HiSilicon Kirin 810 vs Unisoc Tiger T310
Comparing the specifications of the HiSilicon Kirin 810 and the Unisoc Tiger T310 processors, it is evident that there are notable differences between the two.
Starting with the CPU cores and architecture, the HiSilicon Kirin 810 comes with a more advanced setup. It features 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores, totaling eight CPU cores. On the other hand, the Unisoc Tiger T310 has a less powerful structure with only 1x 2 GHz Cortex-A75 core and 3x 1.8 GHz Cortex-A55 cores, resulting in a total of four CPU cores.
Moving to the instruction set, both processors support the ARMv8.2-A instruction set, indicating compatibility with modern software and technology.
In terms of lithography, the HiSilicon Kirin 810 stands out as it utilizes a more advanced 7nm process, which offers superior efficiency and performance compared to the 12nm process used by the Unisoc Tiger T310.
Furthermore, the HiSilicon Kirin 810 impresses with its higher transistor count of 6900 million, indicating a more complex and capable hardware design. In contrast, the Unisoc Tiger T310's transistor count remains unspecified.
Lastly, the HiSilicon Kirin 810 specifies a thermal design power (TDP) of 5 Watts, which indicates its ability to operate at lower power consumption levels, potentially leading to increased battery life. The TDP of the Unisoc Tiger T310, however, is not provided.
Although both processors showcase some similarities, such as their ARMv8.2-A instruction set, the HiSilicon Kirin 810 emerges as the more powerful and technologically advanced option. Its higher number of CPU cores, use of a superior 7nm lithography, larger transistor count, and specified lower TDP make it favorable in terms of performance and energy efficiency.
In conclusion, the HiSilicon Kirin 810 surpasses the Unisoc Tiger T310 in multiple aspects and can provide users with a more comprehensive and advanced processing experience.
Starting with the CPU cores and architecture, the HiSilicon Kirin 810 comes with a more advanced setup. It features 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores, totaling eight CPU cores. On the other hand, the Unisoc Tiger T310 has a less powerful structure with only 1x 2 GHz Cortex-A75 core and 3x 1.8 GHz Cortex-A55 cores, resulting in a total of four CPU cores.
Moving to the instruction set, both processors support the ARMv8.2-A instruction set, indicating compatibility with modern software and technology.
In terms of lithography, the HiSilicon Kirin 810 stands out as it utilizes a more advanced 7nm process, which offers superior efficiency and performance compared to the 12nm process used by the Unisoc Tiger T310.
Furthermore, the HiSilicon Kirin 810 impresses with its higher transistor count of 6900 million, indicating a more complex and capable hardware design. In contrast, the Unisoc Tiger T310's transistor count remains unspecified.
Lastly, the HiSilicon Kirin 810 specifies a thermal design power (TDP) of 5 Watts, which indicates its ability to operate at lower power consumption levels, potentially leading to increased battery life. The TDP of the Unisoc Tiger T310, however, is not provided.
Although both processors showcase some similarities, such as their ARMv8.2-A instruction set, the HiSilicon Kirin 810 emerges as the more powerful and technologically advanced option. Its higher number of CPU cores, use of a superior 7nm lithography, larger transistor count, and specified lower TDP make it favorable in terms of performance and energy efficiency.
In conclusion, the HiSilicon Kirin 810 surpasses the Unisoc Tiger T310 in multiple aspects and can provide users with a more comprehensive and advanced processing experience.
CPU cores and architecture
Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
1x 2 GHz – Cortex-A75 3x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 4 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 12 nm |
Number of transistors | 6900 million | |
TDP | 5 Watt | |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 8 GB | up to 4 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 1333 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | eMMC 5.1 |
Graphics
GPU name | Mali-G52 MP6 | Imagination PowerVR GE8300 |
GPU Architecture | Bifrost | Rogue |
GPU frequency | 820 MHz | 660 MHz |
Execution units | 6 | 2 |
Shaders | 96 | 32 |
DirectX | 12 | 10 |
OpenCL API | 2.0 | 3.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 1600x720 | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 16MP + 1x 8MP |
Max Video Capture | FullHD@30fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2019 Quarter 2 | 2019 April |
Partnumber | Hi6280 | T310 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Low-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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