HiSilicon Kirin 820 5G vs HiSilicon Kirin 970

The HiSilicon Kirin 820 5G and the HiSilicon Kirin 970 are both impressive processors created by HiSilicon. However, they have some notable differences in their specifications.

Let's start with the HiSilicon Kirin 820 5G. This processor has a powerful architecture consisting of 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. With a total of 8 cores, it offers a great balance between performance and power efficiency. The Kirin 820 5G also utilizes ARMv8.2-A instruction set and has a 7 nm lithography, which contributes to its efficiency. Additionally, it has a Thermal Design Power (TDP) of 6 Watts, making it very power-efficient. The Neural Processing capabilities of this processor are brought by the Ascend D110 Lite and the HUAWEI Da Vinci Architecture, ensuring efficient AI processing.

On the other hand, the HiSilicon Kirin 970 has a slightly different architecture. It consists of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores, totaling 8 cores. This processor uses the ARMv8-A instruction set and has a 10 nm lithography, which is still impressive but not as advanced as the Kirin 820 5G. The Kirin 970 has 5500 million transistors, highlighting its technical capacity. This processor has a TDP of 9 Watts, which is a bit higher than the Kirin 820 5G. The Neural Processing Unit (NPU) used in the Kirin 970 is the HiSilicon NPU, ensuring efficient AI tasks.

In summary, the HiSilicon Kirin 820 5G and the HiSilicon Kirin 970 are both powerful processors designed by HiSilicon, but they have some variations in their specifications. The Kirin 820 5G stands out with its more advanced architecture, 7 nm lithography, lower TDP, and the Ascend D110 Lite and HUAWEI Da Vinci Architecture for Neural Processing. Meanwhile, the Kirin 970 offers a strong configuration with its 4x 2.4 GHz Cortex-A73 cores, 4x 1.8 GHz Cortex-A53 cores, 10 nm lithography, and the HiSilicon NPU for Neural Processing.