HiSilicon Kirin 820 5G vs Unisoc Tiger T616
The HiSilicon Kirin 820 5G and Unisoc Tiger T616 are two processors with different specifications. Let's compare them based on their CPU cores and architecture, number of cores, instruction set, lithography, and Thermal Design Power (TDP).
Starting with the HiSilicon Kirin 820 5G, it features a robust architecture with 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. This combination provides a balanced performance and power efficiency. The processor has a total of 8 cores and utilizes the ARMv8.2-A instruction set. It boasts a smaller 7 nm lithography, enhancing power efficiency and reducing heat generation. The TDP of the Kirin 820 5G is only 6 Watts, further contributing to its energy-saving capabilities. Additionally, it features the Ascend D110 Lite and HUAWEI Da Vinci Architecture for neural processing tasks.
On the other hand, the Unisoc Tiger T616 also consists of 8 cores. Its architecture includes 2x 2.0 GHz Cortex-A75 and 6x 1.8 GHz Cortex-A55 cores. This setup focuses more on performance, especially with the faster Cortex-A75 cores. The instruction set used by the T616 is also ARMv8.2-A. However, it possesses a larger 12 nm lithography, which may slightly impact power efficiency and heat dissipation. The TDP of the T616 is higher, standing at 10 Watts.
In summary, the HiSilicon Kirin 820 5G and Unisoc Tiger T616 processors have their own unique specifications. The Kirin 820 5G offers a well-balanced architecture, smaller lithography, and lower TDP, enabling energy efficiency and capable neural processing. On the other hand, the Tiger T616 emphasizes performance with faster Cortex-A75 cores but has a larger lithography and slightly higher TDP. The choice between these processors will depend on specific requirements, with the Kirin 820 5G being a better option for power efficiency and neural processing, while the Tiger T616 may excel in tasks that demand higher performance.
Starting with the HiSilicon Kirin 820 5G, it features a robust architecture with 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. This combination provides a balanced performance and power efficiency. The processor has a total of 8 cores and utilizes the ARMv8.2-A instruction set. It boasts a smaller 7 nm lithography, enhancing power efficiency and reducing heat generation. The TDP of the Kirin 820 5G is only 6 Watts, further contributing to its energy-saving capabilities. Additionally, it features the Ascend D110 Lite and HUAWEI Da Vinci Architecture for neural processing tasks.
On the other hand, the Unisoc Tiger T616 also consists of 8 cores. Its architecture includes 2x 2.0 GHz Cortex-A75 and 6x 1.8 GHz Cortex-A55 cores. This setup focuses more on performance, especially with the faster Cortex-A75 cores. The instruction set used by the T616 is also ARMv8.2-A. However, it possesses a larger 12 nm lithography, which may slightly impact power efficiency and heat dissipation. The TDP of the T616 is higher, standing at 10 Watts.
In summary, the HiSilicon Kirin 820 5G and Unisoc Tiger T616 processors have their own unique specifications. The Kirin 820 5G offers a well-balanced architecture, smaller lithography, and lower TDP, enabling energy efficiency and capable neural processing. On the other hand, the Tiger T616 emphasizes performance with faster Cortex-A75 cores but has a larger lithography and slightly higher TDP. The choice between these processors will depend on specific requirements, with the Kirin 820 5G being a better option for power efficiency and neural processing, while the Tiger T616 may excel in tasks that demand higher performance.
CPU cores and architecture
Architecture | 1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
2x 2.0 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 12 nm |
TDP | 6 Watt | 10 Watt |
Neural Processing | Ascend D110 Lite, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 12 GB | up to 6 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 1866 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G57 MP6 | Mali-G57 MP1 |
GPU Architecture | Valhall | Bifrost |
GPU frequency | 850 MHz | 750 MHz |
Execution units | 6 | 1 |
Shaders | 96 | 16 |
DirectX | 12 | 11 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2400x1080 | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 64MP, 2x 32MP |
Max Video Capture | 4K@30fps | FullHD@60fps |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.2 Gbps | 0.1 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 March | 2021 |
Partnumber | T616 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
MediaTek Helio G96 vs Samsung Exynos 1280
2
MediaTek Dimensity 8200 vs HiSilicon Kirin 960
3
HiSilicon Kirin 930 vs Qualcomm Snapdragon 480 Plus
4
MediaTek Helio G35 vs Qualcomm Snapdragon 821
5
Unisoc Tiger T618 vs Unisoc Tiger T310
6
Qualcomm Snapdragon 870 vs Qualcomm Snapdragon 888
7
Samsung Exynos 9611 vs HiSilicon Kirin 970
8
Qualcomm Snapdragon 865 Plus vs Apple A14 Bionic
9
HiSilicon Kirin 980 vs MediaTek Dimensity 9200 Plus
10
MediaTek Dimensity 9000 vs HiSilicon Kirin 955