HiSilicon Kirin 810 vs Unisoc Tiger T606
The HiSilicon Kirin 810 and Unisoc Tiger T606 are two processors that can be compared based on their specifications.
Starting with the HiSilicon Kirin 810, it features a CPU architecture of 2x 2.27 GHz based on Cortex-A76 cores, along with 6x 1.88 GHz based on Cortex-A55 cores. This architecture provides efficient performance for different tasks. The processor has a total of 8 cores which allows for multitasking without compromising on speed. It is built using a 7 nm lithography process, which enhances power efficiency and reduces heat generation. The HiSilicon Kirin 810 also incorporates the Ascend D100 Lite Neural Processing unit and the HUAWEI Da Vinci Architecture, which enable improved AI and machine learning capabilities.
On the other hand, the Unisoc Tiger T606 features a similar CPU architecture to the Kirin 810, with 2x 1.6 GHz Cortex-A75 cores and 6x 1.6 GHz Cortex-A55 cores. This architecture provides a good balance between performance and power efficiency. Like the Kirin 810, it also has 8 cores for seamless multitasking. However, the Tiger T606 is built on a slightly less advanced 12 nm lithography process compared to the Kirin 810. This may result in slightly higher power consumption and less efficiency.
In terms of TDP (Thermal Design Power), the Kirin 810 has a lower wattage at 5 Watts compared to the Tiger T606's 10 Watts. This suggests that the HiSilicon processor consumes less power and generates less heat, making it more energy-efficient.
Both processors support the same instruction set (ARMv8.2-A), ensuring compatibility with a wide range of software and applications. However, the Kirin 810 outshines the Tiger T606 in terms of the number of transistors, boasting 6900 million compared to the latter's unspecified number. This higher transistor count implies greater complexity and potentially better performance.
In summary, the HiSilicon Kirin 810 and Unisoc Tiger T606 have similar CPU architectures and instruction sets. However, the Kirin 810 has a smaller lithography, lower TDP, more transistors, and incorporates advanced neural processing technology. These features make the Kirin 810 a more powerful and energy-efficient processor compared to the Tiger T606.
Starting with the HiSilicon Kirin 810, it features a CPU architecture of 2x 2.27 GHz based on Cortex-A76 cores, along with 6x 1.88 GHz based on Cortex-A55 cores. This architecture provides efficient performance for different tasks. The processor has a total of 8 cores which allows for multitasking without compromising on speed. It is built using a 7 nm lithography process, which enhances power efficiency and reduces heat generation. The HiSilicon Kirin 810 also incorporates the Ascend D100 Lite Neural Processing unit and the HUAWEI Da Vinci Architecture, which enable improved AI and machine learning capabilities.
On the other hand, the Unisoc Tiger T606 features a similar CPU architecture to the Kirin 810, with 2x 1.6 GHz Cortex-A75 cores and 6x 1.6 GHz Cortex-A55 cores. This architecture provides a good balance between performance and power efficiency. Like the Kirin 810, it also has 8 cores for seamless multitasking. However, the Tiger T606 is built on a slightly less advanced 12 nm lithography process compared to the Kirin 810. This may result in slightly higher power consumption and less efficiency.
In terms of TDP (Thermal Design Power), the Kirin 810 has a lower wattage at 5 Watts compared to the Tiger T606's 10 Watts. This suggests that the HiSilicon processor consumes less power and generates less heat, making it more energy-efficient.
Both processors support the same instruction set (ARMv8.2-A), ensuring compatibility with a wide range of software and applications. However, the Kirin 810 outshines the Tiger T606 in terms of the number of transistors, boasting 6900 million compared to the latter's unspecified number. This higher transistor count implies greater complexity and potentially better performance.
In summary, the HiSilicon Kirin 810 and Unisoc Tiger T606 have similar CPU architectures and instruction sets. However, the Kirin 810 has a smaller lithography, lower TDP, more transistors, and incorporates advanced neural processing technology. These features make the Kirin 810 a more powerful and energy-efficient processor compared to the Tiger T606.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
2x 1.6 GHz – Cortex-A75 6x 1.6 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 12 nm |
Number of transistors | 6900 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 8 GB | up to 8 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 1600 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G52 MP6 | Mali-G57 MP1 |
GPU Architecture | Mali Bifrost | Mali Valhall |
GPU frequency | 820 MHz | 650 MHz |
Execution units | 6 | 1 |
Shaders | 96 | 16 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 1600x900@90Hz | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 24MP, 16MP + 8MP |
Max Video Capture | FullHD@30fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2019 Quarter 2 | 2021 October |
Partnumber | Hi6280 | T606 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Low-end |
Popular comparisons:
1
MediaTek Helio A22 vs Qualcomm Snapdragon 439
2
MediaTek Dimensity 7300 vs MediaTek Dimensity 9200
3
Samsung Exynos 7885 vs MediaTek Dimensity 1080
4
HiSilicon Kirin 985 5G vs Qualcomm Snapdragon 7 Gen 4
5
HiSilicon Kirin 990 5G vs Qualcomm Snapdragon 720G
6
MediaTek Helio G35 vs Unisoc Tiger T710
7
MediaTek Helio P35 vs MediaTek Dimensity 1200
8
MediaTek Dimensity 7030 vs Samsung Exynos 9610
9
Unisoc Tiger T310 vs Qualcomm Snapdragon 782G
10
MediaTek Helio G25 vs MediaTek Dimensity 7400