HiSilicon Kirin 810 vs Unisoc Tanggula T760 5G

When comparing the HiSilicon Kirin 810 and Unisoc Tanggula T760 5G processors, several important specifications should be taken into account.

In terms of the CPU cores and architecture, both processors have 8 cores. However, the Kirin 810 features a 2x 2.27 GHz Cortex-A76 architecture and 6x 1.88 GHz Cortex-A55 architecture, providing a high-performance and energy-efficient balance. On the other hand, the Tanggula T760 5G has a 4x 2.2 GHz Cortex-A76 architecture and 4x 1.8 GHz Cortex-A55 architecture, offering a slightly higher clock speed for improved performance.

Moving onto instruction set, both processors are equipped with ARMv8.2-A, ensuring compatibility with modern software and applications.

When considering lithography, the Kirin 810 stands out with a 7 nm lithography, which signifies a more advanced manufacturing technology compared to the Tanggula T760 5G's 6 nm lithography. Smaller lithography allows for a denser configuration of transistors and generally results in improved power efficiency.

Speaking of transistors, the Kirin 810 boasts 6900 million transistors, indicating a significant level of complexity in its design. Meanwhile, information regarding the number of transistors for the Tanggula T760 5G is not provided.

Both processors have a TDP of 5 Watt, which indicates their power consumption under normal operating conditions. This energy efficiency makes them suitable for mobile devices where battery life is a crucial factor.

Lastly, the Kirin 810 incorporates Ascend D100 Lite and HUAWEI Da Vinci Architecture for neural processing, potentially enabling advanced artificial intelligence capabilities. The Tanggula T760 5G, on the other hand, features an unspecified NPU for neural processing.

In summary, the HiSilicon Kirin 810 and Unisoc Tanggula T760 5G processors have similarities in terms of the number of cores, instruction set, and TDP. However, the Kirin 810 excels with its 7 nm lithography, higher number of transistors, and advanced neural processing architecture. These specifications make the Kirin 810 a promising choice for devices requiring both high performance and energy efficiency.

CPU cores and architecture

Architecture 2x 2.27 GHz – Cortex-A76
6x 1.88 GHz – Cortex-A55
4x 2.2 GHz – Cortex-A76
4x 1.8 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 6 nm
Number of transistors 6900 million
TDP 5 Watt 5 Watt
Neural Processing Ascend D100 Lite, HUAWEI Da Vinci Architecture NPU

Memory (RAM)

Max amount up to 8 GB up to 16 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 2133 MHz
Memory-bus 4x16 bit 4x16 bit


Storage specification UFS 2.1 UFS 3.1


GPU name Mali-G52 MP6 Mali-G57 MP6
GPU Architecture Bifrost Valhall
GPU frequency 820 MHz 850 MHz
Execution units 6 6
Shaders 96 96
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2160x1080
Max camera resolution 1x 48MP, 2x 20MP 1x 64MP, 2x 24MP
Max Video Capture FullHD@30fps FullHD@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
H.264 (AVC)
H.265 (HEVC)


4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 2.7 Gbps
Peak Upload Speed 0.15 Gbps 1.5 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.1 5.0
Satellite navigation BeiDou

Supplemental Information

Launch Date 2019 Quarter 2 2021 February
Partnumber Hi6280 T760
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 810
Tanggula T760 5G

GeekBench 6 Single-Core

Kirin 810
Tanggula T760 5G

GeekBench 6 Multi-Core

Kirin 810
Tanggula T760 5G