HiSilicon Kirin 820 5G vs HiSilicon Kirin 985 5G
The HiSilicon Kirin 820 5G and HiSilicon Kirin 985 5G are both powerful processors designed by HiSilicon. Let's compare their specifications to see how they differ.
In terms of CPU cores and architecture, both processors have 8 cores and use ARMv8.2-A instruction set. However, there are differences in the clock speeds of their cores. The Kirin 820 5G consists of 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. On the other hand, the Kirin 985 5G has 1x 2.58 GHz Cortex-A76, 3x 2.4 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. This means that the Kirin 985 5G has slightly higher clock speeds, which may result in improved performance.
Both processors feature a 7 nm lithography, ensuring energy efficiency and better heat management. They also have a TDP (Thermal Design Power) of 6 Watts, which means they consume lower power while operating.
When it comes to Neural Processing, the Kirin 820 5G utilizes the Ascend D110 Lite, while the Kirin 985 5G combines the Ascend D110 Lite and the Ascend D100 Tiny. This suggests that the Kirin 985 5G might have more advanced neural processing capabilities, potentially leading to enhanced AI performance.
Overall, while both processors have similar core configurations and lithography, the Kirin 985 5G stands out with slightly higher clock speeds and its utilization of both Ascend D110 Lite and Ascend D100 Tiny for neural processing. This could result in improved performance, particularly in AI-related tasks.
It's important to note that other factors such as software optimization, overall system architecture, and real-world performance should also be considered when comparing processors. These specifications provide a general understanding of the differences between the HiSilicon Kirin 820 5G and Kirin 985 5G processors, but actual performance may vary based on various factors and practical usage scenarios.
In terms of CPU cores and architecture, both processors have 8 cores and use ARMv8.2-A instruction set. However, there are differences in the clock speeds of their cores. The Kirin 820 5G consists of 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. On the other hand, the Kirin 985 5G has 1x 2.58 GHz Cortex-A76, 3x 2.4 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. This means that the Kirin 985 5G has slightly higher clock speeds, which may result in improved performance.
Both processors feature a 7 nm lithography, ensuring energy efficiency and better heat management. They also have a TDP (Thermal Design Power) of 6 Watts, which means they consume lower power while operating.
When it comes to Neural Processing, the Kirin 820 5G utilizes the Ascend D110 Lite, while the Kirin 985 5G combines the Ascend D110 Lite and the Ascend D100 Tiny. This suggests that the Kirin 985 5G might have more advanced neural processing capabilities, potentially leading to enhanced AI performance.
Overall, while both processors have similar core configurations and lithography, the Kirin 985 5G stands out with slightly higher clock speeds and its utilization of both Ascend D110 Lite and Ascend D100 Tiny for neural processing. This could result in improved performance, particularly in AI-related tasks.
It's important to note that other factors such as software optimization, overall system architecture, and real-world performance should also be considered when comparing processors. These specifications provide a general understanding of the differences between the HiSilicon Kirin 820 5G and Kirin 985 5G processors, but actual performance may vary based on various factors and practical usage scenarios.
CPU cores and architecture
Architecture | 1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
1x 2.58 GHz – Cortex-A76 3x 2.4 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 7 nm |
TDP | 6 Watt | 6 Watt |
Neural Processing | Ascend D110 Lite, HUAWEI Da Vinci Architecture | Ascend D110 Lite + Ascend D100 Tiny, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 12 GB | up to 12 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.0 |
Graphics
GPU name | Mali-G57 MP6 | Mali-G77 MP8 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 850 MHz | 700 MHz |
Execution units | 6 | 8 |
Shaders | 96 | 128 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3120x1440 | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 48MP, 2x 20MP |
Max Video Capture | 4K@30fps | 4K@30fp |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.6 Gbps | 1.4 Gbps |
Peak Upload Speed | 0.2 Gbps | 0.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 March | 2020 Quarter 2 |
Partnumber | Hi6290 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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