HiSilicon Kirin 810 vs Unisoc Tanggula T760 5G
When comparing the HiSilicon Kirin 810 and Unisoc Tanggula T760 5G processors, several important specifications should be taken into account.
In terms of the CPU cores and architecture, both processors have 8 cores. However, the Kirin 810 features a 2x 2.27 GHz Cortex-A76 architecture and 6x 1.88 GHz Cortex-A55 architecture, providing a high-performance and energy-efficient balance. On the other hand, the Tanggula T760 5G has a 4x 2.2 GHz Cortex-A76 architecture and 4x 1.8 GHz Cortex-A55 architecture, offering a slightly higher clock speed for improved performance.
Moving onto instruction set, both processors are equipped with ARMv8.2-A, ensuring compatibility with modern software and applications.
When considering lithography, the Kirin 810 stands out with a 7 nm lithography, which signifies a more advanced manufacturing technology compared to the Tanggula T760 5G's 6 nm lithography. Smaller lithography allows for a denser configuration of transistors and generally results in improved power efficiency.
Speaking of transistors, the Kirin 810 boasts 6900 million transistors, indicating a significant level of complexity in its design. Meanwhile, information regarding the number of transistors for the Tanggula T760 5G is not provided.
Both processors have a TDP of 5 Watt, which indicates their power consumption under normal operating conditions. This energy efficiency makes them suitable for mobile devices where battery life is a crucial factor.
Lastly, the Kirin 810 incorporates Ascend D100 Lite and HUAWEI Da Vinci Architecture for neural processing, potentially enabling advanced artificial intelligence capabilities. The Tanggula T760 5G, on the other hand, features an unspecified NPU for neural processing.
In summary, the HiSilicon Kirin 810 and Unisoc Tanggula T760 5G processors have similarities in terms of the number of cores, instruction set, and TDP. However, the Kirin 810 excels with its 7 nm lithography, higher number of transistors, and advanced neural processing architecture. These specifications make the Kirin 810 a promising choice for devices requiring both high performance and energy efficiency.
In terms of the CPU cores and architecture, both processors have 8 cores. However, the Kirin 810 features a 2x 2.27 GHz Cortex-A76 architecture and 6x 1.88 GHz Cortex-A55 architecture, providing a high-performance and energy-efficient balance. On the other hand, the Tanggula T760 5G has a 4x 2.2 GHz Cortex-A76 architecture and 4x 1.8 GHz Cortex-A55 architecture, offering a slightly higher clock speed for improved performance.
Moving onto instruction set, both processors are equipped with ARMv8.2-A, ensuring compatibility with modern software and applications.
When considering lithography, the Kirin 810 stands out with a 7 nm lithography, which signifies a more advanced manufacturing technology compared to the Tanggula T760 5G's 6 nm lithography. Smaller lithography allows for a denser configuration of transistors and generally results in improved power efficiency.
Speaking of transistors, the Kirin 810 boasts 6900 million transistors, indicating a significant level of complexity in its design. Meanwhile, information regarding the number of transistors for the Tanggula T760 5G is not provided.
Both processors have a TDP of 5 Watt, which indicates their power consumption under normal operating conditions. This energy efficiency makes them suitable for mobile devices where battery life is a crucial factor.
Lastly, the Kirin 810 incorporates Ascend D100 Lite and HUAWEI Da Vinci Architecture for neural processing, potentially enabling advanced artificial intelligence capabilities. The Tanggula T760 5G, on the other hand, features an unspecified NPU for neural processing.
In summary, the HiSilicon Kirin 810 and Unisoc Tanggula T760 5G processors have similarities in terms of the number of cores, instruction set, and TDP. However, the Kirin 810 excels with its 7 nm lithography, higher number of transistors, and advanced neural processing architecture. These specifications make the Kirin 810 a promising choice for devices requiring both high performance and energy efficiency.
CPU cores and architecture
Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
4x 2.2 GHz – Cortex-A76 4x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 6 nm |
Number of transistors | 6900 million | |
TDP | 5 Watt | 5 Watt |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 16 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G52 MP6 | Mali-G57 MP6 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 820 MHz | 850 MHz |
Execution units | 6 | 6 |
Shaders | 96 | 96 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2160x1080 | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 64MP, 2x 24MP |
Max Video Capture | FullHD@30fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.7 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.5 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2019 Quarter 2 | 2021 February |
Partnumber | Hi6280 | T760 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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