HiSilicon Kirin 810 vs Unisoc Tiger T618
The HiSilicon Kirin 810 and the Unisoc Tiger T618 are two processors with distinct specifications. Let's compare them based on their specifications.
Starting with the HiSilicon Kirin 810, it is built on a 7 nm lithography process. This means that it can provide increased power efficiency and better overall performance compared to processors built on larger nodes. The Kirin 810 consists of eight cores, with a combination of 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. The Cortex-A76 cores offer high-performance computing capabilities, while the Cortex-A55 cores focus on energy efficiency. The Kirin 810 also boasts an instruction set of ARMv8.2-A, which is compatible with the latest applications and software. Moreover, it includes the Ascend D100 Lite neural processing unit, incorporating Huawei's Da Vinci architecture for advanced AI capabilities. The HiSilicon Kirin 810 operates at a TDP of 5 watts and has approximately 6.9 billion transistors.
On the other hand, the Unisoc Tiger T618 is fabricated using a 12 nm lithography process, which is slightly less advanced than the Kirin 810. It also features eight cores, including 2x 2.0 GHz Cortex-A75 cores and 6x 2.0 GHz Cortex-A55 cores. The Cortex-A75 cores are designed to deliver improved performance, albeit at a slightly lower clock speed. The Tiger T618 utilizes the ARMv8.2-A instruction set, ensuring compatibility with modern applications and software. In terms of neural processing, it includes an NPU to enhance AI capabilities. However, the Tiger T618 operates at a higher TDP of 10 watts compared to the Kirin 810. It should be noted that this processor contains unspecified information on the number of transistors.
In summary, the HiSilicon Kirin 810 excels in terms of lithography, offering a more power-efficient and powerful performance compared to the Unisoc Tiger T618. Moreover, the Kirin 810's combination of Cortex-A76 and Cortex-A55 cores, along with the Huawei Da Vinci architecture, provides advanced AI capabilities. However, the Tiger T618 offers slightly higher clock speeds on its cores at the expense of higher power consumption. Overall, the choice between these processors will depend on the intended usage and individual priorities relating to power efficiency, performance, and AI capabilities.
Starting with the HiSilicon Kirin 810, it is built on a 7 nm lithography process. This means that it can provide increased power efficiency and better overall performance compared to processors built on larger nodes. The Kirin 810 consists of eight cores, with a combination of 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. The Cortex-A76 cores offer high-performance computing capabilities, while the Cortex-A55 cores focus on energy efficiency. The Kirin 810 also boasts an instruction set of ARMv8.2-A, which is compatible with the latest applications and software. Moreover, it includes the Ascend D100 Lite neural processing unit, incorporating Huawei's Da Vinci architecture for advanced AI capabilities. The HiSilicon Kirin 810 operates at a TDP of 5 watts and has approximately 6.9 billion transistors.
On the other hand, the Unisoc Tiger T618 is fabricated using a 12 nm lithography process, which is slightly less advanced than the Kirin 810. It also features eight cores, including 2x 2.0 GHz Cortex-A75 cores and 6x 2.0 GHz Cortex-A55 cores. The Cortex-A75 cores are designed to deliver improved performance, albeit at a slightly lower clock speed. The Tiger T618 utilizes the ARMv8.2-A instruction set, ensuring compatibility with modern applications and software. In terms of neural processing, it includes an NPU to enhance AI capabilities. However, the Tiger T618 operates at a higher TDP of 10 watts compared to the Kirin 810. It should be noted that this processor contains unspecified information on the number of transistors.
In summary, the HiSilicon Kirin 810 excels in terms of lithography, offering a more power-efficient and powerful performance compared to the Unisoc Tiger T618. Moreover, the Kirin 810's combination of Cortex-A76 and Cortex-A55 cores, along with the Huawei Da Vinci architecture, provides advanced AI capabilities. However, the Tiger T618 offers slightly higher clock speeds on its cores at the expense of higher power consumption. Overall, the choice between these processors will depend on the intended usage and individual priorities relating to power efficiency, performance, and AI capabilities.
CPU cores and architecture
Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
2x 2.0 GHz – Cortex-A75 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 12 nm |
Number of transistors | 6900 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 6 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 1866 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | eMMC 5.1 |
Graphics
GPU name | Mali-G52 MP6 | Mali-G52 MP2 |
GPU Architecture | Bifrost | Bifrost |
GPU frequency | 820 MHz | 850 MHz |
Execution units | 6 | 2 |
Shaders | 96 | 32 |
DirectX | 12 | 11 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2400x1080 | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 64M |
Max Video Capture | FullHD@30fps | FullHD@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2019 Quarter 2 | 2019 August |
Partnumber | Hi6280 | T618 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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