HiSilicon Kirin 820 5G vs HiSilicon Kirin 960

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The HiSilicon Kirin 820 5G and the HiSilicon Kirin 960 are both processors manufactured by HiSilicon. While they have some similarities, there are also notable differences in their specifications.

Starting with the HiSilicon Kirin 820 5G, it features an architecture that includes 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. This octa-core processor operates on a 7 nm lithography, which contributes to its energy efficiency with a TDP of 6 watts. The HiSilicon Kirin 820 5G also boasts Ascend D110 Lite for neural processing, utilizing HUAWEI Da Vinci Architecture.

In comparison, the HiSilicon Kirin 960 consists of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. This octa-core processor operates on a 16 nm lithography and has a TDP of 5 watts. With 4000 million transistors, the HiSilicon Kirin 960 has a higher transistor count compared to the Kirin 820 5G.

Both processors support the ARMv8 instruction set, enabling compatibility with a wide range of applications and software. However, the Kirin 820 5G has a more advanced ARMv8.2-A instruction set, while the Kirin 960 utilizes the ARMv8-A instruction set.

When it comes to the Neural Processing Unit (NPU), the HiSilicon Kirin 820 5G incorporates Ascend D110 Lite, which enhances its capabilities for AI-related tasks. The Kirin 960, on the other hand, does not have a dedicated NPU.

In summary, the HiSilicon Kirin 820 5G has a more advanced architecture with a wider range of clock speeds, a more efficient lithography, and an NPU for enhanced AI capabilities. The Kirin 960, on the other hand, has a higher transistor count and a slightly lower TDP. Ultimately, the choice between these two processors will depend on the specific requirements and preferences of the user.

CPU cores and architecture

Architecture 1x 2.36 GHz – Cortex-A76
3x 2.22 GHz – Cortex-A76
4x 1.84 GHz – Cortex-A55
4x 2.4 GHz – Cortex-A73
4x 1.8 GHz – Cortex-A53
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8-A
Lithography 7 nm 16 nm
Number of transistors 4000 million
TDP 6 Watt 5 Watt
Neural Processing Ascend D110 Lite, HUAWEI Da Vinci Architecture

Memory (RAM)

Max amount up to 12 GB up to 6 GB
Memory type LPDDR4X LPDDR4
Memory frequency 2133 MHz 1866 MHz
Memory-bus 4x16 bit 2x32 bit

Storage

Storage specification UFS 2.1 UFS 2.1

Graphics

GPU name Mali-G57 MP6 Mali-G71 MP8
GPU Architecture Valhall Bifrost
GPU frequency 850 MHz 900 MHz
Execution units 6 8
Shaders 96 128
DirectX 12 11.3
OpenCL API 2.1 1.2
OpenGL API ES 3.2
Vulkan API 1.2 1.0

Camera, Video, Display

Max camera resolution 1x 48MP, 2x 20MP 1x 20MP, 2x 12MP
Max Video Capture 4K@30fps 4K@30fps
Video codec support AV1
H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP8
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.6 Gbps 0.6 Gbps
Peak Upload Speed 0.2 Gbps 0.15 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.1 4.2
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2020 March 2016 October
Partnumber Hi3660
Vertical Segment Mobiles Mobiles
Positioning Mid-end Flagship

AnTuTu 10

Total Score
Kirin 820 5G
387656
Kirin 960
253892

GeekBench 6 Single-Core

Score
Kirin 820 5G
640
Kirin 960
382

GeekBench 6 Multi-Core

Score
Kirin 820 5G
2436
Kirin 960
1544