HiSilicon Kirin 820 5G vs HiSilicon Kirin 960
The HiSilicon Kirin 820 5G and the HiSilicon Kirin 960 are both processors manufactured by HiSilicon. While they have some similarities, there are also notable differences in their specifications.
Starting with the HiSilicon Kirin 820 5G, it features an architecture that includes 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. This octa-core processor operates on a 7 nm lithography, which contributes to its energy efficiency with a TDP of 6 watts. The HiSilicon Kirin 820 5G also boasts Ascend D110 Lite for neural processing, utilizing HUAWEI Da Vinci Architecture.
In comparison, the HiSilicon Kirin 960 consists of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. This octa-core processor operates on a 16 nm lithography and has a TDP of 5 watts. With 4000 million transistors, the HiSilicon Kirin 960 has a higher transistor count compared to the Kirin 820 5G.
Both processors support the ARMv8 instruction set, enabling compatibility with a wide range of applications and software. However, the Kirin 820 5G has a more advanced ARMv8.2-A instruction set, while the Kirin 960 utilizes the ARMv8-A instruction set.
When it comes to the Neural Processing Unit (NPU), the HiSilicon Kirin 820 5G incorporates Ascend D110 Lite, which enhances its capabilities for AI-related tasks. The Kirin 960, on the other hand, does not have a dedicated NPU.
In summary, the HiSilicon Kirin 820 5G has a more advanced architecture with a wider range of clock speeds, a more efficient lithography, and an NPU for enhanced AI capabilities. The Kirin 960, on the other hand, has a higher transistor count and a slightly lower TDP. Ultimately, the choice between these two processors will depend on the specific requirements and preferences of the user.
Starting with the HiSilicon Kirin 820 5G, it features an architecture that includes 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. This octa-core processor operates on a 7 nm lithography, which contributes to its energy efficiency with a TDP of 6 watts. The HiSilicon Kirin 820 5G also boasts Ascend D110 Lite for neural processing, utilizing HUAWEI Da Vinci Architecture.
In comparison, the HiSilicon Kirin 960 consists of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. This octa-core processor operates on a 16 nm lithography and has a TDP of 5 watts. With 4000 million transistors, the HiSilicon Kirin 960 has a higher transistor count compared to the Kirin 820 5G.
Both processors support the ARMv8 instruction set, enabling compatibility with a wide range of applications and software. However, the Kirin 820 5G has a more advanced ARMv8.2-A instruction set, while the Kirin 960 utilizes the ARMv8-A instruction set.
When it comes to the Neural Processing Unit (NPU), the HiSilicon Kirin 820 5G incorporates Ascend D110 Lite, which enhances its capabilities for AI-related tasks. The Kirin 960, on the other hand, does not have a dedicated NPU.
In summary, the HiSilicon Kirin 820 5G has a more advanced architecture with a wider range of clock speeds, a more efficient lithography, and an NPU for enhanced AI capabilities. The Kirin 960, on the other hand, has a higher transistor count and a slightly lower TDP. Ultimately, the choice between these two processors will depend on the specific requirements and preferences of the user.
CPU cores and architecture
Architecture | 1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8-A |
Lithography | 7 nm | 16 nm |
Number of transistors | 4000 million | |
TDP | 6 Watt | 5 Watt |
Neural Processing | Ascend D110 Lite, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 12 GB | up to 6 GB |
Memory type | LPDDR4X | LPDDR4 |
Memory frequency | 2133 MHz | 1866 MHz |
Memory-bus | 4x16 bit | 2x32 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G57 MP6 | Mali-G71 MP8 |
GPU Architecture | Valhall | Bifrost |
GPU frequency | 850 MHz | 900 MHz |
Execution units | 6 | 8 |
Shaders | 96 | 128 |
DirectX | 12 | 11.3 |
OpenCL API | 2.1 | 1.2 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.2 | 1.0 |
Camera, Video, Display
Max camera resolution | 1x 48MP, 2x 20MP | 1x 20MP, 2x 12MP |
Max Video Capture | 4K@30fps | 4K@30fps |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.6 Gbps | 0.6 Gbps |
Peak Upload Speed | 0.2 Gbps | 0.15 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 4.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 March | 2016 October |
Partnumber | Hi3660 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Flagship |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Samsung Exynos 1330 vs MediaTek Helio P70
2
MediaTek Helio P90 vs Qualcomm Snapdragon 660
3
HiSilicon Kirin 710 vs Samsung Exynos 9820
4
HiSilicon Kirin 930 vs MediaTek Helio G35
5
MediaTek Dimensity 800 vs Qualcomm Snapdragon 8 Plus Gen 1
6
Qualcomm Snapdragon 665 vs Qualcomm Snapdragon 835
7
Qualcomm Snapdragon 6 Gen 1 vs Qualcomm Snapdragon 888
8
MediaTek Dimensity 6100 Plus vs Unisoc Tanggula T760 5G
9
Qualcomm Snapdragon 690 vs MediaTek Dimensity 8020
10
MediaTek Dimensity 930 vs Qualcomm Snapdragon 480 Plus