HiSilicon Kirin 810 vs Unisoc Tiger T310

VS
Comparing the specifications of the HiSilicon Kirin 810 and the Unisoc Tiger T310 processors, it is evident that there are notable differences between the two.

Starting with the CPU cores and architecture, the HiSilicon Kirin 810 comes with a more advanced setup. It features 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores, totaling eight CPU cores. On the other hand, the Unisoc Tiger T310 has a less powerful structure with only 1x 2 GHz Cortex-A75 core and 3x 1.8 GHz Cortex-A55 cores, resulting in a total of four CPU cores.

Moving to the instruction set, both processors support the ARMv8.2-A instruction set, indicating compatibility with modern software and technology.

In terms of lithography, the HiSilicon Kirin 810 stands out as it utilizes a more advanced 7nm process, which offers superior efficiency and performance compared to the 12nm process used by the Unisoc Tiger T310.

Furthermore, the HiSilicon Kirin 810 impresses with its higher transistor count of 6900 million, indicating a more complex and capable hardware design. In contrast, the Unisoc Tiger T310's transistor count remains unspecified.

Lastly, the HiSilicon Kirin 810 specifies a thermal design power (TDP) of 5 Watts, which indicates its ability to operate at lower power consumption levels, potentially leading to increased battery life. The TDP of the Unisoc Tiger T310, however, is not provided.

Although both processors showcase some similarities, such as their ARMv8.2-A instruction set, the HiSilicon Kirin 810 emerges as the more powerful and technologically advanced option. Its higher number of CPU cores, use of a superior 7nm lithography, larger transistor count, and specified lower TDP make it favorable in terms of performance and energy efficiency.

In conclusion, the HiSilicon Kirin 810 surpasses the Unisoc Tiger T310 in multiple aspects and can provide users with a more comprehensive and advanced processing experience.

CPU cores and architecture

Architecture 2x 2.27 GHz – Cortex-A76
6x 1.88 GHz – Cortex-A55
1x 2 GHz – Cortex-A75
3x 1.8 GHz – Cortex-A55
Number of cores 8 4
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 12 nm
Number of transistors 6900 million
TDP 5 Watt
Neural Processing Ascend D100 Lite, HUAWEI Da Vinci Architecture

Memory (RAM)

Max amount up to 8 GB up to 4 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 1333 MHz
Memory-bus 4x16 bit 2x16 bit

Storage

Storage specification UFS 2.1 eMMC 5.1

Graphics

GPU name Mali-G52 MP6 Imagination PowerVR GE8300
GPU Architecture Bifrost Rogue
GPU frequency 820 MHz 660 MHz
Execution units 6 2
Shaders 96 32
DirectX 12 10
OpenCL API 2.0 3.0
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 1600x720
Max camera resolution 1x 48MP, 2x 20MP 1x 16MP + 1x 8MP
Max Video Capture FullHD@30fps FullHD@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP8
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 0.3 Gbps
Peak Upload Speed 0.15 Gbps 0.1 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.1 5.0
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2019 Quarter 2 2019 April
Partnumber Hi6280 T310
Vertical Segment Mobiles Mobiles
Positioning Mid-end Low-end

AnTuTu 10

Total Score
Kirin 810
373134
Tiger T310
142714

GeekBench 6 Single-Core

Score
Kirin 810
604
Tiger T310
219

GeekBench 6 Multi-Core

Score
Kirin 810
1959
Tiger T310
945