applications.

When considering power consumption, the Kirin 820 5G takes the lead with its lower TDP of 6 Watts. This indicates that it may offer better power efficiency and potentially longer battery life compared to the Dimensity 700.

Overall, both the HiSilicon Kirin 820 5G and MediaTek Dimensity 700 present compelling options for smartphone processors. Choosing between them depends on the specific requirements and priorities of the user, whether it be multi-threaded performance or power efficiency.

CPU cores and architecture

Architecture 1x 2.36 GHz – Cortex-A76
3x 2.22 GHz – Cortex-A76
4x 1.84 GHz – Cortex-A55
2x 2.2 GHz – Cortex-A76
6x 2 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 7 nm
TDP 6 Watt 10 Watt
Neural Processing Ascend D110 Lite, HUAWEI Da Vinci Architecture

Memory (RAM)

Max amount up to 12 GB up to 12 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 2133 MHz
Memory-bus 4x16 bit 2x16 bit

Storage

Storage specification UFS 2.1 UFS 2.2

Graphics

GPU name Mali-G57 MP6 Mali-G57 MP2
GPU Architecture Valhall Valhall
GPU frequency 850 MHz 950 MHz
Execution units 6 2
Shaders 96 32
DirectX 12 12
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 2520x1080@90Hz
Max camera resolution 1x 48MP, 2x 20MP 1x 64MP, 2x 16MP
Max Video Capture 4K@30fps 2K@30FPS
Video codec support AV1
H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.6 Gbps 2.77 Gbps
Peak Upload Speed 0.2 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.1 5.1
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2020 March 2021 Quarter 1
Partnumber MT6833V/ZA, MT6833V/NZA
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 820 5G
387656
Dimensity 700
325860

GeekBench 6 Single-Core

Score
Kirin 820 5G
640
Dimensity 700
531

GeekBench 6 Multi-Core

Score
Kirin 820 5G
2436
Dimensity 700
1719